• Journal of the Korean Geotechnical Society
• /
• v.27 no.7
• /
• pp.47-57
• /
• 2011

The p-y curve has been used to design pile foundations subjected to lateral loading. Although the p-y curve has a large influence on the pile lateral behavior, p-y curves have not been clearly suggested. In this study, the p-y curve of clay was evaluated for drilled shafts in marine deposits by using 3-dimensional numerical analyses. First, the optimization study was performed to properly determine boundary extent, mesh size, and interface stiffness. The numerical modeling in the study was verified by comparing the calculated and the pile loading test results. Then, the p-y curves of single and group piles were evaluated from the parametric study. The selected parameters were pile diameter, pile Young's modulus and pile head fixed condition for a single pile, and pile spacing for group piles. Finally, the p-multiplier was evaluated by comparing the p-y curves of a single pile and group piles. As a result, the p-multiplier at pile spacing of 3D was 0.83, 0.67 and 0.78 for the front, middle, and back row piles, respectively, and showed values similar to those of O'Neill and Reese (1999). For the pile group with pile spacing larger than 60, the group effect can be ignorable.

• Journal of Internet Computing and Services
• /
• v.16 no.1
• /
• pp.29-37
• /
• 2015

In this paper, we propose a robust pre-processing module for camera-based Optical Music Score Recognition (OMR) on mobile device. The captured images likely suffer for recognition from many distortions such as illumination, blur, low resolution, etc. Especially, the complex background music sheets recognition are difficult. Through any symbol recognition system, the staff line height and staff line space are used many times and have a big impact on recognition module. A robust and accurate staff line height and staff line space are essential. Some staff line height and staff line space are proposed for binary image. But in case of complex background music sheet image, the binarization results from common binarization algorithm are not satisfactory. It can cause incorrect staff line height and staff line space estimation. We propose a robust staff line height and staff line space estimation by using run-length encoding technique on edge image. Proposed method is composed of two steps, first step, we conducted the staff line height and staff line space estimation based on edge image using by Sobel operator on image blocks. Each column of edge image is encoded by run-length encoding algorithm Second step, we detect the staff line using by Stable Path algorithm and removal the staff line using by adaptive Line Track Height algorithm which is to track the staff lines positions. The result has shown that robust and accurate estimation is possible even in complex background cases.

• Journal of the Microelectronics and Packaging Society
• /
• v.20 no.2
• /
• pp.65-74
• /
• 2013

The through-silicon via (TSV) technology is essential for 3-dimensional integrated packaging. TSV technology, however, is still facing several reliability issues including interfacial delamination, crack generation and Cu protrusion. These reliability issues are attributed to themo-mechanical stress mainly caused by a large CTE mismatch between Cu via and surrounding Si. In this study, the thermo-mechanical reliability of copper TSV technology is investigated using numerical analysis. Finite element analysis (FEA) was conducted to analyze three dimensional distribution of the thermal stress and strain near the TSV and the silicon wafer. Several parametric studies were conducted, including the effect of via diameter, via-to-via spacing, and via density on TSV stress. In addition, effects of annealing temperature and via size on Cu protrusion were analyzed. To improve the reliability of the Cu TSV, small diameter via and less via density with proper via-to-via spacing were desirable. To reduce Cu protrusion, smaller via and lower fabrication temperature were recommended. These simulation results will help to understand the thermo-mechanical reliability issues, and provide the design guideline of TSV structure.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.3
• /
• pp.59-65
• /
• 2011

According to the trends of electronic package to be smaller, thinner and more integrative, Flip Chip Ball Grid Array (FCBGA) become more used for mobile phone. However, the flip chip necessarily generate the heat by the electrical resistance and generated heat is increased due to reduced distribution area of the heat in accordance with the miniaturization trend of the package. Thermal issues can result in problems of devices that are sensitive to temperature and stress. Then the heat can generate problems to the system. In this paper, in order to improve the thermal issues of FCBGA, thermal characteristics of FCBGA was analyzed qualitatively by using the general heat transfer module of Comsol 3.5a and In order to solve thermal issues, flip chip with new micro structure is proposed by the simulation. and also by comparing existing model and analyzing variables such as pitch, height of the pattern and shape of the heat spreader, the improvement of heat dissipation characteristics about 18% was confirmed.

• Journal of Korean Tunnelling and Underground Space Association
• /
• v.22 no.1
• /
• pp.47-58
• /
• 2020

The interest in the use of shield TBM (Tunnel Boring Machine) on the tunnel excavation has been increased rapidly in Korea. The shield TBM tunnel is generally designed as non-drainage tunnel. Consequently, if water leakage through the segment joints happens, big problems on the usage and stability of tunnel can be occurred. In this study, the variation of waterproof capacity of hydrophilic rubber waterstop by the construction error and excessive displacement of segment was studied. In particular, the waterproof capacity of each of single and double layer arrangements of hydrophilic rubber waterstop was examined to verify the efficiency of the double layer arrangement. The test results show that the single layer and double layer hydrophilic rubber waterstop showed the same waterproof performance. hydrophilic rubber waterstop has favorable on the offset, however unfavorable on the gap.

• Proceedings of the Korean Institute of Industrial Safety Conference
• /
• 1999.06a
• /
• pp.249-252
• /
• 1999

전도성 충진제가 포함된 결정성 고분자내에 대전류가 흐르게 될 경우 Joule 효과로 소재자체의 발열현상이 발생하며 온도가 증가함에 따라 고분자의 용융점 부근에서 급격한 열팽창으로 인하여 고분자 내에 분포되어 있던 전도성 충진재 입자사이의 간격이 증가하게 되며 전자들의 흐름이 방해를 받게 된다. 이에 따라 전기저항이 커져 전류의 흐름이 감소되는 철상이 발생하며 이를 PTC(Positive Temperature Coefficient)라 하고 온도 증감에 따른 전도성 충진제 간의 electron tunnelling과 고분자의 결정변화에 의해 민감한 전기저항변화 특성을 나타낸다. (중략)

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.05a
• /
• pp.635-638
• /
• 2000

The propose of study analyze a TEMA(Tubular Exchanger Manufacturers Association) E shell and tube heat exchanger performance with 3, 5, 7, 9, 11 baffles and 16, 20 tubes. In this investigate measured a variation of the heat exchanger cooling capacity change within each number of baffle and tube number and determined optimal number of baffle. designs for industry applications are optimized using the analysis of test results.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.05a
• /
• pp.253-253
• /
• 2004

방전가공은 현재의 정밀 금형산업에서는 필수적인 가공방법이나, 공작물과 전극사이에서 방전이 발생할 때 고온고압의 플라즈마 상태에서 재료를 제거하는 메카니즘에 대한 해석은 아직도 많은 연구 대상이다. 방전가공은 기본적으로 3단계의 과정으로 구별할 수 있는데, 첫째 공작물과 전극의 간격과 기하학적 형상, 전압에 의해서 전계가 집중되어 절연체의 절연강도보다 초과하면 절연체가 이온화되어 방전이 시작된다. 둘째, 전극과 공작물이 통전이 되어 플라즈마 채널이 형성되면서 열에너지에 의하여 공작물이 용융 증발이 발생한다.(중략)

• The Journal of the Acoustical Society of Korea
• /
• v.2 no.1
• /
• pp.59-66
• /
• 1983

본 논문은 랜념배열 안테나에서 위치함수의 확률분포함수가 정규 Gaussian 분포가 되도록 사다 리 계층법과 등면적 분포법이란 새로운 방법을 제시하였고 이를 선형과 판형 배열 안테나로 설치하여 그의 방사특성을 컴퓨터에 의해 계산하고 합성한 것이다 측정된 결과를 Monte-Carlo 법에 의한 랜념배 열 안테나와 균일 간격으로 배열된 안테나에 의한 측정결과와 비교한 결과 부로부레벨은 등면적 분포법 에 의한 배열안테나에서 가장 낮았으며 소자수가 많을수록 낮아졌다. 또한 빔폭은 확률밀도함수와 operture 길이에 의존함을 알 수 있다.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.4 no.3
• /
• pp.191-203
• /
• 1992

To analyze the unsteady heat transfer phenomena in radiant heating panel, a mathematical model was considered. Numerical analysis for solving the governing equations was conducted by using the finite difference method with boundary-fitted meshes. Transient temperature distributions and thermal responses in heating panel were obtained for various design parameters such as pipe pitches, pipe diameters and pipe depths. Experimental results were also obtained to verify the results of calculation.