• Title/Summary/Keyword: 유연필름

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Effect of Acrylic Acid on the Physical Properties of UV-cured Coating Films for Metal Coating (금속코팅용 광경화 코팅필름의 물성에 대한 아크릴산(Acrylic acid)의 영향)

  • Seo, Jong-Chul;Choi, Jun-Suk;Jang, Eui-Sung;Seo, Kwang-Won;Han, Hak-Soo
    • Korean Chemical Engineering Research
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    • v.49 no.1
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    • pp.75-82
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    • 2011
  • Five different composition UV-cured poly(urethane acrylate-co-acrylic acid) (PU-co-AA) films have been prepared by reacting isophorone diisocyanate(IPDI), polycaprolactone triol(PCLT), 2-hydroxyethyl acrylate(HEA), and different weight ratio trimethylolpropane triacrylate(TMPTA) and acrylic acid(AA) as diluents, and characterized using a Fourier transform infrared spectroscopy(FT-IR). The adhesion properties onto the stainless steel, morphology, mechanical hardness, and electrical property of UV-cured PU-co-AA films were investigated as a function of acrylic acid(AA) content. All the PU-co-AA films are structure-less and the molecular ordering and packing density decreased with increasing content of AA due to the flexible structure and -COOH side chains in AA. The crosscut test showed that PU-co-AA films without AA and with low content of AA showed 0% adhesion(0B) and the adhesion of PU-co-AA films in the range of 40-50% AA increased dramatically as the content of AA increases. The pull-off measurements showed that the adhesion force of PU-co-AA films to stainless steel substrate varied from 6 to 31 kgf /$cm^2$ and increased linearly with increasing AA content. The mechanical hardness also decreased as the content of AA increases. This may come from relatively linear and flexible structure in AA and low crystallinity in PU-co-AA films with higher content of AA. The higher AA-containing PU-co-AA films showed higher dielectric constant due to the increase of polarization by introducing AA monomer. In conclusion, the physical properties of UV-cured PU-co-AA films are strongly dependent upon the content of AA and the incorporation of AA in polyurethane acrylate is very useful way to increase the adhesion strength of UV-curable polymers on the stainless steel substrate.

The Electroresponse Properties of Alginate Films under the Electric Field (알지네이트 필름의 전기장 하에서의 응답 특성)

  • 김인중;강휘원;정창남
    • Polymer(Korea)
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    • v.27 no.3
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    • pp.195-200
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    • 2003
  • Alginate is a natural ionic polymer including numerous anionic groups and can be actuated by the ionic group under the electric field. The crosslinked alginate films were fabricated with CaCl$_2$. The thermal, mechanical and electroresponse properties of the films were investigated by thermogravimetric analysis, tensile and bending tests. The initial degradation and tensile strength increased according to the degree of crosslinking. Also, the swelling ratio of the films increased with decreasing degree of crosslinking and increasing pH due to free volume and electrostatic repulsion. The films actuated by an electric stimulus exhibited gentle and flexible action like a pendulum. In the electric field, the electric stimuli such as the applied voltage, ionic strength and kind of electrolyte solution had an effect on the electroresponse of the films. Alginate films with 5 wt% crosslinking agent showed the highest bending angle and reversible bending behavior. When the ionic strength of NaCl and KCl electrolyte solution was 0.1 M, the films showed the highest electroresponse. The bending behavior of the films increased with the applied voltage.

A Study on the Characteristic Analysis and Manufacture of Electrostatic Dissipation PU Foaming Film (정전방전 PU 발포필름의 제조와 특성분석)

  • Kim, Seung-Jin;Park, Jun-Hyeong;Choi, La-Hee;Park, Mi-Ra;Ma, Hye-Young;Kwon, Oh-Kyung
    • Proceedings of the Korean Society of Dyers and Finishers Conference
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    • 2011.03a
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    • pp.58-58
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    • 2011
  • CNT 나노기술을 응용한 IT산업용 적층간지용 ESD(정전방전, Electrostatic Dissipation)PU 발포필름의 제조 가공기술 및 상품화 개발은 전자제품 패키지에 요구되는 쿠션성과 정전방전 기능을 갖는 폴리우레탄 발포 필름의 제조기술을 확립함으로써 가능 할 수 있다. 특히 IT산업용 필름제품이 개발되면 ESD 성능을 발휘하게 됨으로서 정전기 쇼크에 의한 각종 전자제품의 오작동이나 파손 방지가 가능하게 되어 포장재, 자동차, 전자제품의 하우징 등으로 사용될 수 있게 된다. 현재까지 ESD 기능을 부여하기 위해서 사용되는 충전재로는 금속섬유, 금속플레이크, 탄소섬유, 카본블랙 등이 있으며, 최근 탄소나노튜브를 응용한 연구가 많이 진행되고 있는데 탄소나노튜브는 직경이 수십nm, 종횡비 1000이상의 나노섬유형태로 서 전기전도성이 구리수준으로 알려져 있고 소량을 충전할 시 기계적 특성도 오히려 증대하는 장점을 가지고 있으며 전기적 특성으로는 상대적으로 낮은 나노튜브 함량에서는 ESD를 들 수 있고 높은 함량에서는 전자파 차폐성까지 기대되고 있다. 본 연구에서는 우수한 인장강도, 기계적 강도, 열적 안정성, 내약품성을 가지면서 습식 또는 용융공정을 통해 용이하게 시트, 필름, 코팅제를 제조할 수 있는 방수, 투습방수성을 가지는 유연재료인 폴리우레탄(PU) 1액형 PU에 MWNT 함량이 3wt%인 IPA/MWNT 분산용액을 PU 함량 대비 20, 30, 40파트로 함유시켜 $120^{\circ}C$에서 2분 건조시켜 제조한 그라운드 필름에 2액형 PU와 IPA/MWNT 분산용액에 발포제를 첨가하여 발포온도 140, 150, $160^{\circ}C$에서 5분간 건조시켜 시료 필름을 제조하였다. 제조된 필름의 전기전도성 측정은 부피저항과, 표면저항을 각각 측정하여 확인하였으며, 필름의 마찰 대전압은 E.S.T-7 마찰 대전압 시험기를 이용하여 표면 마찰 대전압과 반감기를 측정하여 확인하고, 필름의 물리적 특성은 인장시험기를 이용하여 breaking stress, breaking strain을 구하였다. 필름의 표면 특성은 영상 현미경 시스템을 사용하여 ${\times}1000$ 배율로 측정하여 분산특성과의 연관성을 확인하였다.

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Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates (유연 기판 위 적층 필름의 굽힘 탄성계수 측정)

  • Lee, Tae-Ik;Kim, Cheolgyu;Kim, Min Sung;Kim, Taek-Soo
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.3
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    • pp.63-67
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    • 2016
  • In this paper, we present an indirect method of elastic modulus measurement for various lamination layers formed on polymer-based compliant substrates. Although the elastic modulus of every component is crucial for mechanically reliable microelectronic devices, it is difficult to accurately measure the film properties because the lamination layers are hardly detached from the substrate. In order to resolve the problem, 3-point bending test is conducted with a film-substrate specimen and area transformation rule is applied to the cross-sectional area of the film region. With known substrate modulus, a modulus ratio between the film and the substrate is calculated using bending stiffness of the multilayered specimen obtained from the 3-point bending test. This method is verified using electroplated copper specimens with two types of film-substrate structure; double-sided film and single sided film. Also, common dielectric layers, prepreg (PPG) and dry film solder resist (DF SR), are measured with the double-sided specimen type. The results of copper (110.3 GPa), PPG (22.3 GPa), DF SR (5.0 GPa) were measured with high precision.

Synthesis and Characterization of 4-Component Polyimide Films with Various Diamine and Dianhydride Compositions (다양한 조성 변화에 따른 4성분계 폴리이미드 필름 제조와 물성분석)

  • Park, Yun Jun;Yu, Duk Man;Choi, Jong Ho;Ahn, Jeong-Ho;Hong, Young Taik
    • Applied Chemistry for Engineering
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    • v.22 no.6
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    • pp.623-626
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    • 2011
  • Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

Stress Analysis for Bendable Electronic Module Under Thermal-Hygroscopic Complex Loads (열·습도 복합하중에서의 유연성 전자모듈에 대한 구조해석)

  • Han, Changwoon;Oh, Chulmin;Hong, Wonsik
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.37 no.5
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    • pp.619-624
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    • 2013
  • A bendable electronic module is developed. In this module, thin silicon electronic chips are embedded in a polymer-based encapsulating adhesive between flexible copper-clad polyimide layers. During the qualification test of a harshly thermal-hygroscopic complex loading condition, delaminations occur inside the module layers. A finite element model is developed for the module. To investigate the effect of hygroscopic stress on delamination, the results of the thermal and thermal-hygroscopic loads are compared. The analysis results reveal that the hygroscopic effect more strongly affects delamination than does the thermal effect. The potential failure mechanisms of the module are investigated based on the stress analysis.

Mechanical and Electrical Failure of ITO Film with Different Shape during Twisting Deformation (비틀림 변형 중 ITO 필름의 시편 형태에 따른 기계적 전기적 파괴 연구)

  • Kwon, Y.Y.;Kim, Byoung-Joon
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.4
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    • pp.53-57
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    • 2017
  • The most representative transparent electrode in the modern society is ITO (Indium Tin Oxide). ITO is widely used in general for touch panels and displays due to its high electrical and optical properties. However, in general, mechanical deformation causes deterioration and destruction of device properties because ITO is basically vulnerable to mechanical deformation. Therefore, the in-depth understanding on the stability of ITO film during various mechanical deformations is necessary. In this study, the reliability and mechanical properties ITO sample having different length, width, and area were investigated. The electrical stability was estimated according to electrical resistance change. The stability was dropped as the sample length, and width increased and the sample area decreased. The electrical stability of ITO film was correlated with twisting strain including tensile, compressive and shear stress.

Structure Development of Solvent Casting Triacetyl Cellulose Film (트리아세틸 셀룰로오스 필름의 용액가공에 의한 구조변화)

  • Kim, Hyo-Gap;Kim, Hong-Suk;Kim, Han-Sung;Cho, Jin-Sik;Kim, Yong-Won;Kang, Ho-Jong
    • Polymer(Korea)
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    • v.34 no.3
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    • pp.210-214
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    • 2010
  • The structural development of triacetyl cellulose (TAC) was studied as a function of solution casting processing parameters such as dope concentration, evaporation temperature, annealing temperature and the addition of plasticizer. The crystalline structure was developed by the solution casting and the level of crystallinity was increased with increasing dope concentration and evaporation temperature. The crystalline structure could be enhanced by the annealing process after formation of TAC film. Introducing plasticizer resulted in decreasing melting temperature and crytallinity of TAC film due to the increase of chain mobility. It was also found that thermal stability of TAC was improved due to the rigid structure of applied plasticizer.

나노카본를 이용한 기능성 필름 연구

  • Han, Jong-Hun;Sin, Gwon-U
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.110-110
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    • 2012
  • 탄소나노튜브와 그래핀 소재는 나노 스케일의 탄소를 대표하는 소재로서 전기적, 기계적인 특성이 뛰어나며, 화학적으로 안정하고, 환경 친화성을 가지고 있다. 탄소나노튜브의 경우 전기적으로 도체 및 반도체성을 가지고 있을 뿐만이 아니라 직경이 최소 1 nm 수준으로 종횡비 및 비표면적이 매우 큰 특성을 가지고 있어서 차세대 정보 전자소재, 고효율 에너지 소재, 고기능성 복합소재, 친환경 소재 등의 분야에서 많은 응용연구가 활발히 진행되고 있다. 그래핀의 경우 실리콘의 100배에 이르는 전하 이동도, 구리의 100배에 이르는 전류밀도를 가지며, 열전도도 및 내화학성이 뛰어나고 다양한 화학적 기능화가 가능할 뿐 아니라 뛰어난 유연성과 신축성을 보이면서 그래핀 자체의 물리화적 특성구명과 더불어 투명전극, 반도체, 에너지 전극, 구조체, 가스 베리어 등의 응용연구가 최근 활발히 진행되고 있다. 본 발표에서는 최근의 나노카본 기반의 투명전극 및 기체 차단 필름의 연구 개발동향 등에 대해 발표하고자 한다.

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Characteristics of Directional Squeeze Film Damper Using ER Fluid (ER유체를 이용한 이방성 스퀴즈필름 댐퍼의 특성)

  • 안영공;양보석;삼하신
    • Journal of KSNVE
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    • v.11 no.2
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    • pp.301-306
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    • 2001
  • Electro-Rheological (ER) fluid is applied to a controllable squeeze film damper (SFD) for stabilizing a flexibly supported rotor system. ER fluid is a class of functional fluid whose yield stress varies according to the applied electric field strength, which is observed as viscosity variation of the fluid. In applying ER fluid to a SFD, a pair of rings of the damper can be used as electrodes. When the electrodes are divided into a horizontal pair and a vertical one, the SFD can produce damping force in each direction independently. A prototype of the directionally controllable SFD was constructed and its performance was experimentally and numerically investigated in the present work.

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