• Journal of the korean academy of Pediatric Dentistry
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• v.27 no.3
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• pp.410-418
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• 2000

An in vitro study was performed to evaluate the effect of four variables on the temperature rise produced by polishing of restorations. The four variables were : restorative material, base, thickness of remaining dentin, continuous polishing or intermittent polishing. Class V cavities were cut on extracted molar and restored with composite resin, resin-modified glass ionomer cement, compomer, amalgam on the various bases (glass ionomer cement, zinc oxide eugenol cement, zinc phosphate cement) Dentin thickness under the restoration was 0.5mm, 1.5mm. Polishing was done with an aluminum oxide-coated disc. Polishing time was continuous or intermittent for up to 1 minute. Intra-pulpal temperature increased almost linearly in all cases. Amalgam produced highest temperature rises at the pulp, while the composite resin, resin-modified glass ionomer cement and compomer were not different for each other. The rate and extent of temperature rising of amalgam restoration was reduced by presence of a cement base. Zinc oxide eugenol cement bases showed the highest temperature rise, while glass ionomer cement, zinc phosphate cement were not different to the untreated tooth Thickness of remaining dentin was only significant for the amalgam restoration. Continuous polishing produced higher temperature rise than intermittent polishing.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.10a
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• pp.88-88
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• 2003

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.42-49
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• 2003

In this paper, we provide the results of polishing temperature distribution by way of infrared ray measurement system as well as polishing resistance, which can be interpreted as tribological aspects of CMP, using force measurement system. The results include the trend of polishing temperature, its distribution profile and temperature change during polishing. The results indicate that temperature affects greatly to the removal rate. Polishing temperature increases gradually and reaches steady state temperature and the period of temperature change occurs first tens of seconds. Furthermore, the friction force also varies as the same pattern with polishing temperature from high friction to low. These results suggest that the first period of the whole polishing time greatly affects the nonuniformity of removal rate.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.24.1-24.1
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• 2011

CMP (Chemical Mechanical Planarization)는 고직접도의 다층구조의 소자를 형성하기 위한 표면연마 공정으로 사용되며, pattern 크기의 감소에 따른 공정 중요도는 증가하고 있다. 반도체 소자 제조 공정에서는 낮은 비용으로 초기재료를 만들 수 있고 우수한 성능의 전기 절연성질을 가지는 산화막을 만들 수 있는 단결정 실리콘 웨이퍼가 주 재료로 사용되고 있으며, 반도체 공정에서 실리콘 웨이퍼 표면의 거칠기는 후속공정에 매우 큰 영향을 미치므로 CMP 공정을 이용한 평탄화 공정이 필수적이다. 다결정 실리콘 박막은 현재 IC, RCAT (Recess Channel Array Transistor), 3차원 FinFET 제조 공정에서 사용되며 CMP공정을 이용한 표면 거칠기의 최소화에 대한 연구의 필요성이 요구되고 있다. 본 연구에서는 알칼리성 슬러리를 이용한 단결정 및 다결정 실리콘의 식각 및 연마거동에 대한 특성평가를 실시하였다. 화학적 기계적 연마공정에서 슬러리의 pH는 슬러리의 분산성, removal rate 등 결과에 큰 영향을 미치고 연마대상에 따라 pH의 최적조건이 달라지게 된다. 따라서 단결정 및 다결정 실리콘 연마공정의 최적 조건을 확립하기 위해 static etch rate, dynamic etch rate을 측정하였으며 연마공정상의 friction force 및 pad의 온도변화를 관찰한 후 removal rate을 계산하였다. 실험 결과, 단결정 실리콘은 다결정 실리콘보다 static/dynamic etch rate과 removal rate이 높은 것으로 나타났으며 슬러리의 pH에 따른 removal rate의 증가율은 다결정 실리콘이 더 높은 것으로 관찰되었다. 또한 다결정 실리콘 연마공정에서는 friction force 및 pad의 온도가 단결정 실리콘 연마공정에 비해 상대적으로 더 높은 것으로 나타났다. 결과적으로 단결정 실리콘의 연마 공정에서는 화학적 기계적인 거동이 복합적으로 작용하지만 다결정 실리콘의 경우 슬러리를 통한 화학적인 영향보다는 공정변수에 따른 기계적인 영향이 재료 연마율에 큰 영향을 미치는 것으로 확인되었으며, 이를 통한 최적화된 공정개발이 가능할 것으로 예상된다.

• Korean Journal of Optics and Photonics
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• v.21 no.5
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• pp.190-194
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• 2010

A hybrid grating sensing device based on a side-polished fiber Bragg grating (FBG) with a polymer overlay is proposed for simultaneous measurement of external refractive index and temperature. The side-polished FBG, which is insensitive to ambient index change, is utilized for detecting temperature variation, and the polymer overlay is coated on the side-polished FBG for measurement of ambient index change. The temperature sensitivities of the side-polished FBG and the polymer overlay were measured to be 0.01 nm/$^{\circ}C$ and -0.58 nm/$^{\circ}C$, respectively, in a temperature range from $30^{\circ}C$ to $100^{\circ}C$. The ambient index sensitivities of the polymer overlay were measured to be 498.8 nm/RIU in an ambient index range from 1.33 to 1.39, 694.9 nm/RIU from 1.39 to 1.42, and 1312 nm/RIU from 1.42 to 1.44.

• Journal of the korean academy of Pediatric Dentistry
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• v.26 no.2
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• pp.365-376
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• 1999

The importance of finishing and polishing the restoration has been described by several authors. The final step provides for improved metallurgical properties, better marginal adaptation, reduced plaque accumulation. Unfortunately, finishing of the restorations can produce damage from temperature rises at the pulpal wall. The aim of this study was to determine the changes in temperature can be occurred during the use of finishing and polishing instruments under a variety of conditions. ; with or without a water coolant, intermittent or continuous operation, high or low rotation speed, remaining dentin thickness and various restorative materials. Class V preparations were cut on extracted molars and restored with composite resin(Z 100), resin-modified glass ionomer cements(Dyract, Fuji II LC), and amalgam. Finishing was done with aluminum oxide coated disc($Sof-lex^{(R)}$ polishing disc, 3M, USA). The following results were obtained. 1. The rise of temperature during polishing of amalgam restorations was the highest among the all experimental groups except polishing with water coolant(P<0.05). However, there were no statistical differences in temperature rises between Z 100, Dyract and Fuji II LC(P>0.05). 2. The intrapulpal temperature was greatly influenced by the applied time, and intermittent polishing was showed significantly lower temperature rises than continuous polishing(P<0.01). 3. The intrapulpal temperature was increased according to the application of polishing regard less of using water coolant. However, polishing with water coolant showed significantly lower temperature in the pulp than not used water coolant(P<0.01).

• Journal of the Korean Society for Precision Engineering
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• v.10 no.1
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• pp.147-152
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• 1993

The lapping characteristics of single crystal diamond are studied by considering the crystallographic anisotropy. It is introduced for lapping method to identify crystallographic orientantion by the X-ray diffraction and to measure lapping force ratio, lapping temperature and lapping wear. Diamound bonded wheels are used for lapping under dry condition. On the lapping {110} and {100} planes, it shows remarkable crystallographic anistropy. The lapping force ratio, temperature and wear become gerater with sliding direction along the <100> than along <110>. The results also show that the wear of diamond is influenced by mechanical work(tangential lapping force * lapping distance) as well by lapping speed.

• Proceedings of the Optical Society of Korea Conference
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• 2000.08a
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• pp.12-13
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• 2000

광섬유형 센서는 전자기 간섭에 강하고 높은 감도와 원거리측정 등의 장점이 있어 이에 대한 연구가 활발하게 진행되고 있다. 온도센서의 경우 다양한 구조의 센서 구현이 용이하고 넓은 온도범위에서의 측정이 가능하다. 하지만 이러한 광섬유형센서는 대부분 온도변화를 물리량의 변화로 감지하기 때문에 작은 온도의 감지에는 구조적인 한계를 가지는 경우가 많으며 이러한 문제점을 개선하기 위하여 많은 연구가 시도되고 있다$^{[1]}$ . 본 논문은 이러한 점을 인지한 측면연마된 광섬유와 평면도파로 결합기형 고감도 온도센서에 관한 연구이다. 본 연구에서는 온도의 감지를 열광학 평면도파로의 열광학계수에 의존하기 때문에 물질의 변화에 따라 다양한 온도감도 조절과 높은 분해능을 가지는 센서의 구현이 가능하다. (중략)

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.46-52
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• 2004

CMP (Chemical-Mechanical Polishing) is a process in which both chemical and mechanical mechanisms act simultaneously to produce the planarized wafer. CMP process is an extensive usage and continuing high growth rates in the semiconductor industry. The understanding of the process, however, is much slower. The nature of material removal from the wafer is still undefined and ambiguous. Material removal rate according to the slurry flow rate is also undefined and ambiguous. Thus, in this study, the basic mechanism of material removal rate as slurry flow rate is defined in terms of energy supply and energy loss.

• Clean Technology
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• v.10 no.3
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• pp.139-148
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• 2004

The recovery of stainless steel fiber by removing cutting oil from grinding swarf, which is classified as specified wastes, was investigated. Swarf loaded with grinding oil was regenerated by supercritical carbon dioxide. And, the effects of temperature(313.15K-323.15K), pressure(10MPa-30MPa) on regeneration efficiency were studied. Regeneration effiency was increased as the pressure was increased. Also, at the same pressure, the experiments at higher temperature were more efficient for regeneration. The experiment results was predicted by applying a one-parameter mathematical model assuming linear desorption kinetics. The predicted value showed good agreement with experimental data.