• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1885-1888
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• 2003

As high technology industries such as IT and display have developed, demand for application parts of micro lens and lens array has been extremely increasing. According to these trends, many researchers are studying on the fabrication technology for parts of the micro lens by a variety of methods such as MEMS, Lithography, LIGA and so on. In this paper, we have performed researches related to ultra precision micro lens, lens array mold and fabrication of Lenticular lens mold for three-dimensional display by using mechanical micro end-milling and fly-cutting fabrication method. Tools used in this research were a diamond tool of R 150$\mu\textrm{m}$. Cutting conditions set up feed rate, spindle revolution. depth of cut and dwell time as variables. And we analyzed surface quality variation of the processed products according to the cutting conditions, and then carried out experiments to search the optimum conditions. Through this research, we have confirmed that we can fabricate the ultra precision micro lens mold with surface roughness Ra=20nm and the holographic lens mold by using micro end-milling and fly-cutting fabrication method. Furthermore, we demonstrated problems happened in the fabrication of the micro lens and established the foundation of experimental study for formulating its improvement plan.

• Transactions of Materials Processing
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• v.14 no.3 s.75
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• pp.245-250
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• 2005

Recently, micro machining technology for high precision mold becomes more interested for mass production of high performance optical parts micro-grooved on the surface, which is under very active development due to its effectiveness in the view point of optical performance. Mechanical micro machining technology now has more competitiveness on lithography, MEMS or LIGA processes which have some problems to fabricate especially cylinder type of groove in such as lenticular lens for illumination angle modulation system. In this study. a lenticular lens mold with U-type micro groove is fabricated making utilizing of the benefit of the mechanical micro machining technology. A shaping machining process is adapted using 3 axis degree of freedom micro machining system and single crystal natural diamond tool. A brass and a electroless nickel materials are used for mold fabrication. Machining force, chip shape and machined surface are investigated from the experiment and an optimal machining condition is found based on the examined problems from the micro cutting process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.9 s.240
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• pp.1169-1174
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• 2005

Imprint lithography is a promising method for high-resolution and high-throughput lithography using low-cost equipment. In particular, ultraviolet-nanoimprint lithography (UV-NIL) is applicable to large area imprint easily. We have proposed a new UV-NIL process using an elementwise patterned stamp (EPS), which consists of a number of elements, each of which is separated by channel. Experiments on UV-NIL are performed on an EVG620-NIL using the EPS with 3mm channel width. The replication of uniform sub 70 nm lines using the EPS is demonstrated. We investigate the nonuniformity of residual layer caused by wafer deformation in experiment with varying wafer thickness. Severely deformed wafer works as an obstacle in spreading of dropped resin, which causes nonuniformity of thickness of residual layer. Numerical simulations are conducted to analyze aforementioned phenomenon. Wafer deformation in the process is simulated by using a simplified model, which is a good agreement with experiments.

• Journal of Sensor Science and Technology
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• v.16 no.5
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• pp.377-383
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• 2007

We describe the fabrication and characterization of a doubly clamped multi-walled carbon nanotube (MWNT). The device was assembled by an application of electric field in solution. The MWNT was clamped on end of metal trench electrodes in solution and deposited with additional platinum (Pt) on edge of electrode for firmly suspending the MWNT by focused ion beam (FIB). The MWNTs range of diameter and length were 100 to 150 nm and 1.5 to $2{\mu}m$, respectively. Electrical characteristics of fabricated devices were measured by I-V curve and impedance analysis. The mechanical deformation was observed by resistivity in high air pressure. Resonant frequency around 6.8 MHz was detected and resistivity was linearly varied according to the magnitude of air pressure. This device could have potential applications in nanoelectronics and various sensors.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2002.02a
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• pp.231-238
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• 2002

미세 절삭에 의한 마이크로 형상가공 및 이를 이용한 미세금형 가공기술개발을 위하여 절삭 공구를 이용한 기계적 미세 가공법에 대한 고찰과 더불어 shaping, end-milling, drilling 등의 가공이 가능한 기계적 미세 가공시스템을 구성하고 이를 이용한 미세 치형 그루브와 미세 격벽 등 미세 형상 구조의 금형 개발을 위한 가공실험을 수행하였다. 본 실험에서는 먼저 shaping 방식으로 세 종류의 다이아몬드 바이트를 사용하여 알루미늄, PMMA, Nickel, 황동 등의 소재에 pitch $150{\mu}m$, 높이 $8{\mu}m$ 내외의 미세 치형의 금형 코어를 가공하였고, 다음으로 Z축에 air spindle을 설치하여 $\phi0.2mm$의 end-mill(WC)을 사용하여 황동 소재에 깊이 $200{\mu}m$, 폭 $200{\mu}m,\;100{\mu}m,\;50{\mu}m,\;30{\mu}m$의 두께 변화를 주어 미세 격벽에 대한 가공실험을 하였다. 미세 구멍가공실험으로는 drilling 전용장비를 구성하여 $\phi0.6\~0.15mm$의 drill공구로 SM45C와 세라믹$(Si_3N_4-BN)$ 소재에 스텝이송방식에 의한 미세 구멍 가공 실험을 실시하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.595-596
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• 2006

The flexible organic thin film transistor (OTFT) array to use as a switching device for an organic light emitting diode (OLED) was designed and fabricated in the microcontact printing and low-temperature processes. The gate, source, and drain electrode patterns of OTFT were fabricated by microcontact printing which is high-resolution lithography technology using polydimethylsiloxane(PDMS) stamp. The OTFT array with dielectric layer and organic active semiconductor layers formed at room temperature or at a temperature tower than $40^{\circ}C$. The microcontact printing process using SAM(self-assembled monolayer) and PDMS stamp made it possible to fabricate OTFT arrays with channel lengths down to even nano size, and reduced the procedure by 10 steps compared with photolithography. Since the process was done in low temperature, there was no pattern transformation and bending problem appeared. It was possible to increase close packing of molecules by SAM, to improve electric field mobility, to decrease contact resistance, and to reduce threshold voltage by using a big dielecric.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.155-156
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• 2006

UV-NIL is a promising technology for the fabrication of sub-100 nm features. Due to non-uniformity of the residual layer thickness (RLT) and a strong possibility of defects, many UV-NIL processes have been developed and some are commercially available at present, most are based on the 'step-and-repeat' nanoimprint technique, which employs a small-area stamp, much smaller than the substrate. This is mainly because, when a large-area stamp is used, it is difficult to obtain acceptable uniform residual layer thickness and/or to avoid defects such as air entrapment. As an attempt to enable UV_NIL with a large-area stamp for high throughput, we propose a new UV-NIL tool that is able to imprint 4 inch wafer in a low vacuum environment at a single step.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.145-146
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• 2006

A fluorine-doped diamond-like carbon (F-DLC) stamp which has high contact angle, high UV-transmittance and sufficient hardness, was fabricated using the following direct etching method: F-DLC is deposited on a quartz substrate using DC and RF magnetron sputtering, PMMA is spin coated and patterned using e-beam lithography and finally, O2 plasma etching is performed to transfer the line patterns having 100 nm line width, 100 nm line space and 70 nm line depth on F-DLC. The optimum fluorine concentration was determined after performing several pre-experiments. The stamp was applied successfully to UV-NIL without being coated with an anti-adhesion layer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.19-20
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• 2006

As the Mobile and Display technology are being developed quickly, new wireless devices are released in great numbers. They reduce existing devices' life time and demand a reduction of developing period of portable devices. With these demands, existing film cutting mold used many films of portable devices, especially LCD Display, needs to be more precise, and cheaper. In this research, we have analyzed machining characteristics of cutter shapes, materials, and cutting conditions for application to other films. Cutter edge was machined by slot cutting method and CAD program to select the cutter shape and cutter angle. Also, we have determined the optimal cutting conditions using high speed machining experiments to improve the productivity.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.11a
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• pp.249-254
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• 2004

광의 효율적 사용을 위해 표면에 마이크로 그루브가 새겨진 고성능 광학 부품의 개발이 활발하고, 이들 부품의 다량 생산을 위한 초정밀 금형제조기술이 각광을 받고 있다. 최근의 초정밀 미세 기계가공의 경우 간단한 공정으로 이러한 마이크로 그루브 금형을 제작할 수 있다. 특히 조명각 변조용 렌티큘러 렌즈와 같이 실린더형 그루브 금형의 경우에는 기존의 Lithography, MEMS, LIGA 등 광 에너지를 이용한 다른 제조방법들에서는 가공하기 어려운 점이 있으나, 기계가공에서는 쉽게 제작가능한 장점이 있다. 본 연구에서는 이러한 미세기계가공기술의 장점을 활용하여 U 형 마이크로 그루브를 가진 Lenticular 렌즈용 금형을 가공하고자 하였다. 가공에는 3 축 구동의 초정밀 미세 복합가공기와 단결정 천연 다이아몬드공구가 사용되었고, 가공방식은 마이크로 세이핑 공정을 적용하였으며, 가공 금형 재료에는 Brass와 무전해 Nickel이 사용되었다. 실험을 통하여 금형가공시의 절삭력, 칩 형상, 가공표면 등의 분석이 수행되었으며 이를 기반으로 여러 가지 가공문제점을 해결하고, 최종적으로 양호한 렌티큘러렌즈용 금형을 가공하였다.