• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.1-7
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• 2007

Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. To successfully imprint a nano-sized pattern, the process conditions such as temperature, pressure, and time should be appropriately selected. This starts with a clear understanding of polymer material behavior during the NIL process. In this work, the squeezing of thin polymer films into nanocavities during the thermal NIL has been investigated based upon a two-dimensional viscoelastic finite element analysis in order to understand how the process conditions affect a pattern quality. The simulations have been performed within the viscoelastic plateau region and the stress relaxation effect has been taken into account.

• Proceedings of the KIEE Conference
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• 1999.11d
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• pp.1137-1139
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• 1999

저가의 우수한 성능을 갖는 적외선 영상표시 소자 구현에 적합한 마이크로 볼로미터를 MEMS 기술을 사용하여 제작하였다. 작은 열질량을 갖는 마이크로미터 단위의 열적고립 구조(thermal isolation structure) 제작은 폴리이미드(PI2611)를 희생층으로 사용하여 최종적으로 ashing공정 단계에서 폴리이미드를 제거하여 마이크로 볼로미터 구조를 완성하였다. 이 때의 구조층으로는 PECVD 질화실리콘($SiN_x$) 박막, 감지층으로 산화바나듐($VO_x$) 박막을 사용하였다. 본 연구에서는 폴리이미드 패턴 형성시 건식식각 공정조건 변수에 따라서 패턴의 기울기를 조절하여 폴리이미드 측면에서 발생되는 불 균일한 박막 증착과 패터닝 문제를 개선하였다. 또한 저응력의 질화실리콘 박막을 사용하여 잔류응력에 의한 열적고립 구조의 뒤틀림 현상을 완화하였다.

• Membrane Journal
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• v.28 no.1
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• pp.37-44
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• 2018

Polysulfone composites including graphene were prepared, and their thermal characteristics in membrane states were analyzed by using a custome-made residual stress analyzer and a thermal diffusivity analyzer based on laser flash method. The residual stress analysis was carried out on the polysulfone composite films deposited on Si (100) substrates for 1 cycle of heating and cooling runs. The flat membrane of graphene-embedded polysulfone composites were prepared by the phase transfer method in distilled water and the thermal conductivity was separately measured in the out-of-plane and the in-plane directions. The residual stress of the graphene-embedded polysulfone film was gradually decreased with increasing graphene loading and the out-of-plane thermal conductivity was distinguished from the in-plane thermal conductivity in the flat membranes. These thermal characteristics are caused by the structural uniqueness of graphene and the micro-void structures formed during membrane fabrication.

• Journal of Powder Materials
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• v.11 no.1
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• pp.8-15
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• 2004

The basic concept of functionally gradient materials (FGM) is to fabricate materials type having possibilities of applications in various fields by changing their intrinsic properties with continuous gradient. The present communication has reviewed the developments and applications of various FGMs designed for improved thermo-mechanical properties, in which the thermal protective and wear resistant materials are especially focused. Effects of thermo-mechanical properties and limits of FGMs designed for high temperature applications were mainly understood in terms of residual stress evolved from the design and fabrication. In addition, FGMs applied in structural parts were also introduced and discussed in terms of typical fabrication method for FGMs.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.45-54
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• 2020

Recently, market demands of miniaturization, high interconnection density, and fine pitch of PCBs continuously keep increasing. Therefore, SLP (substrate like PCB) technology using a modified semi additive process (MSAP) has attracted great attention. In particular, SLP technology is essential for the development of high-capacity batteries and 5G technology for smartphones. In this study, the reliability of the microvia of hybrid SLP, which is made of conventional HDI (high density interconnect) and MSAP technologies, was investigated by experimental and numerical analysis. Through thermal cycling reliability test using IST (interconnect stress test) and finite element numerical analysis, the effects of various parameters such as prepreg properties, thickness, number of layers, microvia size, and misalignment on microvia reliability were investigated for optimal design of SLP. As thermal expansion coefficient (CTE) of prepreg decreased, the reliability of microvia increased. The thinner the prepreg thickness, the higher the reliability. Increasing the size of the microvia hole and the pad will alleviate stress and improve reliability. On the other hand, as the number of prepreg layers increased, the reliability of microvia decreased. Also, the larger the misalignment, the lower the reliability. In particular, among these parameters, CTE of prepreg material has the greatest impact on the microvia reliability. The results of numerical stress analysis were in good agreement with the experimental results. As the stress of the microvia decreased, the reliability of the microvia increased. These experimental and numerical results will provide a useful guideline for design and fabrication of SLP substrate.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.4
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• pp.1-8
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• 2003

Thermo-mechanical behavior of a ceramic ball grid array (CBGA) package assembly are characterized by high sensitive moire interferometry. Moir fringe patterns are recorded and analyzed at various temperatures in a temperature cycle. Thermal-history dependent analyses of global and local deformations are presented, and bending deformation (warpage) of the package and shear strain in the rightmost solder ball are discussed. A significant non-linear global behavior is documented due to stress relaxation at high temperature. Analysis of the solder interconnections reveals that inelastic deformation accumulates on only eutectic solder fillet region at high temperatures.

• Korean Journal of Materials Research
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• v.10 no.10
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• pp.703-708
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• 2000

As the engine design changes to get high efficiency and performance of commercial diesel engine, surface w wear of the earn follower becomes an important issue as applied load increasing at the contact face between cam follower and cam. We developed the ceramic cam follower made of sili$\infty$n nitride ceramic which was more wear resistant than the cast iron or sintered metal cam follower. Ceramic cam follower was made by direct brazing of thin ceramic disk to steel body using an active brazing alloy without the interlayer. In-situ crowning(R), resulted from the difference of thermal expansion coefficient between ceramic and carbon steel after direct brazing without any stress-relieving inter]ayer, could be controlled. When a earbon steel was heated above $A_{c1}$ point and then c$\infty$led, the expansion curve represented a hysteresis. Appropriate crowning was achieved below the $A_{c1}$ point(about $723^{\circ}C$) and crowning increased with brazing temperature exponentially above the $A_{c1}$ point. Optimum brazing temperature range was from 700 to $720^{\circ}C$. We developed successfully the ceramic cam follower having appropriate crowning and being inexpensive. Also we could successfully control the crowning of ceramic earn follower by hysteresis behavior of thermal expansion of earbon steel during direct brazing process.

• Korean Journal of Materials Research
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• v.3 no.3
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• pp.282-291
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• 1993

Joining ${Al}_{2}{O}_{3}$ and STS 304 stainless steel by active metal brazing method with using CuI Owt % Ti and Cu -7 .5wt % Zr insert metal, their interfaces were analyzed and strength of the joint brazed with Cu-7.5wt % Zr insert metal also investigated with shear strength testing method. In brazing with Cu-lOwt% Ti insert metal, the single reaction layer was formed by the reaction with Ti and ${Al}_{2}{O}_{3}$ at the interface between ${Al}_{2}{O}_{3}$ and insert metal, but the double reaction layer was found in brazing with Cu-7.5wt % Zr insert metal because of the difference of their wettability on the surface of ${Al}_{2}{O}_{3}$. Fracture shear strength about 86MPa was obtained from ${Al}_{2}{O}_{3}$/Cu-7.5wt% Zr/STS 304 stainless steel joint and reasonable strength of the joints is attributed to the formation of double reaction layer at the interface.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.139-139
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• 1999

다이아몬드는 지구상에서 가장 단단한 물질로 잘 알려져 있을 뿐만 아니라 공업적 측면에서 볼 때, 여러 가지 특출한 성질들을 동시에 지니고 있다. 인장강도, 압축강도, 탄성계수 등 기계적 특성이 우수하고 넓은 광투과성과 내열, 내화학, 내방사성을 지니고 있으며, 열전도율이 높고 전기적으로 절연체이다. 또한 hole이동도가 높고 도핑에 의해서 반도체적 특성을 나타낸다. 이와 같이 매우 뛰어난 성질을 공업적으로 응용하기 위하여 이전부터 많은 연구가 행해져 왔으며, 1980년대에 들어와 박막이나 코팅 형태로의 합성이 가능한 기상합성법이 큰 발전을 보임으로써 다이아몬드의 우수한 특성을 여러 분야에서 폭넓게 응용할 수 있게 되었다. 특히 마찰 응용분야에 최적의 재료로 추천되고 있다. 지금도 Epitaxial 다이이몬드를 기지 위에 성장시키고 다결정질박막을 여러 가지 비다이아몬드(Si, W, Mo 등) 기지 위에 성장시키는 연구가 계속되고 있으며 공구강 위엥 경질코팅으로써 한층 개선된 다이아몬드박막 제조를 위한 수많은 연구노력들이 집중되고 있다. 그러나 일반탄소강에 다이아몬드박막을 성장시키기 위한 많은 노력들은 크게 바람직하지 않은 non-diamond carbon(black carbon or graphitic soot)의 형성 때문에 방해를 받고 있다. 계면에서 이들의 형성은 증착된 다이아몬드박막과 금속기지의 저조한 밀착력을 나타내게 된다. 이외 같이 다이아몬드박막의 응용을 위하여 다이아몬드피막에 요구되는 중요한 조건은 기지에 대해서 강한 밀착력을 나타내는 것이며, 동시에 상대물에 대하여 낮은 마찰계수를 가져야 한다. 그러나 다이아몬드와 금속기지는 서로 다른 열챙창계수(각각 0.87$\times$10-6K-1, 12$\times$10-6K-1)의 차이로 인하여 밀착력이 현저히 떨어진다는 단점으로 인해 산업화에 많은 제약을 받아왔다. 이러한 문제점을 해결하기 위하여 본 연구에서는 다이아몬드박막과 금속기지 사이에 중간층을 이용하는 방법을 제안하였다. 이러한 시도는 일반적으로 중간층 형성 금속인 Ti 또는 TiN 등이 적용되었으나 원하는 결과를 얻지 못하였다. 즉 carbon과 Fe의 상호확산, non-diamond carbon상의 형성 그리고 열잔류응력을 완화시키고 일반탄소강 위에 다이아몬드박막을 형성시켜 우수한 밀착력을 얻기 위한 목적에 미흡하였던 것이다. 이에 중간층으로 Cr 또는 Cr계 화합물 박막을 이용하였는 바, 이 중간층을 이용한 결과 우수한 밀착력을 나타내는 다이아몬드박막을 얻었으며 열적, 구조저으로 모재와 다이아몬드에 적합한 결과를 얻을 수 있었다. 본 연구에 의해 얻어진 결과들은 재료 가공을 위하여 높은 경도와 내마모성등이 요구되는 절삭공구나 금형의 수명 향항에 크게 기여할 것이며 산업적으로 큰 응용이 기대된다.