• Composites Research
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• v.13 no.6
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• pp.39-46
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• 2000

Electrical discharge machining (EDM) cuts metal by discharging electric current across a thin gap between tool and workpiece. Electrical discharge wire cutting, a special form of EDM, uses a continuously moving conductive wire as an electrode, and is widely used for the manufacture of punches, dies and stripper plates. In the wire cutting process, the moving wire is usually supported by cantilever arm and wire guides. As the wire traveling speed has been increased in recent years to improve productivity, the vibration of the cantilever arm occurs, which reduces the positional accuracy of the machine. Therefore, the design and manufacture of the cantilever arm with high dynamic characteristics have become important as the machining speed increases. In this paper, the cantilever arm for guiding the moving wire was designed and manufactured using carbon fiber epoxy composite in order to improve the static and dynamic characteristics. Specimens for the composite cantilever arm were manufactured and tested to investigate the effect of the number of reinforcing plies and length fitted to steel flange on the load capacity. Also, the finite element analysis using layer and contact elements was performed to compare the calculated results with the experimental ones. From the results, the prototype of the composite cantilever arm for the electrical discharge wire cutting machine was manufactured and the static and dynamic characteristics were compared with those of the conventional steel cantilever arm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.04a
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• pp.206-210
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• 1992

본 연구는 ER(electro-rheological) 유체를 특징으로하는 지능외팔보의 고유주파수, 강성, 댐핑 등이 전장(electric field)에 따라 변화함을 고찰하였고 향후 능동제어계(active control system)에서 ER유체가 엑튜에이터로써 사용가능함을 보여주었다. ER 유체의 종류, 농도, 체적비, 시편의 전하특성에 따른 지능보의 동탄성 특성을 자유진동과 강제진동하에서 실험하여 비교분석하였다.

• Journal of the Korean Society for Nondestructive Testing
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• v.26 no.5
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• pp.329-335
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• 2006

It is necessary to study on the stress concentration experimentally, which is the main reason to avoid mechanical dilapidation and failure, when designing a mechanical structure. Stress concentration factor of a specimen of cantilever beam with a circular hole in the center was measured using both strain gage and photoelastic methods in this paper. In strain-gage measurement, three strain gages along the line near a hole of the specimen were installed and maximum strain was extrapolated from three measurements. In photoelastic measurement, two methods were employed. First, the Babinet-Soleil compensation method was used to measure the maximum strain. Secondly, photoelastic 4-step phase shilling method was applied to observe the strain distribution around the hole. Measurements obtained by different experiments were comparable within the range of experimental error.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.5
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• pp.513-523
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• 2016

The stress concentration factors and stress intensity factors for a simple beam and a cantilever are analyzed by using finite element method and phtoelasticity. Using the analyzed results, the estimated graphs on stress concentration factors and stress intensity factors are obtained. To analyze stress concentration factors of notch, the dimensionless notch length H(height of specimen)/h=1.1~2 and dimensionless gap space r(radius at the notch tip)/h=0.1~0.5 are used. where h=H-c and c is the notch length. As the notch gap length increases and the gap decreases, the stress concentration factors increase. Stress concentration factors of a simple beam are greater than those of a cantilever beam. However, actually, the maximum stress values under a load, a notch length and a gap occur more greatly in the cantilever beam than in the simple beam. To analyze stress intensity factors, the normalized crack length a(crack length)/H=0.2~0.5 is used. As the length of the crack increases, the normalized stress intensity factors increase. The stress intensity factors under a constant load and a crack length occur more greatly in the cantilever beam than in the simple beam.

• Journal of the Korean Society for Railway
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• v.8 no.6 s.31
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• pp.573-580
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• 2005

Model I interlaminar fracture behaviors of the carbon/epoxy composite, one of the candidate composites for a tilting train carbody, were investigate by the use of DCB(Double cantilever beam) specimens. These specimens were made of CF3327 plain woven fabric with epoxy resin, and an artificial starter delamination was fabricated by inserting Teflon film with the thickness of $12.5{\mu}m$ of $25.0{\mu}m$ at the one end of the specimen. Mode I interlaminar fracture toughness was evaluated for the specimens with the different thickness of an inserter. Also delamination propagating behaviors and interlaminar fracture surface were examined through an ooptical travelling scope and a scanning electron microscope. We found that abruptly unstable crack propagation called as stick-slip phenomena was observed. In addition, interlaminar fracture behaviors were affected on the location and the morphology of a crack tip as well as an interface region.

• Composites Research
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• v.29 no.2
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• pp.85-89
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• 2016

This paper aims at estimating the fracture behavior at the bonded part of composite material. CFRP is manufactured as the type of TDCB. The static analysis of Mode 1 due to the configuartion factor of m is carried out. Four kinds of specimens have the configuartion factor(m) of 2, 2.5, 3 and 3.5. As the study result, the displacements at specimens are shown to be similar each other in these four cases. At m of 3.5, the reaction force becomes highest as 412 N and is shown to be improved as much as 14% by comparing m of 2. The data on defection of the bonded interface and reaction force are thought to be contributed to the structural design of CFRP and the safe design.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1705-1713
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• 2010

The reliable fatigue life for hybrid composite joint structures was estimated by a statistical method for evaluating fatigue life; the results of the fatigue test varied widely. Cyclic bending tests were performed on a cantilever beam with a hybrid composite joint, which was developed for the body of a low-floor bus. In order to estimate the fatigue life of the hybrid composite joint structure by comparing the data obtained during the fatigue tests, the most suitable probabilistic density function among the normal, lognormal, and Weibull distributions was selected. The probabilistic-stress-life (P-S-N) curves calculated by using the selected Weibull distribution was suggested for process of statistical fatigue life estimation and reliability design.