• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.23-31
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• 2019

In this study, we conducted numerical analyses using the Taguchi method and finite element method to calculate the thermal deformation of a printed circuit board and the effect of design factors on the thermal deformation. Analysis results showed that the thermal deformation of the panel had the strongest effect on the thermal deformation and shape of the strip and unit. In particular, the deformation in the z direction was larger than that in the xy-plane direction. The effect of design factors and the design conditions for reducing the thermal deformation of the panel and strip changed at the unit level. Therefore, it is recommended that panel-level thermal deformation must be controlled to reduce the final thermal deformation at the unit level because the thermal deformation of the strip strongly affects that of the unit.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.1048-1050
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• 2017

In this study, Numerical simulations of the pintle-nozzle were performed to evaluate the thermal strain effect using by 1-way fluid structure interaction analysis(FSI). we carried out computational fluid dynamics analysis to obtain the pressure and temperature fields of pintle nozzle. we then used the data as the load condition for a FSI separately. and thermal strain of the pintle was checked. In order to confirm the change of thrust characteristic by deformation, we are carrying out 2-way FSI.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.236-236
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• 2003

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.5
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• pp.208-213
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• 2020

In this research, design optimization was investigated using the finite element analysis and the optimal design technique based on the PQRSM algorithm to minimize the thermal deformation of IGZO oxide in a target module in which IGZO oxide and a copper backplate are bonded to each other. In order to apply the optimal design technique in conjunction with finite element analysis, the x-coordinate of lower supports and upper fixed boards used as design valuables, and the optimal design was performed to minimize the thermal displacement of IGZO materials as the objective function. After the optimization process, the thermal displacement within IGZO oxide could be reduced to 42 % comparing with the initial model. The result is thought to be useful in the industry as it can reduce the thermal deformation of target oxides materials only by changing the position of the subsidiary materials during the bonding process.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.11
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• pp.4121-4128
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• 2010

A probe card is used in testing semiconductor wafers. It must maintain a precise location tolerance for a fine pitch due to highly densified chips. However, high heat transferred from its lower chuck causes thermal deformations of the probe card. Vertical deformation due to the heat will bring contact problems to the pins in the probe card, while horizontal deformation will cause positional inaccuracies. Therefore, probe cards must be designed with proper materials and structures so that the thermal deformations are within allowable tolerances. In this paper, heat transfer analyses under realistic loading conditions are simulated using ANSYS$^{TM}$ finite element analysis program. Thermal deformations are calculated based on steady-state temperature gradients, and an optimal structure of the probe card is proposed by adjusting a set of relevant design parameters so that the deformations are minimized.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.10
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• pp.809-815
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• 2014

The co-bonded dissimilar composite under a wide range of temperature change shows thermal distortion due to the differences in thermal expansion characteristics of the composite materials. Analysis of the thermal expansion characteristics of each composite is required for the design of co-bonded dissimilar composite structure with considering the shape distortion during the manufacturing process. In this work, digital image correlation (DIC) technique is introduced for measuring the thermal distortion characteristics of co-bonded dissimilar composite specimen, carbon/epoxy and silica/phenolic. The thermal distortion of co-bonded dissimilar composite specimen is numerically estimated and compared with the experiments. The estimated results is successfully validated using the measured results.

• The Journal of the Acoustical Society of Korea
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• v.38 no.3
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• pp.344-351
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• 2019

In this work, the mechanism of contraction and expansion noise generation is investigated, and effective methods are proposed to reduce the occurrence frequency of noise during operation of the refrigerator. First, the frequency spectrum analysis was made by using the sound pressure signal measured in an anechoic chamber to investigate the characteristic of noise and the frequency of occurrence. Second, a thermal deformation analysis was conducted to predict the location of noise source. It is found from the analysis that the biggest thermal deformation occurs in the middle of the left inner case in the freezer room. Following the investigation made, a noise reduction method is proposed. The method is proposed to reduce the contraction and expansion noise by reducing the thermal deformation through increasing ABS (Acrylonitrile Butadiene Styrene) thickness in the center of refrigerator.

• Journal of the Korea Convergence Society
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• v.9 no.1
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• pp.283-289
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• 2018

In automotive disc brake systems, frictional heat is not uniformly dispersed for reasons such as heat flux and thermal deformation. The thermoelastic deformation due to the frictional heat affects the contact pressure distribution and the contact load may be concentrated on the contact portion on the the disc brake surface, resulting in thermoelastic instability. In this study, thermal analysis and thermal deformation analysis considering the contact between disk and pad occurred during braking through 3D axial symmetry model with reference to the experimental equation and Kao's analysis method of contact pressure of disk and pad. ANSYS is used to analyze the thermal and elastic instability problems occurring at the contact surface between the disk and the pad, considering both the thermal and mechanical loads. A 3D axisymmetric model with direct contact between the disk and the pad was constructed to more accurately observe the thermal behavior of the disk by observing the frictional surface temperature, thermal deformation and contact thermal stress of the disk.

• Composites Research
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• v.34 no.6
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• pp.426-433
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• 2021

The carbon fiber reinforced plastic manufacturing process has a problem in that a dimensional error occurs due to thermal deformation such as residual stress, spring-in, and warpage. The main causes of thermal deformation are various, including the shape of the product, the chemical shrinkage, thermal expansion of the resin, and the mold effect according to the material and surface condition of the mold. In this study, a viscoelastic model was applied to the plate model to predict the thermal deformation. The effects of chemical shrinkage and thermal expansion of the resin, which are the main causes of thermal deformation, were analyzed, and the analysis technique of the 3-D viscoelastic model with and without mold was also studied. Then, the L-shaped mold effect was analyzed using the verified 3D viscoelastic model analysis technique. The results show that different residual deformation occurs depending on the surface condition even when the same mold is used.