• Title/Summary/Keyword: 저항온도계수

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A Design of bias circuit in temperature independent voltage detect circuit (온도에 의존하지 않는 전압 감시회로에서의 바이어스 회로의 설계)

  • 문종규;백종무
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.35C no.9
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    • pp.49-56
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    • 1998
  • In this paper, a design of bias circuit in temperature independent voltage detect circuit is proposed. In order to realize this intention, we are used the differences in temperature coefficient of thermal voltage, resistor and transistor forward voltage(V$\sub$BE/) which is consisted in comparator. That is, It is realized by compensating the difference of temperature coefficient due to using components with each different temperature coefficient. As well, reference voltage of the circuit is accomplished by the difference of transistor forward voltage($\Delta$V$\sub$BE/) in comparator. In using reference voltage, resistor and V$\sub$BE/ Multiplier, we can design detect voltage of the circuit. In order to test operation of proposing circuit, we manufactured IC. Then, we measured operating characteristics and capability of the circuit by using HP4145B and temperature chamber. The result, we could obtain the good variation of temperature from -0.01 %/$^{\circ}C$ to -0.025 %/$^{\circ}C$.

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A Fabrication and Evaluation of Bipolar Integrated Pressure Sensor (바이폴라 공정으로 집적화된 압력센서 제작 및 평가)

  • 이유진;김건년;박효덕;이종홍
    • Proceedings of the KAIS Fall Conference
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    • 2001.05a
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    • pp.269-272
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    • 2001
  • 실리콘 마이크로머시닝 기술과 바이폴라 공정으로 집적화된 압력센서를 제작하고 동작특성 평가를 수행하였다. 센서부 보상파라미터를 추출하였고 트리밍 공정을 통하여 출력전압의 보상을 수행하였다. 센서 특성은 압저항 위치, 마스크 정렬 오차, 다이어프램 정밀두께제어 정도, 보호막의 과도식각 정도 등에 의하여 민감하게 좌우됨을 알 수 있었다. 웨이퍼별 샘플추출을 통하여 센서부 감도는 평균 0.653mV/kPa, 감도의 온도계수는 -2078.8ppm/℃, 옵셋 전압은 30.78mV, 옵셋전압의 온도계수는 32.11㎶/℃로 측정되었다. 추출된 샘플의 다이어프램 두께오차는 27±2.5㎛였다. 센서부 특성평가 결과를 통하여 신호처리회로의 옵셋 및 스팬보상, 온도보상을 위한 트리밍 공정을 수행한 결과 개발사양을 만족하는 결과를 얻을 수 있었다.

An Implementation of Temperature Independent Bias Scheme in Voltage Detector (온도에 무관한 전압검출기의 바이어스 구현)

  • Moon, Jong-Kyu;Kim, Duk-Gyoo
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.39 no.6
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    • pp.34-42
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    • 2002
  • In this paper, we propose a temperature independent the detective voltage source in voltage detector. The value of a detective voltage source is designed to become m times of silicon bandgap voltage at zero absolute temperature. By properly choosing the temperature coefficient of diode, the temperature coefficient of a concave voltage nonlinearities generated by the ${\Delta}V_{BE}$ section of diode between base and emitter of transistors with a different area can be summed with convex nonlinearities the $V_{BE}$ voltage to achieve the near zero temperature coefficient of the detective voltage source. We designed that the value of a detective voltage can be varied by ${\Delta}V_{BE}$, the $V_{BE}$multiplier circuit and resistor. In order to verify the performance of a proposed detective voltage source, we manufactured the voltage detector IC for 1.9V which is fabricated in $6{\mu}m$ Bipolar technology and measured the operating characteristics, the temperature coefficient of a detective voltage. To reduce the deviation of a detective voltage in the IC process step, we introduced a trimming technology, ion implantation and an isotropic etching. In manufactured IC, the detective voltage source could achieve the stable temperature coefficient of 29ppm/$^{\circ}C$ over the temperature range of -30$^{\circ}C$ to 70$^{\circ}C$. The current consumption of a voltage detector constituted by the proposed detective voltage source is $10{\mu}A$ from 1.9V-supply voltage at room temperature.

Thermal Characteristics of Microheater for Gas Sensors (가스센서용 마이크로 히터의 발열특성)

  • Choi, Woo-Chang;Choi, Hyek-Hwan;Kwon, Tae-Ha;Lee, Myong-Kyo
    • Journal of Sensor Science and Technology
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    • v.7 no.5
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    • pp.356-363
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    • 1998
  • Using the results analyzed by FEM(Finite Element Method). the microheaters with the stress-balanced $Si_3N_4$(150 nm)/$SiO_2$(300 nm)/$Si_3N_4$(150 nm) diaphragms were fabricated by silicon micromachining techniques. Pt was used as microheater materials. Pt temperature sensor was fabricated to measure the temperature of microheaters. Resistance of temperature sensor and power dissipation of microheater were measured and calculated at the various temperatures. The thermal distribution of heater was examined by a IR thermoviewer. Measured and simulated results are compared and analyzed. The temperature coefficient of resistance of heater was about $0.00379/^{\circ}C$. Pt heater showed the power dissipation of about 51 mW at $300^{\circ}C$ and a uniform thermal distribution on the surface.

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A Temperature-Compensated Hygrometer Using Resistive Humidity Sensors (전기 저항식 습도 센서를 이용한 온도 보상된 습도계 설계)

  • Chung, Won-Sup
    • Journal of the Institute of Electronics Engineers of Korea SC
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    • v.43 no.6 s.312
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    • pp.27-32
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    • 2006
  • A temperature-compensated hygrometer has been developed using resistive humidity sensors. It consist of a sine wave generator, logarithm converters, rectifiers, and amplifiers. The hygrometer accomplishes the linearization and temperature compensation of sensor characteristics. The theory of operation is presented and experimental results are used to verify theoretical predictions. The experimental results show that the conversion sensitivity of the hygrometer is about 24.8 mV/%RH and the linearity error of the conversion characteristic is less than 17.2 % over a relative humidity range from 30 to 80 %RH. The results also show that the temperature coefficient of the output voltage is less than $10149ppm/^{\circ}C$ over a temperature range from 22 to $40^{\circ}C$.

A Study on Development of Electric Safety Control Apparatus by Using Thermal Characteristics of PTC Thermistor (PTC 서미스터의 온도특성을 이용한 전기안전 제어장치 개발에 관한 연구)

  • Kwak, Dong-Kurl;Jung, Do-Young
    • Fire Science and Engineering
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    • v.21 no.4
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    • pp.65-71
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    • 2007
  • This paper is studied on a protective control system for electrical fire and electrical faults by using electrical and thermal characteristics of PTC thermistor. The PTC thermistor has characteristic or positive resistivity temperature coefficient according to the temperature variation, which is construction of a regular square and cube demarcation with $BaTiO_3$ Ceramics of positive temperature coefficient. Also PTC thermistor shows the phenomenon which is rapidly increased in the resistivity if the temperature is increased over Curie temperature point. This paper is proposed on a protective control system used PTC thermistor which is protected from electrical fire due to electric short circuit faults or overload faults. Some experimental results of the proposed electric safety control apparatus are confirmed to the validity of the analytical results.

A Study on the Reistivity and Temperature Coefficient of Resistivity of Stacked $TaN_x$/Cr Cermet Thin Film ($TaN_x$/Cr Cermet 적층 박막의 비저항 및 저항온도계수에 관한 연구)

  • 허명수;천희곤;인건환;권식철;조동율
    • Journal of the Korean Vacuum Society
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    • v.3 no.2
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    • pp.190-197
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    • 1994
  • 본 연구에서는 DC magnetron 스퍼터링법을 이용하여 고정밀, 고저항 저항체 박막으로 TaNx film을 제조하였을 때 형성될 수 있는 화합물 중 TaN0.1, TaN0.8과 TaN 박막의 Rs와 TCR특성을 평가하 고 film층의 우선방향성을 XRD를 이용하여 판명한 뒤 저항체의 Rs와 TCR에 미치는 영향을 조사하였 다. TaN0.1 박막이 35$\Omega$/$\square$의 면저항값과 안정된 TCR값을 나타내는 것을 알수 있었다. 두께50~200nm 의 TaN0.1과 Alumina 기판 사이에 정(+)의 TCR을 갖는 약 50nm의 Cr층을 증착하였을 때 Rs는 180$\Omega$/ $\square$ 과 TCR는 20ppm/$^{\circ}C$인 적층박막을 제조할 수 있었다. TaN0.1, TaN0.8 과 TaN 시편에서 화합물 형성 에 따른 Ta의 결합에너지를 ESCA를 이용하여 조사하였다. 이상의 연구결과로부터 TaN0.1 film이 TaNfilm 보다 고정밀, 고저항 박막 저항체 제조에 있어 우수한 전기저항 특성을 가지며 Cr 중간층 형성 으로 TCR이 $\pm$ppm/$^{\circ}C$정도로 안정된 고정밀 다층 저항체 박막을 형성할 수 있었다.

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Development on Electrical Fire Prevention System of Small Size and High Speed by using PTC Thermistor (PTC 서미스터를 이용한 소형 고속응성의 전기화재 방재시스템 개발)

  • Kwak, Dong-Kurl
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.51-58
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    • 2008
  • This paper is studied on a prevention system for electrical fire and electrical faults by using electrical temperature characteristic of PTC thermistor. The PTC thermistor has characteristic of positive resistivity temperature coefficient according to the temperature variation, which is construction of a regular square and cube demarcation with $BaTiO_3$ ceramics of positive temperature coefficient. Also PTC shows the phenomenon which is rapidly increased in the resistivity if the temperature is increased over Curie temperature point. This paper is proposed on a protective control system used with temperature sensor of PTC thermistor. The proposed prevention system will prevent electrical fires due to electric short circuit faults or overload faults. And the prevention system will solve the problems that circuit breakers to be commonly used at existing are happened frequently electrical fires and electrical disasters due to incapable operation, weak reliability and low speed response. Some experimental results of the proposed apparatus are confirmed to the validity of the analytical results.

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Preparation of precision thin film resistor sputtered by magnetron (IC용 초정밀 박막저항소자의 제조와 특성연구)

  • 하홍주;장두진;조정수;박정후
    • Electrical & Electronic Materials
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    • v.8 no.1
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    • pp.13-20
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    • 1995
  • To develope a high precision TiAIN thin film resistor, TiAIN films were deposited on A1$_{2}$03 substrates by reactive planar magnetron cosputtering from Ti and Al targets in an Ar-N$_{2}$ atmosphere. The characteristics of the TiAIN thin film were controlled by changing of the R.F. power on Ti and Al targets, and the N$_{2}$ partial pressure. The high precision TiAIN thin film resistor with TCR(Temperature Coefficient of Resistance) of less than 10ppm/.deg. C was obtained under the R.F. power condition of 160(w)/240(w) to Ti and Al targets at the N$_{2}$ partial pressure of 7*10$^{-5}$ Torr. The composition of these films were investigated by XRD, SEM and EDS.

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Adhesion and Agglomeration Phenomena of Pt Film of Resistance Heat Source (저항열원체 Pt 박막의 밀착력과 응집화 현상)

  • Lee, Jae-Seok;Park, Hyo-Deok;Sin, Sang-Mo;Park, Jong-Wan
    • Korean Journal of Materials Research
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    • v.6 no.2
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    • pp.204-209
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    • 1996
  • 각종 전자부품에 이용되는 백금막의 밀착력과 응집화 현상에 대해 연구하였다. 온도저항계수(TCR)의 열화 없이 밀착력을 향상 시키기 위해서 AI, Si의 산화물을 adhesion promoting layer로 이용한 결과 매우 우수한 밀착력과 TCR을 보였다. 질소분위기 600-90$0^{\circ}C$의 온도범위에서 행한 열처리를 통해 응집화현상을 관찰한 결과 응집화는 기판거칠기에 따라 다른 양상을 보였다. Si3N4등의 기판거칠기가 작은 adhesion promoting layer를 이용한 시편의 경우 고온인 90$0^{\circ}C$에서 응집화 현상이 발생되었다. 표면거칠기가 큰 AI-Si 산화물을 adhesion promoting layer로 이용한 시편의 경우 비교적 저온인 $600^{\circ}C$에서 응집화 현상이 발생했으며 80$0^{\circ}C$이상의 열처리의 경우 중앙응집체와 응집체고갈지역이 형성되는 현상을 나타내었다.

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