• Title/Summary/Keyword: 유도결합 플라즈마

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A Study of The Etched ZnO Thin Film Surface using inductively coupled plasma system (유도결합 플라즈마를 이용하여 식각된 ZnO 박막 표면연구)

  • Woo, Jong-Chang;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.384-384
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    • 2010
  • The surface reaction characteristics of Zinc Oxide (ZnO) in $Cl_2/BCl_3$/Ar gas ratio using inductively coupled plasma system were investigated. It was found that ZnO etch rate shows a non-monotonic behavior with increasing both Ar fraction in $Cl_2/BCl_3$ plasma, RF power, and gas pressure. The maximum ZnO etch rate of 53 nm/min was obtained for $Cl_2$(3 sccm)/$BCl_3$(16 sccm) /Ar(4 sccm) gas mixture. The chemical state of etched surfaces was investigated with X-ray diffraction (XRD) and the etched surface was investigated to the rms by atomic force microscopy (AFM). From these data, the suggestions on the ZnO etch mechanism were made by secondary ion mass spectrometery (SIMS).

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Determination of Trace Elements in Animal Feed by Inductively Coupled Plasma-Mass Spectrometry (유도결합 플라즈마 질량분석기를 이용한 동물사료중의 극미량원소의 분석)

  • Park, Jeoung-Hwa;Kim, Hyo-Jin
    • YAKHAK HOEJI
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    • v.36 no.3
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    • pp.199-204
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    • 1992
  • The trace elements in animal feed were analyzed by Inductively Coupled Plasma Mass Spectrometer (ICP-MS, VG-PlasmaQuad Co.) to find possible sources of heavy metals accumulation in rat organ. The study about spectral interference was performed by analysis of a background spectrum of ICP-MS. Recovery test using standard of Cd and Se (100 ppb) was found to be better than 90%. Twenty elements (Ca, Fe, Mg, Ti, Cr, Ni, Cu, Zn, Ba, Al, Mn, Pb, B, Ce, Bi, U, V, Cd, and W)are determined.

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Effect of Inductively Coupled Plasma (ICP) Power on the Properties of Ultra Hard Nanocrystalline TiN Coatings (유도결합 플라즈마 파워변화에 따른 초경도 나노결정질 TiN 코팅막의 물성변화)

  • Chun, Sung-Yong
    • Journal of the Korean Ceramic Society
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    • v.50 no.3
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    • pp.212-217
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    • 2013
  • Ultra hard TiN coatings were fabricated by DC and ICP (inductively coupled plasma) magnetron sputtering techniques. The effects of ICP power, ranging from 0 to 300 W, on the coating microstructure, crystallographic, and mechanical properties were systematically investigated with FE-SEM, AFM, HR-XRD and nanoindentation. The results show that ICP power has a significant influence on the coating microstructure and mechanical properties of TiN coatings. With an increasing ICP power, the film microstructure evolves from an apparent columnar structure to a highly dense one. Grain sizes of TiN coatings decreased from 12.6 nm to 8.7 nm with an increase of the ICP power. A maximum nanohardness of 67.6 GPa was obtained for the coatings deposited at an ICP power of 300 W. The crystal structure and preferred orientation in the TiN coatings also varied with the ICP power, exerting an effective influence on film nanohardness.

A study on the etch characteristics of BST thin films using inductively coupled plasma (유도결합 플라즈마를 이용한 BST 박막의 식각 특성 연구)

  • Kim, Gwan-Ha;Kim, Kyoung-Tae;Kim, Chang-Il;Kim, Tae-Hyung;Lee, Chul-In
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.04b
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    • pp.22-25
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    • 2004
  • In this study, BST thin films were etched with inductively coupled $CF_4/(Cl_2+Ar)$ plasmas. The etch characteristics of BST thin films as a function of $CF_4/(Cl_2+Ar)$ gas mixtures were analyzed using quadrupole mass spectrometry (QMS) and optical emission spectroscopy (OES). The maximum etch rate of the BST thin films was 53.6 nm/min because small addition of $CF_4$ to the $Cl_2/Ar$ mixture increased chemical effect. The optimum condition appears to be under a 10 % $CF_4/(Cl_2+Ar)$ gas mixture in the present work.

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The Surface Damage of SBT Thin Film Etched in $Ar/CF_{4}/Cl_{2}$ Plasma ($Ar/CF_{4}/Cl_{2}$ 유도결합 플라즈마에 의한 SBT 박막의 표면 손상)

  • Kim, Dong-Pyo;Kim, Chang-Il;Lee, Cheol-In;Kim, Tae-Hyung;Lee, Won-Jae;Yu, Byung-Gon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.26-29
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    • 2001
  • $SrBi_2Ta_2O_{9}$ thin films were etched at high-density $Cl_2/CF_4/Ar$ in inductively coupled plasma system. The etching of SBT thin films in $Cl_2/CF_4/Ar$ were chemically assisted reactive ion etching. The maximum etch rate was 1300 $\AA$/min at 900W in $Cl_2(20)/CF_4(20)/Ar(80)$. As rf power increase, radicals (F, Cl) and ion(Ar) increase. The influence of plasma induced damage during etching process was investigated in terms of the surface morphology and th phase of X-ray diffraction. The chemical residue was investigated with secondary ion mass sperometry.

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Diagnostics of Inductively Coupled $BCl_3/Ar$ Plasma Characteristics Using Quadrupole Mass Spectrometer (사중극자 질량 분석기를 이용한 $BCl_3/Ar$ 유도결합 플라즈마 특성 진단)

  • Kim, Gwan-Ha;Kim, Chang-Il
    • The Transactions of the Korean Institute of Electrical Engineers C
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    • v.55 no.4
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    • pp.204-208
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    • 2006
  • In this study, we investigated the ion energy distributions in a chlorine based inductively coupled plasma by quadrupole mass spectrometer with an electrostatic ion energy analyzer. Ion energy distributions are presented for various plasma parameters such as $BCl_3/Ar$ gas mixing ratio, RF power, and process pressure. As the $BCl_3/Ar$ gas mixing ratio and process pressure decreases, and RF power increases, the saddle-shaped structures is enhanced. The reason is that there are ionized energy difference between $BCl_3$ and Ar, change of plasma potential, alteration of mean free path. and variety of ion collision in the sheath.

Global Simulation for $CF_4$ Discharge in Transformer Coupled Plasma Source (평판형 유도결합 플라즈마 장치의 $CF_4$ 방전에 대한 Global Simulation)

  • Kwon, Deuk-Chul;Yoo, D.H.;Kim, S.S.;Yoon, N.S.;Kim, J.H.;Shin, Y.H.
    • Proceedings of the KIEE Conference
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    • 2002.07c
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    • pp.1757-1759
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    • 2002
  • Global simulator for $CF_4$ discharge in transformer coupled plasma (TCP) source is developed and simulations arc performed under various conditions. The developed simulator is based on a set of space averaged fluid equations for electrons, positive ions, neutrals and radicals of $CF_4$ plasma. And the used absorbed power by electrons is calculated by a 2-dimensional heating model[1].

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Dry etching properties of SBT thin films using $Cl_2/Ar$ inductively coupled plasma ($Cl_2/Ar$ 유도결합 플라즈마를 이용한 SBT 박막의 건식 식각 특성)

  • Yeo, Ji-Won;Kim, Kyoung-Tae;Kim, Dong-Pyo;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07a
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    • pp.404-407
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    • 2003
  • Among the ferroeletric thin films that have been widely investigated for ferroelectric random access memory (FRAM) applications, the $SrBi_2Ta_2O_9$ (SBT) thin film is appropriate as a memory capacitor material due to its excellent fatigue endurance. SBT thin films were etched in high-density $Cl_2/Ar$ in inductively coupled plasma. The maximum etch rate of SBT film is $1834\;{\AA}/min$ under $Cl_2/(Cl_2+Ar)$ of 30 %, rf power of 700 W, dc-bias voltage of -250 V, chamber pressure of 11 mTorr and gas flow rate of 20 sccm.

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A Comparative Study of Superhard TiN Coatings Deposited by DC and Inductively Coupled Plasma Magnetron Sputtering (DC 스퍼터법과 유도결합 플라즈마 마그네트론 스퍼터법으로 증착된 수퍼하드 TiN 코팅막의 물성 비교연구)

  • Chun, Sung-Yong
    • Journal of the Korean institute of surface engineering
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    • v.46 no.2
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    • pp.55-60
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    • 2013
  • Superhard TiN coatings were fabricated by DC and ICP (inductively coupled plasma) assisted magnetron sputtering techniques. The effect of ICP power, ranging from 0 to 300 W, on coating microstructure, preferred orientation mechanical properties were systematically investigated with HR-XRD, SEM, AFM and nanoindentation. The results show that ICP power has a significant influence on coating microstructure and mechanical properties of TiN coatings. With the increasing of ICP power, coating microstructure evolves from the columnar structure of DC process to a highly dense one. Grain sizes of TiN coatings were decreased from 12.6 nm to 8.7 nm with increase of ICP power. The maximum nanohardness of 67.6 GPa was obtained for the coatings deposited at ICP power of 300 W. Preferred orientation in TiN coatings also vary with ICP power, exerting an effective influence on film nanohardness.