• Journal of the Korean Society for Precision Engineering
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• v.19 no.5
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• pp.7-12
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• 2002

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.73-82
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• 2003

Recently, PWB(Printed Wiring Board) has been recognized in the field of microelectronic package as core technology for designing or manufacturing. PWB is the structure stacked by several materials with different thermophysical properties, which shows the different CTEs(Coefficient or Thermal Expansions) during the fabrication process and causes a lot of defects such as warpage, shrinkage, dimension, etc. Thermal deformation of PWB is affected mainly by the volume change of solder-resist among fabrication parameters. Therefore, thermal deformation of PBGA and CSP consisting of 2 layers and 4 layers was studied with solder-resist process. When over 30% in volume fraction of solder-resist, thermal deformation of 2-layered PWB was min. 40% higher than that of 4-layered PWB because 4-layered PWB contained the layer with high toughness such as prepreg, which counterbalanced the thermal deformation of solder-resist. Otherwise, when below 30%, PWB showed similar thermal deformation without regard to layers and design.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.43 no.10
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• pp.896-901
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• 2015

The skin-frame type structure is designed to investigate the thermal deformation of the wing skin induced by the temperature gradient. In order to effectively simulate the temperature gradient on the wing specimen, a water cooling system is devised on the frame of the specimen. Out of surface skin deformation of the skin-frame type structure made of SUS304 material with respect to the temperature is successfully measured using the digital image correlation (DIC) technique including quantitative evaluation of the measurement uncertainty.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.42 no.10
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• pp.809-815
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• 2014

The co-bonded dissimilar composite under a wide range of temperature change shows thermal distortion due to the differences in thermal expansion characteristics of the composite materials. Analysis of the thermal expansion characteristics of each composite is required for the design of co-bonded dissimilar composite structure with considering the shape distortion during the manufacturing process. In this work, digital image correlation (DIC) technique is introduced for measuring the thermal distortion characteristics of co-bonded dissimilar composite specimen, carbon/epoxy and silica/phenolic. The thermal distortion of co-bonded dissimilar composite specimen is numerically estimated and compared with the experiments. The estimated results is successfully validated using the measured results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.215-219
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• 1995

요사이 공작기계는 고생산성을 위해 고속절삭과 강력 절삭이 가능하도록 설계되고, 고성능의 Controller를 부착하여 이송과 공구착탈에 필요한 비절삭 시간을 급격히 단축시켜 나가고 있다. 본 연구에서는 공작기계 주축 베어링의 비대칭 벌열의 원인과 발열형태를 이론적으로 예측하고, 실험에 의해 비대칭 발열과 냉각특성 을 운전조건 별로 확인하였다. 또한 비대칭 발열이 주축대의 열변형에 어떤 영향을 미치는지 알기 위해 유 한요소법에 의해 열변위 특성을 분석하였다.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.49-56
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• 2012

Recently, by the trends of electronic package to be smaller, thinner and more integrative, fine bump is required. but It can result in the electrical short by reduced cross-section of UBM and diameter of bump. Especially, the formation of IMCs and KV can have a significant affects about electrical and mechanical properties. In this paper, we analyzed the thermal deformation of flip-chip bump by using FEM. Through Thermal Cycling Test (TCT) of flip-chip package, We analyzed the properties of the thermal deformation. and We confirmed that the thermal deformation of the bump can have a significant impact on the driving system. So we selected IMCs thickness and bump diameter as variable which is expected to have implications for characteristics of thermal deformation. and we performed analysis of temperature, thermal stress and thermal deformation. Then we investigated the cause of the IMC's effects.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.41.1-41
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• 2004

본 발표에서는, 최근 고속 고정밀 이송계로 각광을 받고 있는 리니어 모터의 열특성 분석과 구동부 설계변경을 통한 첨단 이송계의 열변형 억제 및 최소화 기술에 대해 다루고 있다. 리니어 모터의 공작기계에 적용 시, 리니어 모터의 발열원과 열전달 경로 등을 분석하고 이에 대응한 냉각기법과 단열재의 배치에 따른 고성능 이송계의 열특성 개선 사례를 소개한다. 새로운 리니어 모터의 공작기계에 적용은 선택사항에서 필수사항으로 이동한다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.9
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• pp.126-132
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• 2016

This study numerically investigates the characteristics of chemical reactions and thermal deformation in a steam reformer. These phenomena are significantly affected by the high-temperature burner gas and the process gas conditions. Because the high temperature of the burner gas ranges from 800 to 1000 K, the reformer tubes undergo substantial thermal deformation, eventually resulting in structural failure. Thus, it is necessary to understand the characteristics of the reaction and thermal deformation under the operating conditions to evaluate the reformer tubes for sustainable, stable operation. Extensive numerical simulations were carried out using commercial CFD code (ANSYS FLUENT/MECHANICA Ver. 13.0) while considering three-dimensional turbulent flows and combined heat transfer including conduction, convection, and radiation. Structural analysis considering conjugated heat transfer between solid tubes and fluid flows was conducted using the Fluid-Solid Interaction (FSI) method. The results show that when the injection temperature of the process gas and burner gas decreased, the hydrogen production rate decreased significantly, and thermal deformation decreased by at least 15 to 20%.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.5
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• pp.13-18
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• 2002

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2017.05a
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• pp.1048-1050
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• 2017

In this study, Numerical simulations of the pintle-nozzle were performed to evaluate the thermal strain effect using by 1-way fluid structure interaction analysis(FSI). we carried out computational fluid dynamics analysis to obtain the pressure and temperature fields of pintle nozzle. we then used the data as the load condition for a FSI separately. and thermal strain of the pintle was checked. In order to confirm the change of thrust characteristic by deformation, we are carrying out 2-way FSI.