• Title/Summary/Keyword: 온칩버스

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Trends of International Standardization on Semiconductor IP (반도체 IP의 국제 표준화 동향)

  • Lim, T.Y.;Eum, N.W.;Kim, D.Y.
    • Electronics and Telecommunications Trends
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    • v.16 no.2 s.68
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    • pp.40-52
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    • 2001
  • 본 논문은 반도체 공정이나 설계환경에 무관하게 재사용이 가능하면서 라이센스에 의해 보호되는 전자회로 설계 모듈 IP에 관한 세계적인 표준안들에 대하여 살펴본다. 현재 선진 외국의 반도체, 통신 관련 기업들은 자신들의 기능 모듈을 IP화 하는 데 있어서 1996년에 설립된 IP의 국제 표준화 단체인 VSIA의 표준안에 부합하도록 노력하고 있다. 현재까지 VSIA는 약 1,000페이지에 달하는 13종의 사양서와 표준안 및 기술문서를 개발하였으며, 전세계 200여 개의 회원기관에 공개하고 있다. 이와 같은 표준안들은 모든 회원사들이 제안하는 시스템 통합, 테스트, 혼성신호, 온칩버스, 검증, 보안 등의 표준관련 제안들을 8개의 VSIA DWG에서 심의하여 확정하며 계속적인 보완과 수정 및 추가가 진행되고 있다. 본 고는 가장 최신 버전들을 중심으로 IP의 표준화 동향을 파악 분석하고, 표준안들의 본질을 정의하였으며, VSIA 표준안에 부합 시킬 수 있는 절차를 체계화 함으로 국내의 IP 개발에 일조를 하고자 하였다.

Modeling and Analysis of Power Consumed by System Bus for Multimedia SoC (멀티미디어 SoC용 시스템 버스의 소비 전력 모델링 및 해석)

  • Ryu, Che-Cheon;Lee, Je-Hoon;Cho, Kyoung-Rok
    • The Journal of the Korea Contents Association
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    • v.7 no.11
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    • pp.84-93
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    • 2007
  • This paper presents a methodology that accelerates estimating the system-level power consumption for on-chip bus of SoC platforms. The proposed power modeling can estimate the power consumption according to the change of a target SoC system. The proposed model comprises two parts: the one is power estimation of bus logics reflecting the architecture of the bus such as the number of bus layers, the other is to estimate the power consumed by the bus lines during data transmission. We designed the target multimedia SoC system, MPEG encoder as an example and evaluated power consumption using this model. The simulation result shows that the accuracy of the proposed model is over 92%. Thus, the proposed power model can be used to design of a high-performance/low-power multimedia SoC.

임베디드 SoC 응용을 위한 타원곡선알고리즘 기반 보안 모듈

  • Kim Young-Geun;Park Ju-Hyun;Park Jin;Kim Young-Chul
    • Review of KIISC
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    • v.16 no.3
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    • pp.25-33
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    • 2006
  • 본 논문에서는 임베디드 시스템 온칩 적용을 위한 통합 보안 프로세서를 SIP(Semiconductor Intellectual Property)로 설계하였다. 각각의 SIP는 VHDL RTL로 모델링하였으며, 논리합성, 시뮬레이션, FPGA 검증을 통해 재사용이 가능하도록 구현하였다. 또한 ARM9과 SIP들이 서로 통신이 가능하도록 AMBA AHB의 스펙에 따라 버스동작모델을 설계, 검증하였다. 플랫폼기반의 통합 보안 SIP는 ECC, AES, MD-5가 내부 코어를 이루고 있으며 각각의 SIP들은 ARM9과 100만 게이트 FPGA가 내장된 디바이스를 사용하여 검증하였으며 최종적으로 매그나칩 $0.25{\mu}m(4.7mm\times4.7mm)$ CMOS 공정을 사용하여 MPW(Multi-Project Wafer) 칩으로 제작하였다.

Novel Power Bus Design Method for High-Speed Digital Boards (고속 디지털 보드를 위한 새로운 전압 버스 설계 방법)

  • Wee, Jae-Kyung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.43 no.12 s.354
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    • pp.23-32
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    • 2006
  • Fast and accurate power bus design (FAPUD) method for multi-layers high-speed digital boards is devised for the power supply network design tool for accurate and precise high speed board. FAPUD is constructed, based on two main algorithms of the PBEC (Path Based Equivalent Circuit) model and the network synthesis method. The PBEC model exploits simple arithmetic expressions of the lumped 1-D circuit model from the electrical parameters of a 2-D power distribution network. The circuit level design based on PBEC is carried with the proposed regional approach. The circuit level design directly calculates and determines the size of on-chip decoupling capacitors, the size and the location of off-chip decoupling capacitors, and the effective inductances of the package power bus. As a design output, a lumped circuit model and a pre-layout of the power bus including a whole decoupling capacitors are obtained after processing FAPUD. In the tuning procedure, the board re-optimization considering simultaneous switching noise (SSN) added by I/O switching can be carried out because the I/O switching effect on a power supply noise can be estimated over the operation frequency range with the lumped circuit model. Furthermore, if a design changes or needs to be tuned, FAPUD can modify design by replacing decoupling capacitors without consuming other design resources. Finally, FAPUD is accurate compared with conventional PEEC-based design tools, and its design time is 10 times faster than that of conventional PEEC-based design tools.

ALTERA Embedded Gigabit Transceiver Measurement for PCI Express Protocol (ALTERA 임베디드 기가비트 트랜시버 테스트)

  • Kwon, Won-Ok;Park, Kyoung;Kwon, Hyuk-Je;Yoon, Suk-Han
    • Journal of the Institute of Electronics Engineers of Korea CI
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    • v.41 no.4
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    • pp.41-49
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    • 2004
  • In this paper, a design and measurement method for FPGA embedded gigabit-transceiver is presented. Altera's Stratix GX device which is general purpose transceiver called GXB was used for implementing PCI Express transceiver. PCI Express is the generation high performance serial I/O bus used to interconnect peripheral devices. After GXB was set follow by PCI Express specifications, the design has been verified by timing simulation and implemented as hardware. We tested it as follow. First GXB internal digital and analog block test second GXB transmitter signal integrity test called Eye mask test, third GXB high-speed serial I/O buffer and on-chip termination test and the last GXB protocol test. This paper shows all the design and measurement procedure about FPGA embedded gigabit-transceiver.