• 제목/요약/키워드: 전자처리 스페클패턴 간섭법

검색결과 22건 처리시간 0.027초

레이저 스페클 간섭법을 이용한 면내변위 측정시스템 개발 (The Development of In-Plane Displacement Measurement System on Laser Speckle Interferometry)

  • 윤홍석;김경석;박찬주;최태호;최정석
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2005년도 춘계학술대회 논문집
    • /
    • pp.556-560
    • /
    • 2005
  • The measurement method by Laser Speckle Interferometry which uses the interference law which will grow precedes and with it explains a resolution measurement ability and together the change of place arrowhead and general measurement, at real-time measurement sensitivity it has application boat song from candle precise measurement field it is increasing. But, currently the domestic application technique to sleeps and optical science military merit by optical science interferometer and directness it composes purchases to the level which it applies the expensive commercial business equipment the outside and in spite of the technical ripple effect is deficient even in many strong point. The hazard which complements like this problem point form technical development it leads from the research which it sees and an application degree and to sleep as the measurement equipment which tries to develop the small-sized optical science interference sensor and an interpretation program it raises it does.

  • PDF

레이저 스페클 간섭법을 이용한 반도체 패키지의 비파괴검사 (Non-destructive Inspection of Semiconductor Package by Laser Speckle Interferometry)

  • 김경석;양광영;강기수;최정구;이항서
    • 비파괴검사학회지
    • /
    • 제25권2호
    • /
    • pp.81-86
    • /
    • 2005
  • 본 논문에서는 반도체 패키지 내부결함의 비파괴 정량평가를 위한 ESPI 기법을 이용한 시스템 및 검사기 법을 제안하고 있으며, 검사시스템은 ESPI 검사장치, 열변형유도장치, 단열챔버로 구성되어있다. 기존 초음파, X-ray 기반의 검사기법에 비하여 측정시간 및 검사방법이 용이하며, 결함의 정량검출이 가능하다는 장점이 있다. 검사결과에서 대부분의 결함이 열 방출이 많은 칩 주위에서 박리결함으로 나타났으며, 원인은 층간 접착강도의 약화와 열분배 설계에서 문제점인 것으로 사료된다.

Time Average ESPI와 Euler-Bernoulli 방정식에 의한 탄성계수 측정 (Determination of Elastic Modulus by Time Average ESPI and Euler-Bernoulli Equation)

  • 김경석;이항서;강영준;강기수
    • 한국정밀공학회지
    • /
    • 제24권7호
    • /
    • pp.69-74
    • /
    • 2007
  • The paper proposes a new sonic resonance test for a elastic modulus measurement which is based on time-average electronic speckle pattern interferometry(TA-ESPI) and Euler-Bernoulli equation. Previous measurement technique of elastic constant has the limitation of application for thin film or polymer material because contact to specimen affects the result. TA-ESPI has been developed as a non-contact optical measurement technique which can visualize resonance vibration mode shapes with whole-field. The maximum vibration amplitude at each vibration mode shape is a clue to find the resonance frequencies. The dynamic elastic constant of test material can be easily estimated from Euler-Bernoulli equation using the measured resonance frequencies. The proposed technique is able to give high accurate elastic modulus of materials through a simple experiment set up and analysis.

ESPI를 이용한 복합재료 박리결함의 정량평가 (Quantitative Evaluation of Delamination Inside of Composite Materials by ESPI)

  • 김경석;양광영;강기수;지창준
    • 비파괴검사학회지
    • /
    • 제24권3호
    • /
    • pp.246-252
    • /
    • 2004
  • 복합재료는 이방성의 특징으로 매우 복잡한 역학거동을 하며, 해석 및 신뢰성 검사에 많은 어려움이 있다. 특히, 기존의 비파괴검사기법으로 내부손상을 검출하는 것은 매우 어려운 실정이다. 이에 본 연구에서는 복합재구조물의 가장 취약한 분야인 충격에 의한 손상이 발생할 경우 효과적인 검출기법을 개발하고, 충격에 따른 내부결함의 정량평가에 ESPI를 활용하였다. 인공결함을 이용하여 ESPI기법의 신뢰성을 확보하고 실제 충격손상 시험편에 대해 적용하여 5%이내의 오차율로 결함을 정량평가하였다.

ESPI법에 의한 강체 회전 변위 측정에 관한 연구 (A Study on the Rotating Displacement Measurement of Rigid Body by ESPI Method)

  • 김경석;홍명석
    • 한국자동차공학회논문집
    • /
    • 제1권2호
    • /
    • pp.125-133
    • /
    • 1993
  • Electronic Speckle Pattern Interferometry(ESPI) using a CW laser, a video system and image processor was applied to the rotating displacement of rigid body. ESPI require no special surface preparation or attachments and displacements between any two arbitrary points on the surface can be measured. The characteristic speckle pattern formed when imaging a scattering surface illuminated by laser light retains phase information, which can be used for interferometric measurement of surface displacement. The application of this principle to measuring in-plane displacement resolved in one direction is described, together with the novel use of television equipment to detect and process the information contained in the speckle pattern. This is faster, and more convenient and versatile than customary photographic methods.

  • PDF

전자처리 스페클 패턴 간섭법을 이용한 복합재료의 진동 특성 해석에 관한 연구 (A Study on the Vibration Characteristics Analysis of Composite Materials by Using Electronic Speckle PatternInterferometry Method)

  • 김형택;정현철;양승필
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 1995년도 추계학술대회 논문집
    • /
    • pp.388-392
    • /
    • 1995
  • The Electronic Speckle Pattern Interferometry(ESPI) has been applied to many technical problems such as deformation and displacement measurement, strain visualization and surface roughness monitoring. Composite materials have various complicated characteristics depending on the ply materials,ply orientations,ply stacking sequences and boundary conditions. Therefore, it is difficult to analyze composite material. For efficient use of composit materials in engineering applications, the dynamic behavior such as, natural frequencies and modal patterns should be identified. This studying presents FEM results for the free vibration of symmetrically laminated composite as [30/-30/90] $_{s}$. The natural frequencies of laminated composite rectangular plates having the boundary condition(:2-edge clamped) are experimentally obtained. In order to demonstrate the validity of the experiment,FEM analysis using ANSYS was performed and natural frequencies experimentally obtained is compared with calculated by FEM analysis. The results obtained from both experiment and FEM analysis show a good agreement.t.

  • PDF

ESPI를 이용한 반도체 패키지 내부결함 검사에 관한 연구 (A Study on the Inner Defect Inspection for Semiconductor Package by ESPI)

  • 정승택;김경석;양승필;정현철;이유황
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2003년도 추계학술대회
    • /
    • pp.1442-1447
    • /
    • 2003
  • Computer is a very powerful machine which is widely using for data processing, DB construction, peripheral device control, image processing etc. Consequently, many researches and developments have progressed for high performance processing unit, and other devices. Especially, the core units such as semiconductor parts are rapidly growing so that high-integration, high-performance, microminiat turization is possible. The packaging in the semiconductor industry is very important technique to de determine the performance of the system that the semiconductor is used. In this paper, the inspection of the inner defects such as delamination, void, crack, etc. in the semiconductor packages is studied. ESPI which is a non-contact, non-destructive, and full-field inspection method is used for the inner defect inspection and its results are compared with that of C-Scan method.

  • PDF

전자처리 스페클 패턴 간섭법(ESPI)을 이용한 3-유닛 고정성 국소의치의 변형특성 분석 (Deformation Characteristics Analysis of 3-Unit Fixed Partial Dentures by Using Electronic Speckle Pattern Interferometry)

  • 강후원;이철민;양승필;김희진
    • 대한치과기공학회지
    • /
    • 제35권1호
    • /
    • pp.49-56
    • /
    • 2013
  • Purpose: The deformation characteristics induced by non-destructive stresses using piezoelectric transducer(PZT) were analyzed for 3-unit fixed partial dentures manufactured PFM, Everest(CAD/CAM) and Zirkonzahn(copy milling, MAD/MAM) by electron speckle pattern interferometery(ESPI). Methods: The ESPI analysis after loading the restoration with PZT by applying electric voltage of 900mV at the points of 10 mm above the base of the prostheses. Results: PFM and All-Ceramic Everest prostheses showed about 0.1 ${\mu}m$ while that of All- Ceramic Zirkonzahn prostheses showed 0.085 ${\mu}m$, demonstrating that Zirkonzahn displaced less. For PFM and All-Ceramic Zirkonzahn prostheses, the displacements were large at just below the loading point, while generalize displacement was shown over the loading point and weak connector areas for All-Ceramic Everest prostheses. Conclusion: We could find that the deformation characteristics induced by non-destructive stresses using PZT analyzed by ESPI were similar to the fracture strengths evaluated using universal testing machine.

ESPI 를 이용한 곡관 감육 결함부의 변형률 분포 측정 (Strain Distribution Measurement for Wall Thinning Defect in Pipe Bends by ESPI)

  • 아흐터나심;김경석;정성욱;박종현;최정석;정현철
    • 대한기계학회:학술대회논문집
    • /
    • 대한기계학회 2007년도 춘계학술대회A
    • /
    • pp.120-125
    • /
    • 2007
  • Put Abstract text here The strain distribution measurement for wall thinned pipe bends by ESPI is presented. Defect types observed in the steel piping in the nuclear power plants (NPP) are the crack at the weld part and the wall thinning defect in the pipe bends. Especially, the wall thinning defects in the pipe bends due to the flow-accelerated corrosion (FAC) is a main type of defects observed in the carbon steel piping system. ESPI is one of the optical non-destructive testing methods and can measure the stress and the strain distribution of the object subjected by the tensile loading or the internal pressure. In this paper, the strain distribution of the wall thinned pipe bends due to the internal pressure will be measured by ESPI technique and the results are discussed. From the results, the size of the wall thinning defect can also be measured approximately.

  • PDF

ESPI 기법을 이용한 동 박막의 인장 특성 측정 (Measurement of Tensile Properties of Copper foil using ESPI technique)

  • 권동일;허용학;김동진;박준협;기창두
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2003년도 춘계학술대회 논문집
    • /
    • pp.1059-1062
    • /
    • 2003
  • Micro-tensile testing system has been developed and micro-tensile tests for copper foil have been carried out. The system consisted of a micro tensile loading system and a micro-ESPI system for measuring strain. The loading system has a maximum loading capacity of 50N and a stroke resolution of 4.5nm. Stress-strain curves for the electro-deposited copper foil with the thickness of 18$\mu\textrm{m}$ were obtained, and tensile properties, including elastic modulus, yielding strength and tensile strength, were determined. The tensile properties obtained under three different conditions of testing speed showed a dependency on the speed.

  • PDF