• Transactions of the Korean Society of Automotive Engineers
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• v.14 no.2
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• pp.67-75
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• 2006

In this paper, the compensation of ultrasonic scattering on interface crack depending on thickness variations of A1/Epoxy bonded dissimilar components was applied to improve measuring accuracy by using ultrasonic attenuation coefficient. The optimum conditions of theoretical value and experimental measuring accuracy by the ultrasonic method in A1/Epoxy bonded dissimilar components have been investigated. From the experimental results, the measurement method of interfacial crack lengths by using ultrasonic attenuation coefficient was proposed and discussed. After the ultrasonic scattering compensation depending on thickness variations of bonded dissimilar components was carried out, the measuring accuracy of interfacial crack length was improved by 5%.

• Journal of Welding and Joining
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• v.20 no.5
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• pp.99-105
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• 2002

One of the important advantage of adhesive bonded joint can combine the different materials. The joint that bonded by structural adhesive bond must keep a large force and its strength is affected by some environmental factors such as temperature and submergence time in water. In order to advance the fatigue strength of adhesive bonded joint, mostly put a surface treatment on the surface. This study was researched the effect of air temperature, submergence time, submergence temperature and surface treatment on the fatigue strength. We found that submergence temperature has the most effect and low plasma treatment specimens have the most fatigue strength.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.91-93
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• 2005

Forming sheet metal by laser-induced thermal stresses (laser forming) has been extensively studied, and the research has focused on two-dimensional geometries using a multi-pass straight line scan. Recently there came out some useful studies or three-dimensional laser forming which is applied to doubly curved shapes. The task of 3D laser forming sheet metal is to determine a set of process parameters such as laser scanning paths, laser power and scanning speed that will make a given shape. New method for laser forming of a doubly curved surface by using geometrical information was proposed and verified by experiments. This method shows good performance in the sense of calculation time and accuracy compared to the inherent strain method.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.25-30
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• 2004

In this paper, the compensation of interfacial scatter due to adhesive layer and adherend thickness ratio variation was applied to improve measuring precision by calculating ultrasonic attenuation coefficient in the Al/Epoxy dissimilar bonded components. The optimum condition of theoretical value and experimental measuring accuracy by the ultrasonic method in the Al/Epoxy dissimilar bonded components have been investigated. From the experimental results, we proposed a measurement method of the interfacial crack lengths by the ultrasonic attenuation coefficient and discussed it.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.62-62
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• 2010

PVC(Polyvinyl Chloride)와 HDPE(High-density Polyethlene) 하수도관은 수많은 고분자 재료 중에도 높은 기계적 강도를 가지며, 광범위하게 사용되고 있다. 하지만, PVC와 HDPE 하수관을 연결하기 위해 소모 접착제나 고무링 이용한 소켓 방법 이음 방법은 낮은 수밀성과 기계적 강도로 오 폐수의 누수가 발생되고, 이것이 흙에 스며들어 지하수, 하천 및 토양을 오염시키고 있다. 따라서, 대안으로 최근에는 열판을 이용한 맞대기 융착 용접을 PE 하수도 관에 제한적으로 적용하여 시공하고 있다. 그러나, PVC 하수관은 열을 가할 시 열에 의한 민감한 거동으로 인해 맞대기 융착 용접법이 적용되지 못하고 있는 실정이다. 따라서 본 연구에서는 하수도 관 중, 국내에서 가장 많이 사용되고 있는 내 충격 PVC 하수도관과 HDPE 이중 벽관의 DSC(Diffential Scanning Calorimeter), TGA(Thermogravimetric analyzer), TMA(Thermomechanical Analysis), DMA(Dynamic Mechanical Analysis) 분석으로 온도에 따른 열적 거동을 분석하여, 적절한 융착 온도 조건을 제시하였다. 또한 접합강도 향상을 위한 이음부 설계를 제안하여, 융착 용접 특성을 평가하였다.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Composites Research
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• v.30 no.3
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• pp.215-222
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• 2017

The effect of a multi walled carbon nanotubes (MWNCT) on the adhesive properties and thermal properties of epoxy were studied by double lap-shear tests. Epoxy/MWCNT resins were prepared from a different amount of the MWCNT incorporated into the epoxy resins (araldite 2011). Steel plates and carbon fiber reinforced plastics (CFRP) were chosen as materials. Mechanical tests were performed by a universal testing machine (UTM). The analysis of thermal properties were conducted by a thermogravimetric analyzer (TGA) and a differential scanning calorimetry (DSC). The fracture surface morphology was examined using a scanning electron microscopy (SEM) and optical microscope. Compared to neat epoxy, it was found that the mechanical properties of epoxy/MWCNT resins are increased.

• Journal of the Korean Magnetics Society
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• v.21 no.2
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• pp.52-55
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• 2011

Spin-transfer torque is a useful tool to control the magnetic state in nanostructures. In magnetic tunnel junctions, the spin-transfer torque has two components, the in-plane spin torque and the perpendicular spin torque. While properties of the in-plane spin-transfer torque are relatively well understood, properties of the perpendicular spin-transfer torque still remain controversial. A recent experiment demonstrated that in asymmetric magnetic tunnel junctions, the bias voltage dependence of the perpendicular spin-transfer torque contains both linear and quadratic terms in the bias. However it still remains unexplored how the bias voltage dependence changes as a function of material parameters. In this paper, we systematically investigate the perpendicular spin-transfer torque in asymmetric magnetic tunnel junction by varying spin splitting energy, work function difference, and Fermi energy of the ferromagnetic metal leads.

• Journal of the Korean Institute of Telematics and Electronics
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• v.7 no.2
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• pp.33-42
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• 1970

This report is concerned with the fahrication with the falricationof silicon VVC diode by the double diffusion planer technique. At first, some design charts for VVC diode were derived by considering the voltage-capacitance relations, the critical field intensity at the metallurgical junction, and the cut-off frequency of the diode. These charts enables the fabrication engineers to design VVC diode easily without going into the sophisticated design theory. We started with a 2.5 ohm-cm n-type epitaxial silicon wafer. The phosphorous was diffused by POCl3 impurity source. Then boron diffusion followed make hyperabrupt p-n junction by BN source. The maximum to minimum capacitance ratio of the diode as a tuning diode for a TV tuner made in these experiments was 4:1. Measured electrical characteristics of the sample diodes showed in good agreement with the theoretical expectations. Slicing and polishing technique of the silicon wafer and diffusion technique of the impurity atoms, which were employed in our study, are also stated briefly in this report.

• Journal of the Korean Vacuum Society
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• v.19 no.2
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• pp.134-140
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• 2010

We have investigated the contactless electroreflectance (CER) properties of $In_{0.5}(Ga_{1-x}Al_x)_{0.5}P$/GaAs double heterostructures grown by metal-organic chemical vapour deposition (MOCVD). The CER measurements on the sample were studied as a function of temperature, modulation voltage ($V_{ac}$), and dc bias voltage ($V_{bias}$). Five signals observed at room temperature are related to the GaAs, $In_{0.5}Ga_{0.5}P$, $In_{0.5}(Ga_{0.73}Al_{0.27})_{0.5}P$, $In_{0.5}(Ga_{0.5}Al_{0.5})_{0.5}P$, and $In_{0.5}(Ga_{0.2}Al_{0.8})_{0.5}P$ transitions, respectively. From the temperature dependence of CER spectrum, the Varshni coefficients and broadening parameters were determined and discussed. In addition, we found that the behavior of the CER amplitude for the reverse bias is larger than that of the forward.