• Journal of the Korean Chemical Society
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• v.54 no.3
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• pp.291-294
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• 2010

In this study, we demonstrated high-efficiency blue organic light-emitting diodes (OLEDs) employing BCzVBi as a blue fluorescent dye doped into blue host material, DPVBi with various concentration. The optimized blue OLED device having high-efficiency was constructed with structure of NPB (500 ${\AA}$) / DPVBi:BCzVBi-6% (150 ${\AA}$)/$Alq_3$(300 ${\AA}$) / Liq (20 ${\AA}$) / Al (1000 ${\AA}$). The maximum luminescence of blue OLED was 13200 cd/$m^2$ at 13.8 V and current density and maximum efficiency were 26.4 mA/$cm^2$ at 1000 cd/$m^2$ and 4.24 cd/A at 3.9 V, respectively. Luminous efficiency shows two times higher than comparing with non-doped BCzVBi blue OLED whereas $CIE_{x,y}$ coordinate was similar with bare DPVBi blue OLED such as (0.16, 0.19). Electroluminescence of BCzVBi-6% doped blue OLED has two major peaks at 445 nm and 470 nm whereas pure DPVBi's blue peak appears at 456 nm and it is happened through endothermic Forster energy transfer by molecule's vibration between LUMO of DPVBi as host material and LUMO of BCzVBi as dopant in device.

• Composites Research
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• v.29 no.4
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• pp.209-215
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• 2016

The failure of composite sandwich structures with thickness and material variation was studied. The main body of the structure is sandwich plate made of the carbon composite face and Aluminum honeycomb core. It is connected with composite laminated flange without core through transition region of tapered sandwich panel with foam core. Tension and compression tests were conducted for the total of 6 panels, 3 for each. Test results showed that the panels under compression are vulnerable to the face failure along the material discontinuity line between two different cores. However the failure load of which panel does not show such failure can carry 16% more load and fails in honeycomb core and face debonding. For the tensile load, the extensive delamination failure was observed at the corner radius which connects the panel and the flange. The average failure load for compression is about 7 times the tensile failure load. Accordingly, these sandwich structures should be applied to the components that endure the compressive loadings.

• Korean Journal of Food Science and Technology
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• v.28 no.5
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• pp.897-903
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• 1996

The shelf-life of brown rice in laminated film (4-layered) pouch was analyzed at various temperatures $(4^{\circ}C,\;20^{\circ}C,\;30^{\circ}C\;and\;$40^{\circ}C)$ using n-hexanal content and fatty acid composition as a measure of deterioration. The far acidity of brown rice during storage showed sensitive responses at the storage temperature, resulting in the activation energy of 14.07 kcal/mole and $Q_{10}$ value of 2.22. The fatty acids in the brown rice were myristic, palmitic, stearic, oleic, linoleic and linolenic acid, and oleic acid was the moot predominant. The higher the temperature and the longer the storage periods, the higher the fatty acid contents except linoleic acid. The n-hexanal activation energy was 18.36 kcal/mole, and $Q_{10}$ value was 2.84. Based on the storage conditions, the shelf-life of brown rice was 80 days by n-hexanal and 60 days by fat acidity at room temperature $(21^{\circ}C)$.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.69-74
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• 2010

A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.

• Applied Chemistry for Engineering
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• v.24 no.3
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• pp.219-226
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• 2013

Organic semiconductor-based soft electronics has potential advantages for next-generation electronics and displays, which request mobile convenience, flexibility, light-weight, large area, etc. Organic field-effect transistors (OFET) are core elements for soft electronic applications, such as e-paper, e-book, smart card, RFID tag, photovoltaics, portable computer, sensor, memory, etc. An optimal multi-layered structure of organic semiconductor, insulator, and electrodes is required to achieve high-performance OFET. Since most organic semiconductors are self-assembled structures with weak van der Waals forces during film formation, their crystalline structures and orientation are significantly affected by environmental conditions, specifically, substrate properties of surface energy and roughness, changing the corresponding OFET. Organo-compatible insulators and surface treatments can induce the crystal structure and orientation of solution- or vacuum-processable organic semiconductors preferential to the charge-carrier transport in OFET.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.3
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• pp.95-99
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• 2019

In the modified atmosphere packaging of powdered infant formula, the oxygen inside the package may cause its quality deterioration and needs to be minimized for quality preservation. A way of oxygen scavenger inclusion in the single-serve package without contacting the product was devised for removing oxygen residing initially and permeating through the seal layer during the storage. A polyethylene/pulp multi-layer porous filter bag of 5 × 7 cm containing 13 g of powdered infant formula was packaged in an 8 × 9 cm size aluminium laminated film package with a Fe-based oxygen scavenger of 1.8 g. After nitrogen flushed packaging, the active packages were stored at 30℃ for 254 days with periodical quality measurement. The active package could remove the initial residual oxygen of 1.4% completely and maintain absence of oxygen for the whole storage, which contributed to reduced oxidation observed in lower product peroxide value compared to that of the product in the control package. There was no influence of packaging treatment on content of 5-hydroxymethylfurfural, reaction product of initial nonenzymatic browning. The devised oxygen-scavenging single-serve package showed a potential to improve the preservation of infant formula powder and extend the shelf life.

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.44 no.1
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• pp.74-84
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• 2007

This paper presents a new dual-loop Delay Locked Loop(DLL) to expand the delay lock range of a conventional DLL. The proposed dual-loop DLL contains a Coarse_loop and a Fine_loop, and its operation utilizes one of the loops selected by comparing the initial time-difference among the reference clock and 2 internal clocks. The 2 internal clock signals are taken, respectively, at the midpoint and endpoint of a VCDL and thus are $180^{\circ}$ separated in phase. When the proposed DLL is out of the conventional lock range, the Coarse_loop is selected to push the DLL in the conventional lock range and then the Fine_loop is used to complete the locking process. Therefore, the proposed DLL is always stably locked in unless it is harmonically false-locked. Since the VCDL employed in the proposed DLL needs two control voltages to adjust the delay time, it uses TG-based inverters, instead of conventional, multi-stacked, current-starved inverters, to compose the delay line. The new VCDL provides a wider delay range than a conventional VCDL In overall, the proposed DLL demonstrates a more than 2 times wider lock range than a conventional DLL. The proposed DLL circuits have been designed, simulated and proved using 0.18um, 1.8V TSMC CMOS library and its operation frequency range is 100MHz${\sim}$1GHz. Finally, the maximum phase error of the DLL locked in at 1GHz is less than 11.2ps showing a high resolution and the simulated power consumption is 11.5mW.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.4
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• pp.362-370
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• 2010

In this paper, a compact RF Front-end module for Wireless Fidelity(Wi-Fi) and Worldwide Interoperability for Microwave Access(WiMAX) applications is realized by low temperature co-fired ceramic(LTCC) technology. The RF Front-end module is composed of three LTCC band-pass filters, a Film Bulk Acoustic Resonator(FBAR) filter, fully embedded matching circuits, an SPDT switch for mode selection, an SPDT switch for Tx/Rx selection, and an SP4T switch for band selection. The parasitic elements of 0.2~0.3 pF are generated by the structure of stacking in the top pad pattern for DC block capacitor of SPDT switch for mode selection. These kinds of parasitic elements break the matching characteristic, and thus, the overall electrical performance of the module is degraded. In order to compensate it, we insert a parallel lumped-element inductor on capacitor pad pattern for DC block, so that we obtain the optimized performance of the RF Front-end module. The fabricated RF front-end module has 12 layers including three inner grounds and it occupies less than $6.0mm{\times}6.0mm{\times}0.728mm$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.10
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• pp.758-765
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• 2018

This paper presents a 24-GHz frequency-modulated continuous wave(FMCW) radar transceiver with two Rx and one Tx channels in 65-nm complementary metal-oxide-semiconductor(CMOS) process and implemented it on a radar system using the developed transceiver chip. The transceiver chip includes a $14{\times}$ frequency multiplier, low-noise amplifier, down-conversion mixer, and power amplifier(PA). The transmitter achieves >10 dBm output power from 23.8 to 24.36 GHz and the phase noise is -97.3 GHz/Hz at a 1-MHz offset. The receiver achieves 25.2 dB conversion gain and output $P_{1dB}$ of -31.7 dBm. The transceiver consumes 295 mW of power and occupies an area of $1.63{\times}1.6mm^2$. The radar system is fabricated on a low-loss Duroid printed circuit board(PCB) stacked on the low-cost FR4 PCBs. The chip and antenna are placed on the Duroid PCB with interconnects and bias, gain blocks and FMCW signal-generating circuitry are mounted on the FR4 PCB. The transmit antenna is a $4{\times}4$ patch array with 14.76 dBi gain and receiving antennas are two $4{\times}2$ patch antennas with a gain of 11.77 dBi. The operation of the radar is evaluated and confirmed by detecting the range and azimuthal angle of the corner reflectors.

• Journal of Korean Society of Forest Science
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• v.94 no.4 s.161
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• pp.243-251
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• 2005

This study was carried out to evaluate precipitation, geological and topographical factors from the landslide area occurred in Maeri, Sangdong-myeon, Gimhaesi, Gyeongsangnam-do. The landslide was affected by geo-topographical factors. Talus which is infiltrated easily by runoff was widely distributed in the landslide area. Concave areas on back- and toe-slope were built up colluvial materials and weathered soils. The colluvial materials were consisted of less weathered pebbles and stones (diameter: 10~100 cm) which are easily infiltrated during rainfall events. Also the landslide was mainly affected by an ascending of ground water table which is low in summit and high in toe-slope due to geo-topographical characteristics of the landslide area. The most important reason of the landslide was a lacking of drainage system of ground water despite the high infiltration rates of ground water in talus area during rainfall events.