• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.7-12
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• 2010

We have developed a SPICE compatible model of thermoelectric devices, and a parameter extracting technique only by electrical and temperature measurement by using Harman method was proposed. The proposed model and parameter extraction technique do not require experimental data from thermal conductivity measurements. The maximum error between extracted parameters extracted by proposed method and conventional method was about 14%, which is not a severe mismatch for real application. The proposed model is applicable to design of both for thermoelectric coolers and thermo electric generators.

• Journal of the Korea Society of Computer and Information
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• v.17 no.12
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• pp.41-47
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• 2012

Every object over $O^{\circ}K$ emits radiant energy based on its own temperature. Uncooled thermal imaging system displays the detected incident radiant energy as an image by signal processing. Recently, the uncooled thermal imaging system is applied to various areas such as medical, industrial, and military applications. Also, several researches are in progress to find new applications of the uncooled thermal imaging system. In this paper, we present effective method for controlling TEC-less detector in the uncooled thermal imaging system and also present the efficient control scheme for maximizing the accuracy of temperature measurement. The proposed scheme is to apply TEC-less and temperature detection algorithm in Uncooled thermal imaging system. In results of tests performed by using the actual chamber, we acquired images of better quality than the former system and temperature measurement accuracy was improved to less than $1^{\circ}C$.

• Journal of Power System Engineering
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• v.10 no.4
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• pp.65-70
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• 2006

This study is to experimentally evaluate the cooling performance of the Bonding type and Injection type of heat sink using three different kinds of industrial Peltier module by digital LabViewTM measurement. Injection type of heat sink could be more efficient for the heat transfer than Bonding type, even with 30% more radiating surface area. In addition, the experimental results revealed that the sufficient power supplied was able to show the better cooling performance of Peltier module. In order to verify the optimal cooling performance of the cooling device, two Peltier module, HMN 6040 and HMN 1550 with Bonding and Injection type of heat sink were used. The cooling performance with injection type of heat sink was 2.11% and 6.24% better than that with bonding type of heat sink under the HMN 6040 and HMN 1550, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.12 no.5
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• pp.519-524
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• 2000

The purpose of this study is to develop a low temperature waterless container for live fish transportation which is economical and efficient The principle of the waterless transportation is that a live fish becomes asphyxial at about $5^{\circ}C$can survive without water for a long time. A low temperature waterless container is developed for this purpose, which utilizes thermoelectric modules for rather smaller and lighter cooling system with precise temperature control devise compared to the existing mechanical system. At first, we succeeded in making flounders alive in the waterless container for 24 hours. Also when flounders were transported in a round trip from Inchon to Pusan in the waterless container, carried in a car, they survived in the waterless container for over 21 hours.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4072-4080
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• 2014

The Peltier Module has been used to dissipate the heat from electronic devices and electronic components. In this module, a heat sink is used to release the operating heat into the air outside. This study addressed the heat transfer characteristics for a heat sink with an inner tunnel. Under forced and natural convection conditions, the heat transfer characteristics were different. Therefore, the cooling and heating performances were studied for the heat sink, which has an inner tunnel. The heat transfer conditions were also evaluated by performing an experimental test, which investigated the heat transfer characteristics related to the variance in time and temperature distribution. Experiments on the heat transfer characteristics of the heat sink were conducted based on the forced and natural convection and temperature distribution changes. In the cooling experiment, the A- and B-shaped cooling pin heat sinks decreased the temperature of the forced convection than the temperature of natural convection. In the forced and natural convection, the A- and B-shaped decreased to a minimum of $-15^{\circ}C$. Under the forced and natural convection conditions, A- and B-shaped cooling pin heat sinks decreased the temperature when the voltage was increased. In the heating experiment, the A- and B-shaped cooling pin heat sinks increased the temperature of the forced convection than the temperature of natural convection. In forced convection, when the voltage was $15^{\circ}C$, the temperature of the A-shaped cooling pin heat sink increased to $150^{\circ}C$, and the temperature of the B-shaped cooling pin heat sink increased to $145^{\circ}C$. Under forced and natural convection conditions, the A- and B-shaped cooling pin heat sinks showed an increase in temperature with increasing voltage.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.143-143
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• 2007

Bi-Te계 화합물은 상온영역($250^{\circ}C$이하)에서 열전특성이 우수하여, 냉각용 및 발전용 열전소자 재료로 사용되고 있다. 앞선 연구에서 MA법에 의한 La이 치환된 Bi-Te 진공가압 소결체의 열전특성이 $Bi_2Te_3$와 비교하여 향상된 값을 나타내었다. 본 연구에서는 Bi와 Te을 각각 0.01wt%, 0.02wt% La으로 미량 치환하여 melting법으로 제조한 분말을 $420^{\circ}C$, 200MPa로 가압 소결하였다. 가압 소결체의 열전특성은 Seebeck계수, 전기전도도. 열전도도를 측정하여 성능지수를 계산하였고 Bi-Te, (Bi-La)-Te, Bi-(Te-La)의 열전특성을 비교 분석하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.199-199
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• 2007

Bi-Te계 화합물은 상온영역 ($250^{\circ}C$ 이하)에서 열전 특성이 우수하여, 냉각용 및 발전용 열전 소자 재료로 사용되고 있다. 앞선 연구에서 La이 치환된 Bi-Te 진공가압 소결체의 열전특성이 $Bi_2Te_3$와 비교하여 향상된 값을 나타내었다. 본 연구에서는 Bi와 Te을 각각 0.01wt% Ce으로 미량 치환하여 기계적 합금화법으로 제조한 분말을 $420^{\circ}C$, 200MPa로 진공가압 소결하였다. 진공가압 소결체의 열전특성은 Seebeck계수, 전기전도도. 열전도도를 측정하여 성능지수를 계산하였고 Bi-Te, (Bi-Ce)-Te, Bi-(Te-Ce)의 열전특성을 비교 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.31-36
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• 2015

The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.

• The Magazine for Energy Service Companies
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• s.62
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• pp.58-65
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• 2010

최근 가정용 컴퓨터와 노트북 등의 중앙처리장치(CPU) 속도가 급격히 빨라지고 있다. 더욱이 화석 에너지 고갈 위기에 따라 제품의 발열량은 급속도로 늘어날 전망이라는 관측이 나왔다. 때문에 에너지절약에 대한 해결이 동반된 연구가 이뤄져야 한다는 목소리가 커지고 있다. 이러한 문제를 해결하기 위해 발열원에 히트싱크를 직접 부착하는 강제대류 방식에 대한 연구가 진행되고 있고, 최근 들어 열전소자를 이용한 냉각방식과 히트파이프를 이용한 방식도 대두되고 있다. 그 중 열저항 특성 연구에 집중했던 기존 방식에서 벗어나 Pulsating Heat Pipe(PHP)를 열확산기로 적용시킨 연구방식을 소개한다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.06a
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• pp.27-28
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• 2009