• Journal of the Korea Academia-Industrial cooperation Society
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• v.8 no.4
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• pp.733-737
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• 2007

The object of this paper is to propose a method to solve resulting heat in using numerous modulized watt-class LEDs in MCPCB as lighting device. To use LED for lighting, the chip needs to have a large capacity, resulting in extra heat in P-N connection area. To solve this problem, a Pottier Module, heat-sink panel and a fan was installed to measure variations in the temperature. Additionally, temperature variation characteristics were observed according to the heat conductor panel connecting cooling module and heat-sink panel, insulator and thermal grease. As a result, the type and amount of heat-sink panel was the most important facto. The fan would effect the temperature by max. $18[^{\circ}C]$ while other materials affected the temperature by $2{\sim}3[^{\circ}C]$, showing significant difference.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.10 no.8
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• pp.1789-1794
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• 2009

In the present study, the cooling performance characteristics on environment changes of A/C applied fin-tube and PF heat exchangers were experimentally investigated. Capacity and COP on an air velocity, an indoor/outdoor temperature and an indoor/outdoor relative humidity were obtained. Fin types of PF heat exchanger were a triangler and squarer form. The experimental data for the three kinds of heat exchangers were measured using the air-enthalpy calorimeter. Performance of PF A/C was more excellent than that of a fin-tube A/C. Also, the performance of PF-2 A/C with the squarer fin was more excellent than that of PF-1 A/C with the triangler fin. As the air velocity, the indoor temperature and the indoor relative humidity increase, capacity and COP increase. And as outdoor temperature increases, capacity and COP decrease. But, the performance change on the outdoor relative humidity was insignificant.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.1
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• pp.69-73
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• 2013

Internal heat exchanger (IHX) apparatus using the temperature difference between high and low pressure lines in vehicle air conditioning system is a good method to enhance the cooling performance. In this study, we designed various double-pipe internal heat exchangers which have inner fins between the internal pipe and external pipe. We also measured the performance characteristic (pressure drop, cooling capacity, compressor work and coefficient of performance (COP)) of the modified internal heat exchangers that had the change of the fin height and the inside shape of the internal pipe. This experimental results indicated that the liner and serration type internal heat exchanger was the best cooling performance. In addition, the air conditioning system with the liner and serration type internal heat exchanger showed the improved performances of about 6.4% and 9.2%, respectively, for the cooling capacity and COP.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.3
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• pp.1003-1010
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• 2013

In this study, a simulation program was developed, which predicts the performance of cold-air forced circulation type air cooled showcase. The showcase has an excellent display effect in addition to preserving the grocery. In the program, the compressor was analyzed using performance data supplied by the manufacturer and the capillary tube pressure drop was analyzed using a homogeneous model. The evaporator and condenser were analyzed by dividing the heat exchangers into small elements, where energy balance and appropriate heat transfer correlations were used. A showcase model with two 3/4 HP compressors, capillary tubes of 1.6 mm inner diameter, a fin-and-tube evaporator and condenser was tested, and the results are compared with the predicted values. It is shown that both evaporation and condensation temperatures are adequately predicted by the program.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.1
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• pp.23-26
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• 2000

In spot welded joint. Electronic Speckle Pattern Interferometry(ESPI) method using the Model 95 Ar laser a video system and an image processor was applied to measure the stress Unlike traditional strain gauges or Moire method, ESPI method has no special surface preparation or attachments and can be measured in-plane displacement with non-contact and real time. In this experiment, specimens are loaded in parallel with a load cell. The specimens are made of the cold rolled steel sheet with 1mm thickness, are attached strain. gauges. This study Provides an example of how ESPI has been used to measure stress and strain inspecimen. The results measured by ESPI are compared with the data which was measured by strain gauge method under tensile testing.

• Fire Science and Engineering
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• v.24 no.1
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• pp.116-121
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• 2010

The present study has been performed to investigate the ignition characteristics of a n-dodecane fuel droplet on the hot surface. Simplified bench scale test setup was built to examine the effect of air flow on the ignition temperature of fuel droplet. IR pyrometric sensor was used to measure the surface temperature, the measured temperature using IR pyrometer was directly compared with k-type thermocouple. The ignition of n-dodecane fuel droplet was divided into two stage - cool flame and hot flame - with the air flow rate except the case of air flow rate 3.0 lpm. The ignition temperature and probability was greatly affected by the air flow rate and the MHSIT of the present study was about $300^{\circ}C$ for air flow rate of 0.5 lpm.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.11
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• pp.5202-5207
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• 2011

A temperature control system is very important part in many industrial applications. Typical development procedures for temperature control system consist of several stages such as conceptual system design, construction of physical system, controller design based on the mathematical model for the system, and performance test. Since the mathematical model is usually obtained with the aid of system identification technique based on repeated experiments after construction of the physical system, the above procedures require very large amount of time and cost. It takes also large amount of time in the controller design and performance test procedures. In this paper, a virtual development scheme, which can predict the performance of the temperature control system prior to construction of physical system, for rapid validation of the initial system design is proposed. The effectiveness of the proposed scheme is shown by using SISO (Single Input Single Output) example.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.4
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• pp.325-330
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• 2005

A lever type CO micro gas sensor was fabricated by MEMS technology. In order to heat up the gas sensing material, $SnO_2$, to a target temperature, a micro heater was built on the gas sensor. The heater and electrodes were hanged on the air as a bridge type to minimize the heat loss to the silicon base. The sensing material laid on the heater and electrodes and did not contact with the silicons base. The temperature distribution of micro gas sensor was analyzed by a CFD program, FLUENT. The results showed that the temperature of silicon wafer base was almost similar to that of the room temperature, which indicates that the heat generated at the micro heater heated up effectively the sensing material. The required electric current of micro heater to heat up the sensing material to the target temperature could be predicted.

• Journal of IKEEE
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• v.25 no.3
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• pp.528-533
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• 2021

This paper presents the PCB heat dissipation characteristics of high density DC-DC converter for electric vehicles. This paper also analyzes the heat dissipation structure of the high density DC-DC converter and optimizes the PCB heat dissipation design of the high density power system through thermal analysis simulation. Based on heat transfer theory, the thermal path of general electronic devices is analyzed and the thermal resistance equivalent circuit is modeled in this paper. Additionally, the thermal resistance equivalent circuit of the 500W synchronous buck converter, which is addressed in this paper, is modeled to present a structural heat dissipation path for better thermal performance. The validity of the proposed scheme is verified through the thermal analysis simulation results and experiments applying multi-surface heat dissipation structure to a 500[W](12[V], 41.67[A]) synchronous buck converter prototype with an input voltage 72[V].