• Title/Summary/Keyword: 전자처리 스페클 패턴 간섭법

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Quantitative Determination of Out-of-plane Displacement by Shearography (Shearography의 1차도함수로부터 면외변위의 정량적 추출)

  • Kim, Koung-Suk;Yoon, Hong-Seok;Park, Chan-Ju;Choi, Jung-Suk
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.772-776
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    • 2004
  • The paper describes the quantitative determination of out-of-plane displacement from result of Shearogrpahy, which can measure the first-order partial derivative of out-of-plane displacement directly. However, the differential sensitivity of Shearography is related to the amount of shearing, which is manually adjustable in optical interferometer and affects the quantitative determination. The relationship between those is inspected by comparing ESPI with Shearography. From the result, the amount of shearing plays a modulation factor of out-of-plane displacement and small amount of shearing gives good agreement with out-of-plane displacement.

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Non-destructive Inspection of Semiconductor Package by Laser Speckle Interferometry (레이저 스페클 간섭법을 이용한 반도체 패키지의 비파괴검사)

  • Kim, Koung-Suk;Yang, Kwang-Young;Kang, Ki-Soo;Choi, Jung-Gu;Lee, Hang-Seo
    • Journal of the Korean Society for Nondestructive Testing
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    • v.25 no.2
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    • pp.81-86
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    • 2005
  • This paper proposes a non-destructive ESPI technique to quantitatively evaluate defects inside a semiconductor package. The inspection system consists of the ESPI system, a thermal loading system and an adiabatic chamber. The technique is high feasibility for non-destructive testing of a semiconductor and overcomes the weaknesses of previous techniques, such as time-consumption and difficult quantitative evaluation. Most defects are classified as delamination defects, resulting from the insufficient adhesive strength between layers and from non-homogeneous heat spread. Ninety percent of the tested samples had delamination defects which originated at the corner of the chip and nay be related to heat spread design.

Determination of Elastic Modulus by Time Average ESPI and Euler-Bernoulli Equation (Time Average ESPI와 Euler-Bernoulli 방정식에 의한 탄성계수 측정)

  • Kim, Koung-Suk;Lee, Hang-Seo;Kang, Young-June;Kang, Ki-Soo
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.7 s.196
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    • pp.69-74
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    • 2007
  • The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

A Study on the Rotating Displacement Measurement of Rigid Body by ESPI Method (ESPI법에 의한 강체 회전 변위 측정에 관한 연구)

  • 김경석;홍명석
    • Transactions of the Korean Society of Automotive Engineers
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    • v.1 no.2
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    • pp.125-133
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    • 1993
  • Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

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A Study on the Vibration Characteristics Analysis of Composite Materials by Using Electronic Speckle PatternInterferometry Method (전자처리 스페클 패턴 간섭법을 이용한 복합재료의 진동 특성 해석에 관한 연구)

  • 김형택;정현철;양승필
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1995.10a
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    • pp.388-392
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    • 1995
  • The Electronic Speckle Pattern Interferometry(ESPI) has been applied to many technical problems such as deformation and displacement measurement, strain visualization and surface roughness monitoring. Composite materials have various complicated characteristics depending on the ply materials,ply orientations,ply stacking sequences and boundary conditions. Therefore, it is difficult to analyze composite material. For efficient use of composit materials in engineering applications, the dynamic behavior such as, natural frequencies and modal patterns should be identified. This studying presents FEM results for the free vibration of symmetrically laminated composite as [30/-30/90] $_{s}$. The natural frequencies of laminated composite rectangular plates having the boundary condition(:2-edge clamped) are experimentally obtained. In order to demonstrate the validity of the experiment,FEM analysis using ANSYS was performed and natural frequencies experimentally obtained is compared with calculated by FEM analysis. The results obtained from both experiment and FEM analysis show a good agreement.t.

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A Study on the Inner Defect Inspection for Semiconductor Package by ESPI (ESPI를 이용한 반도체 패키지 내부결함 검사에 관한 연구)

  • Jung, Seung-Tack;Kim, Koung-Suk;Yang, Seung-Pil;Jung, Hyun-Chul;Lee, You-Hwang
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.1442-1447
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    • 2003
  • Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

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Deformation Characteristics Analysis of 3-Unit Fixed Partial Dentures by Using Electronic Speckle Pattern Interferometry (전자처리 스페클 패턴 간섭법(ESPI)을 이용한 3-유닛 고정성 국소의치의 변형특성 분석)

  • Kang, Hoo-Won;Lee, Chul-Min;Yang, Seung-Pil;Kim, Hee-Jin
    • Journal of Technologic Dentistry
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    • v.35 no.1
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    • pp.49-56
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    • 2013
  • Purpose: The deformation characteristics induced by non-destructive stresses using piezoelectric transducer(PZT) were analyzed for 3-unit fixed partial dentures manufactured PFM, Everest(CAD/CAM) and Zirkonzahn(copy milling, MAD/MAM) by electron speckle pattern interferometery(ESPI). Methods: The ESPI analysis after loading the restoration with PZT by applying electric voltage of 900mV at the points of 10 mm above the base of the prostheses. Results: PFM and All-Ceramic Everest prostheses showed about 0.1 ${\mu}m$ while that of All- Ceramic Zirkonzahn prostheses showed 0.085 ${\mu}m$, demonstrating that Zirkonzahn displaced less. For PFM and All-Ceramic Zirkonzahn prostheses, the displacements were large at just below the loading point, while generalize displacement was shown over the loading point and weak connector areas for All-Ceramic Everest prostheses. Conclusion: We could find that the deformation characteristics induced by non-destructive stresses using PZT analyzed by ESPI were similar to the fracture strengths evaluated using universal testing machine.

Strain Distribution Measurement for Wall Thinning Defect in Pipe Bends by ESPI (ESPI 를 이용한 곡관 감육 결함부의 변형률 분포 측정)

  • Naseem, Akhter;Kim, Koung-Suk;Jung, Sung-Wook;Park, Jong-Hyun;Choi, Jung-Suk;Jung, Hyun-Chul
    • Proceedings of the KSME Conference
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    • 2007.05a
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    • pp.120-125
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    • 2007
  • Put Abstract text here The strain distribution measurement for wall thinned pipe bends by ESPI is presented. Defect types observed in the steel piping in the nuclear power plants (NPP) are the crack at the weld part and the wall thinning defect in the pipe bends. Especially, the wall thinning defects in the pipe bends due to the flow-accelerated corrosion (FAC) is a main type of defects observed in the carbon steel piping system. ESPI is one of the optical non-destructive testing methods and can measure the stress and the strain distribution of the object subjected by the tensile loading or the internal pressure. In this paper, the strain distribution of the wall thinned pipe bends due to the internal pressure will be measured by ESPI technique and the results are discussed. From the results, the size of the wall thinning defect can also be measured approximately.

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Quantitative Evaluation of Delamination Inside of Composite Materials by ESPI (ESPI를 이용한 복합재료 박리결함의 정량평가)

  • Kim, Koung-Suk;Yang, Kwang-Young;Kang, Ki-Soo;Ji, Chang-June
    • Journal of the Korean Society for Nondestructive Testing
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    • v.24 no.3
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    • pp.246-252
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    • 2004
  • Electronic speckle pattern interferometry (ESPI) for quantitative evaluation of delaminations inside of a composite material plate is described. Delaminations caused by the impact on composite materials are difficult to detect visual inspection and ultrasonic testing due to non-homeogenous structure. This paper proposes the quantitative evaluation technique of the defects made in the composite plates by impact load. Artificial defects are introduced inside of the composite plate for the development of a reliable ESPI inspection technique. Real defects produced by impact tester are inspected and compared with the results of visual inspection which shows a good agreement within 5% error.

Measurement of Tensile Properties of Copper foil using ESPI technique (ESPI 기법을 이용한 동 박막의 인장 특성 측정)

  • 권동일;허용학;김동진;박준협;기창두
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1059-1062
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    • 2003
  • Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.

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