Characteristic Validation of High-damping Printed Circuit Board Using Viscoelastic Adhesive Tape
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Shin, Seok-Jin
(Department of Smart Vehicle System Engineering, Chosun University)
Jeon, Su-Hyeon (LIG Nex1 Co. Ltd.) Kang, Soo-Jin (LIG Nex1 Co. Ltd.) Park, Sung-Woo (LIG Nex1 Co. Ltd.) Oh, Hyun-Ung (Department of Smart Vehicle System Engineering, Chosun University) |
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