• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.4
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• pp.16-22
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• 2004

Shape optimization was performed to obtain the precise shape of cutouts including the internal shape of cutouts in laminated composite plates by three dimensional modeling using solid element. The volume control of the growth-strain method was implemented and the distributed parameter chosen as Tsai-Hill fracture index for shape optimization. The volume control of the growth-strain method makes Tsai-Hill failure index at each element uniform in laminated composites under the initial volume. Then shapes optimized by Tsai-Hill failure index were compared with those of the initial shapes for the various load conditions and cutouts. The following conclusions were obtained in this study (1) It was found that growth-strain method was applied efficiently to shape optimization of three dimensional cutouts in a laminated composite plate, (2) The optimal shapes on the various load conditions and cutouts were obtained, (3) The maximum Tsai-Hill failure index was reduced up to 67% when shape optimization was performed under the initial volume by volume control of growth-strain method.

• Journal of Power System Engineering
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• v.11 no.1
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• pp.115-120
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• 2007

The effect of grain size on the damping capacity of Fe-26Mn-2Al alloy studied in this paper has been investigated after changing the microstructure by cold rolling and changing grain size. Micro structures in Fe-26Mn-2Al at room temperature consist of a large quantity of austenite and a small quantity of ${\varepsilon}\;and\;{\alpha}'$ martensite. And ${\varepsilon}\;and\;{\alpha}'$ martensite was increased by increasing the degree of cold rolling. The content of deformation induced martensite was increased with increasing the degree of cold rolling. Damping capacity was linearly increased with increasing ${\varepsilon}$ martensite content, which suggests that stacking faults and ${\varepsilon}$ martensite variant boundaries are the principle damping sources. With increasing the grain size in Fe-26Mn-2Al alloy, the damping capacity was increased due to increasing the volume fraction of ${\varepsilon}$ martensite by decrement in stability of austenite phase. With decreasing the grain size, the content of deformation induced martensite was decreased and the damping capacity was decreased.

• Proceedings of the KAIS Fall Conference
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• 2001.05a
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• pp.220-223
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• 2001

Pb가 10% 과잉되고 Zr : Ti = 52 : 48 조성을 갖는 PZT sol이 Pt(3500Å)/Ti(400Å)/SiO₂(3000Å)Si(525㎛)기판 위에 스핀 코팅법으로 반복 코팅된 후, 450℃에서 10분, 650℃에서 2분간 반복 열처리되었다. 이와 같이 다양한 두께로 적층된 박막은 각 시편에 대해 최종적으로 650℃ 30분 동안 어닐링 처리되었다. 제조된 PZT 박막의 두께는 4100Å에서 1.75㎛사이의 4종이었다. 이어서 스퍼터링법으로 Pt전극이 PZT 막 위에 증착되었다. 제조된 PZT 박막의 결정 구조 조사를 위해 XRD, 그리고 미세 구조 및 전기적 특성을 알아보기 위해 FESEM과 P-E 이력 곡선이 각각 관찰되었다. 4100Å에서 1.75㎛까지 두께 증가에 따른 장비상의 포화 이력 한계로 잔류 분극(Pr)값이 25μC/㎠에서 다소 감소되었다. 측정된 X선 회절 결과에서 최초 4회 코팅시 perovskite 결정 구조로 성장한 결정립은 (111)배향이 우세하었으나, 두께가 증가됨에 따라 (111)/(110)값이 감소되었으며, 이를 통해 두께 증가에 따른 (111)배향성이 다소 감소됨을 알 수 있었다. 이상의 결과로부터 제조된 PZT 박막은 큰 힘과 높은 내전압 특성을 갖는 마이크로 압전 액츄에이터에 적용될 수 있을 것으로 생각되었다.

• Electrical & Electronic Materials
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• v.8 no.5
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• pp.580-586
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• 1995

최근 커패시터의 전극은 Pt, Au등으로 이용되고 있다. 이러한 전극의 전기적 특성은 우수하나 고가이다. 본 연구에서는 전극의 저가격화 측면에서 알루미늄 전극 위에 BaTiO$_{3}$를 증착하고 기관의 온도를 실온에서 600[.deg. C]까지 변화시켜 RF스퍼터링법으로 제작하였다. BaTiO$_{3}$세라믹의 유전특성은 구성하고 있는 입자의 강유전 분역 밀도와 입자의 크기에 의존하므로 입자가 성장되는 온도영역에서 입자의 크기와 유전율간의 관계를 연구하였다. 또한 BaTiO$_{3}$박막 커패시터의 유전상수는 BaTiO$_{3}$세라믹과 알루미늄기관의 계면에서 산화특성이 일어나기 때문에 기관온도의 변화에 의해 조사되었다. 기관의 온도를 증가시킴에 따라 결정면의 피크와 강도는 증가하였으며, 유전특성은 결정입자의 크기가 0.8[.mu.m]일때 가장 양호하였다. 유전율값은 기판 온도가 400[.deg. C]일 때 가장 크게 나타났다. 결과적으로, 알루미늄 전극에 BaTiO$_{3}$세라믹을 증착하여 저가의 적층용 세라믹 콘덴서를 제조할 수 있음을 알았다.

• The Journal of the Korea institute of electronic communication sciences
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• v.16 no.3
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• pp.451-456
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• 2021

In order to improve the cell capacitance and scale down in capacitors of semiconductor memory devices, a stacked ONO structure has been introduced as a dielectric layer and thinning of these layers has been attempted continuously. However, many problems have emerged in the manufacturing process. In this study, L/L LPCVD system was used to suppress the growth of natural oxide film of about 10 Å, which was able to secure the capacitance of 3fF / cell. In addition, we investigated the effect of thinning of the dielectric film on the abnormal oxidation of the nitride film, and proposed a stable process control method for forming the dielectric film to ensure oxidation resistance.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.161-162
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• 2011

최근 광전자 분야에서는 미래 에너지 자원에 대한 관심과 함께 GaN 기반 태양전지 연구가 활발히 진행되고 있다. GaN 물질은 높은 전자 이동도와 높은 포화 속도 등 광전자 소자에 유리한 광, 전기적 특성들을 가지고 있다. 또한, In의 함량을 변화시켜가며, 0.7eV에서 3.4eV까지 밴드갭을 조절함으로써, 자외선부터 적외선까지 태양빛 스펙트럼의 대부분을 흡수할 수 있는 장점이 있다. InGaN 태양전지의 효율을 높이기 위해서는 In의 함량을 늘려 밴드갭을 줄이는 것이 중요하다. 하지만 GaN 와 InN 간의 격자 부정합으로 인해 In 함량이 높은 단결정 InGaN 층을 두껍게 성장 하는 것이 어렵다. 때문에 GaN 기반 태양전지 관련 연구 그룹들이 태양전지의 효율 향상을 위해 활성층에 양자우물(MQWs) 구조, Supper Lattice (SLs) 구조와 같이 얇은 InGaN/GaN 층을 주기적으로 반복하여 적층함으로써 높은 조성의 In을 함유한 상질의 InGaN/GaN 층을 성장하는 연구들을 진행해 왔다. 본 연구에서는, p-i-n 구조와 MQW 구조를 갖는 InGaN 기반 태양전지를 제작하여, 각각의 특성을 분석해 봄으로써, In0.1Ga0.9N 태양전지 활성층의 구조에 따른 장/단점에 대해 논의하였다. 먼저 MOCVD를 이용하여 200 nm의 i-In0.1Ga0.9N 활성층을 갖는 p-i-n 구조와 In0.19Ga0.81N/GaN(3 nm/8 nm) MQWs (8 periods) 구조를 갖는 태양전지 에피를 각각 성장하였고, 그 후 공정을 통해 그림 1과 같이 InGaN 태양전지 소자를 제작하였다. 그 후, 각 태양전지의 전류/전압 곡선과 외부양자효율을 측정하여 그림 2와 같은 결과를 얻었다. p-i-n과 MQW 샘플의 외부양자효율은 각각 ~70%, ~25%로 측정 되었다. MQW 샘플의 외부 양자효율이 높지 않음에도 불구하고 p-i-n 구조에 비해 높은 In 함량을 가지고 있으므로, 더 넓은 파장의 빛을 흡수하여, 높은 단락전류(0.778 mA/cm2)를 보이고 있다. 또한 p-i-n 구조에 비해 높은 개방전압(2.3V)를 가지고 있으므로, MQW 샘플이 약 17% 정도 높은 변환효율(1.4%)를 보이고 있다. 이후 추가적으로 p-i-n 과 MQW 구조의 InGaN 태양전지에 나타나는 Voc와 Jsc의 차이를 Polarization 효과를 비롯한 다양한 측면에서 분석해 보고자 한다.

• Journal of the Korean Ceramic Society
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• v.36 no.1
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• pp.43-49
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• 1999

Gas pressure sintered silicon nitride based composites with 0~5wt% $\beta$-Si3N4 whiskers were prepared. The whiskers were unidirectionally oriented by a modified tape casting technqiue and green bodies with various microstructure were formed by changing stacking sequences of sheets cut from the tape. Orientations of the large elongated grains of the sample after gas pressure sintering were the same as the those of the whiskers of green body, and the sintering shrinkage and mechanical properties of sintered sample were consistent with the microstructural characteristics. In case of unidirectional samples, the sintering shrinkage normal to whisker alignment direction was larger than that parallel to the direction. The shrinkage difference inceaed as the whiskercontent increaed. As whisker content increaed, the crack length normal to and parallel to tape casting direction became shorter and larger, respectively. Although the grain size increased by th whisker addition, the flexural strength of unidirectional samples was not lower than that of smaple without the whisker. In case of crossplied and 45$^{\circ}$rotated samples, the anisotropy of mechanical preoperties disappeared.

• Journal of Adhesion and Interface
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• v.18 no.2
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• pp.59-67
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• 2017

Recently, integration of parts is accelerating according to the growth of the smart mobile industry. The integration of these parts causes problems of interference phenomena between the parts, and the importance of electromagnetic wave shielding technology to solve this problem is highlighted. Electromagnetic wave shielding technology is implemented so as to reflect or absorb electromagnetic waves, and generally conductive materials are utilized for electromagnetic wave shielding. Transparent shielding technology is required according to recent industrial changes. In this research, we propose transparent the shielding film using imprint technology with conductive composite binder. Utilizing UV polymerized acrylic binder to produce a conductive composite binder. Spherical, plate and stacked silver particles were used for conductivity. The changes of the curing characteristics, conductivity and adhesion were observed according to the structural characteristics of the silver particles. The use of spherical particles was the most efficient in the curing process, and an additional curing system was required to complement the UV-shadowing structure. In the conductivity evaluation, the stacked structure showed excellent characteristics. The adhesion of spherical system was the best. It is evaluated as a result of irregularities on the surface. Ultimately, the patterned film using this showed excellent transparency characteristics.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.61-68
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• 2023

In this study, Sn-3.5Ag-15.0Fe composite solder was manufactured and applied to TLP bonding to change the entire joint into a Sn-Fe IMC(intermetallic compound), thereby applying it as a high-temperature solder. The FeSn₂ IMC formed during the bonding process has a high melting point of 513℃, so it can be stably applied to power modules for power semiconductors where the temperature rises up to 280℃ during use. As a result of applying ENIG surface treatment to both the chip and substrate, a multi-layer IMC structure of Ni₃Sn₄/FeSn₂/Ni₃Sn₄ was formed at the joint. During the shear test, the fracture path showed that cracks developed at the Ni₃Sn₄/FeSn₂ interface and then propagated into FeSn₂. After 2hours of the TLP joining process, a shear strength of over 30 MPa was obtained, and in particular, there was no decrease in strength at all even in a shear test at 200℃. The results of this study can be expected to lead to materials and processes that can be applied to power modules for electric vehicles, which are being actively researched recently.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.13 no.3
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• pp.122-126
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• 2003

In this study, $Zn_{0.86}Mn_{0.14}$Te epilayer of 0.7 $\mu\textrm{m}$-thickness was grown on GaAs(100) substrate by using hot wallepitaxy. GaAs(100) substrate was removed from $Zn_{0.86}Mn_{0.14}$Teepilayer by the selective etching solution. The crystal structure and the lattice constant of only Z $n_{0.86}$ M $n_{0.14}$Te epilayer were investigated to be zincblende and 6.140 $\AA$ from X-ray diffraction pattern, respectively. Mn composition x of $Zn_{1-x}Mn_x$Te epilayer was found to be 0.14 using this lattice constant and Vegard's law. The crystal quality of the epilayer was confirmed to be very good due to 256 arcsec-full-width at half-maximum of the double crystal rocking curve. The absorption spectra from the transmission ones were obtained to measure the band gap energy of $Zn_{0.86}Mn_{0.14}$Te epilayer from 300 K to 10 K. With the decreasing temperature,. strong absorption regions in the absorption spectra were shifted to higher energy side and the absorption peak meaning the free exciton formation appeared near the absorption edge. The band gap energy values of $Zn_{0.86}Mn_{0.14}$Te epilayer at 0 K and 300 K were found to be almost 2.4947 eV and 2.330 eV from the temperature dependence of the free exciton peak position energy of $Zn_{0.86}Mn_{0.14}$Te epilayer, respectively. The free exciton peak position energy of $Zn_{0.86}Mn_{0.14}$Te epilayer without GaAs substrate was larger 15.4 meV than photoluminescence peak position energy at 10 K. This energy difference between two peaks was analysed to be Stokes shift.