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http://dx.doi.org/10.6117/kmeps.2019.26.4.023

Numerical Analysis of Thermal Deformation of a PCB for Semiconductor Package at Panel, Strip and Unit Levels  

Cho, Seunghyun (Mechanical Engineering Department, Dongyang Mirae University)
Ko, Youngbae (Molds & Dies Technology R&BD Group, KITECH)
Publication Information
Journal of the Microelectronics and Packaging Society / v.26, no.4, 2019 , pp. 23-31 More about this Journal
Abstract
In this study, we conducted numerical analyses using the Taguchi method and finite element method to calculate the thermal deformation of a printed circuit board and the effect of design factors on the thermal deformation. Analysis results showed that the thermal deformation of the panel had the strongest effect on the thermal deformation and shape of the strip and unit. In particular, the deformation in the z direction was larger than that in the xy-plane direction. The effect of design factors and the design conditions for reducing the thermal deformation of the panel and strip changed at the unit level. Therefore, it is recommended that panel-level thermal deformation must be controlled to reduce the final thermal deformation at the unit level because the thermal deformation of the strip strongly affects that of the unit.
Keywords
PCB; Panel; strip; unit; thermal deformation; FEM;
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Times Cited By KSCI : 2  (Citation Analysis)
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