• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.63-71
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• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.48 no.5
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• pp.383-390
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• 2020

Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.37 no.1
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• pp.121-127
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• 2013

With the continuing demand for lightweight bicycles, carbon fiber composite materials have been widely used in manufacturing bicycle frames and components. Unlike general isotropic materials, the structural characteristics of composite materials are strongly influenced by the staking directions and sequences of composite laminates. Thus, to verify the design process of bicycles manufactured using composites, structural analysis is considered essential. In this study, a carbon-fiber-reinforced plastic (CFRP) bicycle frame was designed and its structural behavior was investigated using finite element analysis (FEA). By measuring the failure indices of the fiber and matrix under various stacking sequences and loading conditions, the effect of the stacking condition of composite laminates on the strength of the bicycle structure was examined. In addition, the structural safety of the bicycle frame can be enhanced by reinforcing weak regions prone to failure using additional composite laminates.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.55-61
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• 2022

In this study, properties of Pb-free solder joints which were combined using Sn-3.0Ag-0.5Cu (SAC305) Pb-free solder with a mid-temperature type of melting temperature and Sn-57Bi-1Ag Pb-free solder with a low-temperature type of melting temperature were reported. Combined Pb-free solder joints were formed by reflow soldering processes with ball grid array (BGA) packages which have SAC305 solder balls and flame retardant-4 (FR-4) printed circuit boards (PCBs) which printed Sn-57Bi-1Ag solder paste. The reflow soldering processes were performed with two types of temperature profiles and interfacial properties of combined Pb-free solder joints such as interfacial reactions, formations of intermetallic compounds (IMCs), diffusion mechanisms of Bi, and so on were analyzed with the reflow process conditions. In order to compare reliability characteristics of combined Pb-free solder joints, we also conducted thermal shock test and analyzed changes of mechanical properties for joints from a shear test during the thermal shock test.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.11a
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• pp.54-54
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• 2003

최근 새로운 개념에 물성 구현을 위한 강유전체 산화물 인공격자의 연구가 활발히 진행되고 있다. 본 연구에서는 펄스레이져 증착법을 이용하여 산소분압 100 mTorr와 증착온도 50$0^{\circ}C$에서 LSCO/MgO 기판 위에 PbTiO$_3$(PTO) 와 PbZrO$_3$(PZO)을 주기적으로 적층하여 강유전체 산화물 인공격자를 형성하였다. 인공격자의 주기는 1~100 unitcell 까지 변화시켰다. 적층주기와 두께 변화에 따른 PZO/PTO 인공격자의 성장과 전기적 특성에 대하여 관찰하였다. X선 회절분석을 통하여 PZO/PTO 인공격자는 주기가 25 unit cell 이하의 적층구조에서 초격자의 형성으로 인한 위성피크가 관찰되었으며, 그 이하의 낮은 주기(1~10 unitcell)에서는 위성피크와 강한 (100)과 (200) 성장거동을 보였다. 높은 주기에서는 c축 성장된 PTO와 a축 성장된 PZO 각각의 성장거동을 보였다. 적층 주기가 감소함에 따라 a축 성장된 PTO와 c축 성장된 PZO가 초격자를 형성하였다. 적층주기가 감소함에 따라 유전상수와 잔류분극값이 향상되었다. 유전상수는 1 unitcell 주기에서 800정도의 값을 보였고, 잔류분극값은 2 unitcell 주기에서 2Pr=38.7 $\mu$C/$\textrm{cm}^2$ 정도의 가장 큰 값을 나타냈다. 적층주기가 2 unitcell에서 두께가 감소함에 따라 유전상수가 감소하였고, 20 nm 까지 분극반전에 의한 capacitance-voltage 특성곡선의 이력 현상(강유전성)을 관찰하였다. 이러한 산화물 인공초격자에서의 유전상수와 잔류분극값의 향상에 대하여 논의 할 것이며, 임계크기효과 관점에서 나노사이즈(50 nm~5 nm)에서 인공초격자의 전기적 분극의 안정성에 대하여 또한 논의 할 것이다.소수성 가스의 경우70% 이상 향상되었음을 알 수 있었으며, 본 연구를 통해 광분해를 이용한 스크러버가 기존설비의 장.단점을 충분히 보완 가능한 환경 설비임을 확인할 수 있었다. duty로 구동하였으며, duty비 증가에 따라 pulse의 on-time을 고정하고 frequency를 변화시켰다. dc까지 duty비가 증가됨에 따라 방출전류의 양이 선형적으로 증가하였다. 전압을 일정하게 고정시키고 각 duty비에서 시간에 따라 방출전류를 측정한 결과 duty비가 높을수록 방출전류가 시간에 따라 급격히 감소하였다. 각 duty비에서 방출전류의 양이 1/2로 감소하는 시점을 에미터의 수명으로 볼 때 duty비 대 에미터 수명관계를 구해 높은 duty비에서 전계방출을 시킴으로써 실제의 구동조건인 낮은 duty비에서의 수명을 단시간에 예측할 수 있었다. 단속적으로 일어난 것으로 생각된다.리 폐 관류는 정맥주입 방법에 비해 고농도의 cisplatin 투여로 인한 다른 장기에서의 농도 증가 없이 폐 조직에 약 50배 정도의 고농도 cisplatin을 투여할 수 있었으며, 또한 분리 폐 관류 시 cisplatin에 의한 직접적 폐 독성은 발견되지 않았다이 낮았으나 통계학적 의의는 없었다[10.0%(4/40) : 8.2%(20/244), p>0.05]. 결론: 비디오흉강경술에서 재발을 낮추기 위해 수술시 폐야 전체를 관찰하여 존재하는 폐기포를 놓치지 않는 것이 중요하며, 폐기포를 확인하지 못한 경우와 이차성 자연기흉에 대해서는 흉막유착술에 더 세심한 주의가 필요하다는 것을 확인하였다. 비디오흉강경수술은 통증이 적고, 입원기간이 짧고, 사회로의 복귀가 빠르며, 고위험군에 적용할 수 있고, 무엇보다도 미용상의 이점이 크다는 면에서 자연기흉에 대해 유용한 치료방법임에는 틀림이 없으나 개흉술에 비해 재발율이 높고 비용이 비싸다는 문제가 제기되고 있는 만큼 더 세심한 주의와 장기 추적관찰이 필요하리라 사료된

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.8
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• pp.913-920
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• 2011

We describe the evaluation of the fatigue life and strength of a lightweight railway bogie frame made of glass fiber/epoxy 4-harness satin-woven composites. To obtain the S-N curve for the evaluation of the fatigue characteristics of the composite bogie frame, we performed a tension-compression fatigue test for composite specimens with different stacking sequences of the warp direction, fill direction, and $0^{\circ}/90^^{\circ}$ direction. We used a stress ratio (R) of -1, a frequency of 5 Hz, and an endurance limit of $10^7$. The fatigue strength of the composite bogie frame was evaluated by a Goodman diagram according to JIS E 4207. The results show that the fatigue life and strength of the lightweight composite bogie satisfy the requirements of JIS E 4207. Given its weight, its performance was better than that of a conventional metal bogie frame based on an SM490A steel material.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.12
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• pp.614-621
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• 2019

A generalized laminated composite beam element is presented for the flexural and buckling analysis of laminated composite beams with double and single symmetric cross-sections. Based on shear-deformable beam theory, the present beam model accounts for transverse shear and warping deformations, as well as all coupling terms caused by material anisotropy. The plane stress and plane strain assumptions were used along with the cross-sectional stiffness coefficients obtained from the analytical technique for different cross-sections. Two types of one-dimensional beam elements with seven degrees-of-freedom per node, including warping deformation, i.e., three-node and four-node elements, are proposed to predict the flexural behavior of symmetric or anti-symmetric laminated beams. To alleviate the shear-locking problem, a reduced integration scheme was employed in this study. The buckling load of laminated composite beams under axial compression was then calculated using the derived geometric block stiffness. To demonstrate the accuracy and efficiency of the proposed beam elements, the results based on three-node beam element were compared with those of other researchers and ABAQUS finite elements. The effects of coupling and shear deformation, support conditions, load forms, span-to-height ratio, lamination architecture on the flexural response, and buckling load of composite beams were investigated. The convergence of two different beam elements was also performed.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.102-110
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• 2023

This paper introduces scarf welding process of thin substrates using flexible laser transmission welding (f-LTW) technology. We examined the behavior of tensile strength relative to the scarf angle for flexible applications. Thin plastic substrates with the thickness of less than 100 ㎛ were bonded and a jig to form a slope at the edge of the substrate was developed. By developing the scarf welding process, we successfully created a flexible bonding technology that maintains joint's thickness after the process. The tensile strength of the joint was assessed through uniaxial test, and we found that the tensile strength increases as the slope of bonding interface decreases. By conducting stress analysis at the bonding interface with respect to the slope angle, design factor of bonding structure was investigated. These findings suggest that the tensile strength depends on the geometry of the joint, even under the same process conditions, and highlights the significance of considering the geometry of the joint in welding processes.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.7-15
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• 2012

Semiconductor packages are increasingly moving toward miniaturization, lighter and multi-functions for mobile application, which requires highly integrated multi-stack package. To meet the industrial demand, the package and silicon chip become thinner, and ultra-thin packages will show serious reliability problems such as warpage, crack and other failures. These problems are mainly caused by the mismatch of various package materials and geometric dimensions. In this study we perform the numerical analysis of the warpage deformation and thermal stress of 4-layer stacked FBGA package after EMC molding and reflow process, respectively. After EMC molding and reflow process, the package exhibits the different warpage characteristics due to the temperature-dependent material properties. Key material properties which affect the warpage of package are investigated such as the elastic moduli and CTEs of EMC and PCB. It is found that CTE of EMC material is the dominant factor which controls the warpage. The results of RSM optimization of the material properties demonstrate that warpage can be reduced by $28{\mu}m$. As the silicon die becomes thinner, the maximum stress of each die is increased. In particular, the stress of the top die is substantially increased at the outer edge of the die. This stress concentration will lead to the failure of the package. Therefore, proper selection of package material and structural design are essential for the ultra-thin die packages.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.79-79
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• 2002

반도체 패키징 열관리 재료로 널리 사용되는 W-Cu 시스템을 택하여 대면적 양산성이 낮은 기존의 공정과는 달리 테입캐스팅 공정을 적용하여 W-Cu 박판재를 그린 테잎 형태로 제조하여 탈지후 소결하는 저비용 양산화 공정을 개발하였다. 테입 캐스팅, 적층 및 탈지, 소결공정을 거쳐 제조하였고, 이때 탈지 및 소결조건에 따른 미세조직, 소결밀도, 변형등의 물성을 분석함으로써 휨과 변형이 최소화된 W-Cu 박판재를 제조할수 있었다.