• Journal of the Korea Convergence Society
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• v.9 no.5
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• pp.151-156
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• 2018

In this study, CFRP and metal or nonmetal were bonded with adhesive and the fracture study on this material was carried out. CFRP at the upper side of specimen and metal or nonmetal were assigned at the lower side of specimen by using DCB specimen as the analysis condition. And it was desribed that the structural adhesive were bonded between both upper and lower sides. As this analysis result, the least equivalent stress was shown at the specimen bonded with aluminium. The maximum shear stress was shown to become lowest at the de-bonded CFRP specimen when titanium was used. In conclusion, it was shown that the deformation of specimen became lowest when titanium was used. On the basis of this study result, the esthetic sense can be shown as the fracture data of bonded interface using adhesive are grafted onto the real life.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.3
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• pp.9-18
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• 1999

In this study, Metallugical properties between Sn-3.5Ag, Sn-37Pb eutectic solders and Au/Ni/cu substrate according to time span above the melting point were investigated. A conventional reflow soldering machine wert used for this study and time span above the melting point was determined by changing peak soldering temperature and conveyor speed. As results, scallop type intermetallic compounds of $Ni_3Sn_4$ were formed at joint interface and no Cu-Sn compounds were found at all; Ni layer performed as a barrier for Cu diffusion. As the peak soldering temperature increased, thickness of the intermetallic compound layer increased; maximum thickness of the scallop-layer was 2.2$\mu\textrm{m}$. The shape of scallops were transformed from hemi-sphere type to elliptical shape with smaller size. Micro-hardness of the solder joint decreased as the eutectic structure of Sn-3.5Ag and Sn-37Pb increased.

• Journal of Welding and Joining
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• v.13 no.3
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• pp.134-146
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• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.31-39
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• 2008

To develop the MEMS cap bonding process without cavity formation, we electroplated Cu/Sn rim structures and measured the bonding characteristics for the Cu/Sn rims of $25{\sim}400{\mu}m$ width. As the effective device-mounting area ratio decreased and the failure strength ratio increased for wider Cu/Sn rim, these two properties were estimated to be optimized for the Cu/Sn rim with 150 ${\mu}m$ width. Complete bonding was accomplished at the whole interfaces of the Cu/Sn packages with the rim widths of 25 ${\mu}m$ and 50 ${\mu}m$. However, voids were observed locally at the interfaces with the rim widths larger than 100 ${\mu}m$. Such voids were formed by local non-contact between the upper and lower rims due to the surface roughness of the electroplated Sn.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.1-9
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• 2010

We reported the methodology for the shear test which is one of the evaluation procedure for mechanical reliability of flip-chip package. The shear speed and the tip height are found to be two significant experimental parameters in the shear test. We investigated how these two parameters have an influence on the results, the shear strength and failure mode. In order to prove these experimental inconsistency, simulation using finite element analysis was also conducted to calculate the shear strength and to figure out the distribution of plastic energy inside of the solder ball. The shear strength decreased while the tip height increased or the shear speed decreased. A variation in shear strength due to inconsistent shear conditions made confusion on analyzing experimental results. As a result, it was strongly needed to standardize the shear test method.

• Korean Journal of Materials Research
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• v.17 no.3
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• Journal of Korean Society of Steel Construction
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• v.9 no.4 s.33
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• pp.515-521
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• 1997

The effects of heat treatment and fiber orientation on tensile strength and fatigue behavior were studied in a continuously reinforced. magnesium-based composite Following an earlier TEM investigation, specimens were thermally aged to modified the interfacial zone between the alumina fibers and the magnesium alloy matrix. From the tensile experimental results, the ultimate tensile strength of the aged specimens were lower than that of the as-fabricated due to weak fiber-matrix interfacial strength with chemical reaction during the thermal processing. The fatigue crack growth experiments were conducted with specimens having the fiber orientation normal to the crack growth direction (longitudinal) and also specimens with the fibers oriented parallel to the crack growth direction(transverse). A comparison of the fatigue crack growth behavior indicates that aged longitudinal specimens are more resistant to fatigue crack growth the as-fabricated longitudinal specimens. Conversely, as-fabricated transverse specimens are more resistant to fatigue crack growth than aged transverse specimens.

• Journal of the Korean Vacuum Society
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• v.13 no.4
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• pp.175-181
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• 2004

We investigated the stability of the DLC film coated on 304 stainless steel substrate by Radio frequency assisted chemical vapor deposition method. Fracture and spallation behaviour of the coating was observed during micro-tensile test of the fil $m_strate composite. As the tensile deformation progressed, the cracks of the film were observed in the perpendicular direction to the tensile axis. Further deformation resulted in the plastic deformation with $45^{\circ}$ slip bands on the substrate surface. Spallation of the film occurred with the plastic deformation, which was initiated at the cracks of the film and was aligned along the slip directions. We found that both the cracking and the spallation behaviors are strongly dependent on the pre-treatment condition, such as Ar plasma pre-treatment. The spallation of the film was considerably suppressed in an optimized condition of the substrate cleaning by Ar glow discharge. We observed the improved stability with increasing duration of Ar plasma pre-treatment.nt.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.426-426
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• 2012

본 연구에서는 GaAs p-i-n 접합 구조에 InAs 양자점을 삽입한 양자점 태양전지(Quantum Dot Solar Cell; QDSC)의 내부 전기장(internal electric field)을 조사하기 위하여 Photoreflectance (PR) 방법을 이용하였다. QDSC 구조는 GaAs p-i-n 구조의 공핍층 내에 8주기의 InAs 양자점 층을 삽입하였으며 각 양자점 층은 40 nm 두께의 i-GaAs로 분리하였다. InAs/GaAs QDSC는 분자선박막 성장장치(molecular beam epitaxy; MBE)를 이용하여 성장하였다. 이 때 양자점의 형성은 InAs 2.0 ML(monolayer)를 기판온도 $470^{\circ}C$에서 증착하였다. QDSC 구조에서 여기광원의 세기에 따른 전기장의 변화를 조사하였다. 아울러 양자점 층 사이의 i-GaAs 층 내에 6.0 nm의 AlGaAs 퍼텐셜 장벽(potential barrier)을 삽입하여 퍼텐셜 장벽 유무에 따른 전기장 변화를 조사하였다. PR 측정에서 여기광원으로는 633 nm의 He-Ne 레이저를 이용하였으며 여기광의 세기는 $2mW/cm^2$에서 $90mW/cm^2$까지 변화를 주어 여기광세기 의존성실험을 수행하였다. 여기광의 세기가 증가할수록 photovoltaic effect에 의한 내부 전기장의 변화를 관측할 수 있었다. PR 결과로부터 p-i-n 구조의 p-i 영역과 i-n 접합 계면의 junction field를 검출하였다. p-i-n의 i-영역에 양자점을 삽입한 경우 PR 신호에서 Franz-Keldysh oscillation (FKO)의 주파수가 p-i-n 구조와 비교하여 변조됨을 관측하였다. 이러한 FKO 주파수성분은 fast Fourier transform (FFT)을 이용하여 검출하였다. FKO의 주파수 성분들은 고전기장하에서 electron-heavyhole (e-hh)과 electron-lighthole (e-lh) 전이에 의해 나타나는 성분으로 확인되었다.

• Journal of Welding and Joining
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• v.28 no.3
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• pp.49-58
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• 2010

Various alloy system, such as Cu-Sn-Ti, Cu-Ag-Ti, and Ni-B-Cr-based alloy are used for the brazing of diamond grits. However, the problem of the adhesion strength between the diamond grits and the brazed alloy is presented. The adhesion strength between the diamond grits and the melting filler alloy is predicted by the contact angle, thereby, instead of diamond grit, the study on the wettability between the graphite and the brazing alloy has been indirectly executed. In this study, Cu-13Sn-12Ti filler alloy was manufactured, and the contact angles, the shear strengths and the interfacial area between the graphites (diamond grits) and braze matrix were investigated. The contact angle was decreased on increasing holding time and temperature. The results of shear strength of the graphite joints brazed filler alloys were observed that the joints applied Cu-13Sn-12Ti alloy at brazing temperature $940^{\circ}C$ was very sound condition indicating the shear tensile value of 23.8 MPa because of existing the widest carbide(TiC) reaction layers. The micrograph of wettability of the diamond grit brazed filler alloys were observed that the brazement applied Cu-13Sn-12Ti alloy at brazing temperature $990^{\circ}C$ was very sound condition because of existing a few TiC grains in the vicinity of the TiC layers.