• Journal of Korea Society of Industrial Information Systems
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• v.18 no.5
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• pp.15-18
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• 2013

This paper presents an analog front-end for electroencephalogram(EEG) signal processing. Since EEG signals are typically weak and located at very low frequencies, it is imperative to implement an amplifier with high gain, high common-mode rejection ratio(CMRR) and good noise immunity at very low frequencies. The analog front-end of this paper consists of a programmable-gain instrumentation amplifier and a band-pass filter. A frequency chopping technique is employed to remove the low-frequency noise. The circuits were fabricated in 0.18um CMOS technology and measurements showed that the analog front-end has the maximum gain of 60dB and >100dB CMRR over the programmable gain range.

• Journal of the Korean Society of Propulsion Engineers
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• v.4 no.1
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• pp.1-12
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• 2000

This study summarizes the numerical analyses of a Ti alloy deformation under a back extrusion process. Amongst metallic parts in a small propulsion motor case, a Ti-6Al-4V alloy is used extensively. However, the Ti alloy shows a great deal of shear band formation which often leads to a fracture due to a narrow working temperature window. Moreover, the shear band tends to develop over an area where a contact occurs between the hot work piece and the die wall, due to localized cooling. Thus, heating the dies is often required to overcome the deformation localization. Therefore, it becomes necessary to investigate the internal temperature and strain rate distribution during forging process of a Ti alloy. Furthermore, a shear band analysis is peformed using a finite difference scheme and a comparison is made between steel and Ti alloy.

• Korean Chemical Engineering Research
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• v.52 no.3
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• pp.382-387
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• 2014

The PC/ABS blends were manufactured with high shear rate processing. Changes of the blend morphology were analyzed according to the screw speed and processing time. To find optimal conditions of the high shear rate processing of the PC/ABS blend, blend morphology and size of the dispersed phase, ABS, were observed with a SEM. Also, tensile properties of the PC/ABS blends were measured to investigate the effect of the high shear rate process with the screw speed of 500 rpm to 3000 rpm for processing times of 10s to 40s. Especially, to observe the dispersed phase of the PC/ABS blend clearly, fracture surfaces of the PC/ABS blend were etched with chromic acid solution. As screw speed and processing time increase, dispersed phase size of the PC/ABS blend decreases and mechanical properties of the blend decrease as well. Especially, at screw speed over than 1000 rpm of high shear rate processing, mechanical properties of the PC/ABS blends decrease drastically due to the degradation of the blend during the high shear rate processing. Consequently, the optimal condition of screw speed of the high shear processing of the PC/ABS blend is set at 1000rpm, in this study. Under optimal condition, the PC/ABS blend has relatively high mechanical properties with the relatively stable micro-structure having nanometer scale dispersed phase.

• Korean Journal of Materials Research
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• v.8 no.5
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• pp.429-435
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• 1998

무정형 PEEK 필름의 self-bonding 공정 시에 일어나는 결정화 현상이 접합 면에서 개발되어지는 self-bonding 강도에 미치는 영향을 주사전자현미경(SEM)을 이용하여 고찰하였다. 무정형 PEEK 필름의 결정화 현상은 접합 시의 공정변수에 따라 변화하며, self-bonding 공정 동안 접합 면을 가로질러 PEEK의 결정들이 성장함에 따라 접합이 일어남을 알 수 있었다. 접합온도가 높을수록 접합 면을 가로지르는 결정들의 성장 정도가 낮은 온도에서 접합시켰을 때의 경우보다 훨씬 커서 결과적으로 높은 self-bonding 강도를 보였다. 각각의 시편들을 전단 파괴시킨 후 행한 파단면 관찰에서는 self-bonding 강도가 점차 높아짐에 따라 더욱 조밀한 물결무늬 파면과 dimple 형태와 유사한 파면 형상들이 관찰되는 것으로 보아 접합공정 시 접합 면을 가로지르는 PEEK 결정들의 성장 정도가 self-bonding 강도에 커다란 영향을 미친다고 판단되었다.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.55-60
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• 2020

The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to realize SIP. Copper-to-copper bonding process faces challenges such as copper oxidation and high temperature and high pressure process conditions. In this study, the bonding interface quality of low-temperature copper-to-copper bonding using a two-step plasma treatment was investigated through quantitative bonding strength measurements. Our two-step plasma treatment formed copper nitride layer on copper surface which enables low-temperature copper bonding. The bonding strength was evaluated by the four-point bending test method and the shear test method, and the average bonding shear strength was 30.40 MPa, showing that the copper-to-copper bonding process using a two-step plasma process had excellent bonding strength.

• Applied Chemistry for Engineering
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• v.18 no.5
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• pp.407-414
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• 2007

Using the MPI (Moldflow Plastics Insight) software from Moldflow Co., the optimum conditions for producing the upper part of the automobile air cleaner were obtained for 20% talc filled polypropylene (PP). The analysis was carried out to solve the cracking problem between upper and lower parts and the improved process was proposed using the flow balance. The comparative results between the conventional process, CASE-1, with one-pin gate and the new process (CASE-2) comprising two-pin gate system are the followings. In the case of CASE-2, the shorter filling time and reduced cycle time induced an improved production and processibility. In addition, the orientation and volumetric shrinkage are similar to those observed in the lower part, but the assembly, deformation, and physical characteristics are enhanced. The problem induced by the CASE-1 did not originate from the residual stress, but from the difference in the size of the upper part air cleaner after shrinkage. Thus, the orientation problem was expected to improve by optimizing the gate structure.

• 프린팅코리아
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• v.13 no.11
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• pp.82-83
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• 2014

(주)벽호(대표이사 권준성)는 1996년 벽호문화사라는 이름으로 교육출판기업인 (주)지학사의 관계사로 설립됐다. 1999년 파주로 이전한 이후 꾸준한 투자로 설비 현대화와 공정의 표준화를 이뤘으며, 업계 최고 수준의 전문 인력을 육성 영입하면서 교육 출판물뿐만 아니라 단행본, 잡지, 카탈로그, 전단지에서부터 패키지에 이르는 인쇄 전 분야를 담당하는 전문기업으로 성장했다. 최근에도 고모리시스템38(LR-438/625S) 국전윤전기를 도입하는 등 끊임없는 도전과 성장을 거듭하고 있다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.05a
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• pp.41.2-41.2
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• 2008

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.45-50
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• 2017

We investigated effect of Zn content on shear strengh of Sn-0.7Cu-xZn and OSP surface finished solder joints. Five pastes of Sn-0.7Cu-xZn (x=0, 0.5, 1.0, 1.5, 2.0 wt.%) solders were fabricated by mixing of solder powder and flux using planatary mixer. $180{\mu}m$ diameter solder balls were formed on OSP surface finished Cu electrodes by screen print method, and the reflow process was performed. The shear strength was evaluated with two high shear speeds; 0.01 and 0.1 m/s. The thickness of the intermetallic compound(IMC) layer was decreased with increasing Zn content in Sn-0.7Cu-xZn solder. The highest shear strength was 3.47 N at the Zn content of 0.5 wt.%. As a whole, the shear strength at condition of 0.1 m/s was higher than that of 0.01 m/s because of impact stress. Fracture energies were calculated by F-x (Force-displacement) curve during high speed shear test and the tendency of fracture energy and that of shear strength were good agreement each other. Fracture took place within solder matrix at lower Zn content, and fracture occured near the interface of OSP surface finished Cu electrode and solder at higher Zn content.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
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• v.8 no.1
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• pp.77-84
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• 2010

Reduction of oxides has been investigated for the volume reduction and recycling of the spent oxide fuel from commercial nuclear power plants. Various oxide reduction methods were proposed and KAERI (Korea Atomic Energy Research Institute) is currently developing an electrochemical reduction process using a LiCl-$Li_2O$ molten salt as a reaction medium. The electrochemical reduction process, the front end of the pyroprocessing, can connect the PWR (Pressurized Water Reactor) oxide fuel cycle to a metal fuel cycle of the sodium cooled fast reactor. This paper summarizes KAERI efforts on the development, improvement, and scale-up of the oxide reduction process.