Browse > Article
http://dx.doi.org/10.17702/jai.2017.18.2.59

A Study on Adhesion of Mechanical Properties of Rubber by MgCl2  

Park, Ji-won (The Lab. Of Adhesion & Bio-Composites, Program in Environmental Materials Science, Seoul National University)
Back, Jong-Ho (The Lab. Of Adhesion & Bio-Composites, Program in Environmental Materials Science, Seoul National University)
Lee, Tae-Hyung (The Lab. Of Adhesion & Bio-Composites, Program in Environmental Materials Science, Seoul National University)
Kim, Hyun-Joong (The Lab. Of Adhesion & Bio-Composites, Program in Environmental Materials Science, Seoul National University)
Publication Information
Journal of Adhesion and Interface / v.18, no.2, 2017 , pp. 59-67 More about this Journal
Abstract
Recently, integration of parts is accelerating according to the growth of the smart mobile industry. The integration of these parts causes problems of interference phenomena between the parts, and the importance of electromagnetic wave shielding technology to solve this problem is highlighted. Electromagnetic wave shielding technology is implemented so as to reflect or absorb electromagnetic waves, and generally conductive materials are utilized for electromagnetic wave shielding. Transparent shielding technology is required according to recent industrial changes. In this research, we propose transparent the shielding film using imprint technology with conductive composite binder. Utilizing UV polymerized acrylic binder to produce a conductive composite binder. Spherical, plate and stacked silver particles were used for conductivity. The changes of the curing characteristics, conductivity and adhesion were observed according to the structural characteristics of the silver particles. The use of spherical particles was the most efficient in the curing process, and an additional curing system was required to complement the UV-shadowing structure. In the conductivity evaluation, the stacked structure showed excellent characteristics. The adhesion of spherical system was the best. It is evaluated as a result of irregularities on the surface. Ultimately, the patterned film using this showed excellent transparency characteristics.
Keywords
EMI Shielding; Silver Particles; UV Curing; Composite material; Transparent Pattern; Negative Imprinting;
Citations & Related Records
연도 인용수 순위
  • Reference
1 D. D. L. Chung, Carbon, 39(2), 279-285 (2001).   DOI
2 M. P. Robinson, T. M. Benson, C. Christopoulos, J. F. Dawson, M. D. Ganley, A. C. Marvin, S. J. Porter, D. W. P. Thomas, IEEE Transactions on Electro-magnetic Compatibility, 40(3), 240-248 (1998).   DOI
3 M. Mishra, A. P. Singh, V. Gupta, A. Chandra, & S. K. Dhawan, Journal of Alloys and Compounds, 688, 399-403 (2016).
4 Celozzi, Salvatore, G. Lovat, and R. Araneo. Electro-magnetic shielding. John Wiley & Sons, Inc., (2008).
5 R. Wai, Y. -F. Lin, & C. -C. Liao., Applied System Innovation: Proceedings of the 2015 International Conference on Applied System Innovation (ICASI 2015), May 22-27, 2015, Osaka, Japan. CRC Press, (2016).
6 P. Ganesan, T. Karthik, A. M. Kumar, & D. Maruthamani, Indian Journal of Fibre & Textile Research (IJFTR), 41(3), 293-297 (2016).
7 P. Kumar, P. V. Reddy, B. Choudhury, P. Chowdhury, & H. C. Barshilia, Thin Solid Films, 612, 350-357, (2016).   DOI
8 T. -W. Lee, S. -E. Lee, and Y. G. Jeong, ACS applied materials & interfaces, 8(20), 13123-13132 (2016).   DOI
9 S. -W. Lee, J. -W. Park, C. -H. Park, Y. -E. Kwon, H. -J. Kim, E. -A. Kim, H. -S. Woo, S. Schwartz, M. Rafailovich, J. Sokolov, International Journal of Adhesion and Adhesives, 44, 200-208 (2013).   DOI
10 Electrical Conductivity in Metals, https://www.thebalance.com/electrical-conductivity-in-metals-2340117
11 Dean, Katherine, & W. D. Cook, Macromolecules, 35(21), 7942-7954 (2002).   DOI
12 J. -W. Park, G. S. Shim, J. H. Back, H. J. Kim, S. Shin, & T. S. Hwang, Polymer Testing, 56, 344-353 (2016).   DOI
13 J. -G. Lee, G. -S. Shim, J. -W. Park, H. -J. Kim, S. - E. Moon, Y. -K. Kim, D. -H. No, J. -H. Kim, K. -Y. Han, Journal of Electronic Materials, 45(7), 3786-3794 (2016).   DOI
14 M. Sumita, K. Sakata, S. Asai, K. Miyasaka & H. Nakagawa, Polymer Bulletin, 25(2), 265-271 (1991).   DOI
15 K. Miyasaka, K. Watanabe, E. Jojima, H. Aida, M. Sumita & K. Ishikawa, Journal of Materials Science, 17(6), 1610-1616 (1982).   DOI
16 B. T. Poh and S. K Chow, Journal of applied polymer science, 106(1), 333-337 (2007).   DOI
17 Z. Czech, R. Peech, A. Kowalczyk, A. Kowalski and R. Wrobel, Polish Journal of Chemical Technology, 13(4), 77-81 (2011).
18 S. W. Lee, J. W. Park, H. J. Kim, K. M. Kim, H. I. Kim and J. M. Ryu, Journal of Adhesion Science and Technology, 26(1-3), 317-329 (2012).