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http://dx.doi.org/10.5139/JKSAS.2020.48.5.383

Characteristic Validation of High-damping Printed Circuit Board Using Viscoelastic Adhesive Tape  

Shin, Seok-Jin (Department of Smart Vehicle System Engineering, Chosun University)
Jeon, Su-Hyeon (LIG Nex1 Co. Ltd.)
Kang, Soo-Jin (LIG Nex1 Co. Ltd.)
Park, Sung-Woo (LIG Nex1 Co. Ltd.)
Oh, Hyun-Ung (Department of Smart Vehicle System Engineering, Chosun University)
Publication Information
Journal of the Korean Society for Aeronautical & Space Sciences / v.48, no.5, 2020 , pp. 383-390 More about this Journal
Abstract
Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.
Keywords
Launch Vibration; Wedge Lock; Printed Circuit Board; Viscoelastic Adhesive Tape; Fatigue Life;
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