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A Study on the Distribution of Friction Heat generated by CMP Process  

김형재 (부산대학교 정밀기계공학과)
권대희 (부산대학교 정밀기계공학과)
정해도 (부산대학교 정밀정형 및 금형가공 연구소)
이용숙 (한국 기계연구원)
신영재 (한국 기계연구원)
Publication Information
Journal of the Korean Society for Precision Engineering / v.20, no.3, 2003 , pp. 42-49 More about this Journal
Abstract
In this paper, we provide the results of polishing temperature distribution by way of infrared ray measurement system as well as polishing resistance, which can be interpreted as tribological aspects of CMP, using force measurement system. The results include the trend of polishing temperature, its distribution profile and temperature change during polishing. The results indicate that temperature affects greatly to the removal rate. Polishing temperature increases gradually and reaches steady state temperature and the period of temperature change occurs first tens of seconds. Furthermore, the friction force also varies as the same pattern with polishing temperature from high friction to low. These results suggest that the first period of the whole polishing time greatly affects the nonuniformity of removal rate.
Keywords
Chemical Mechanical Polishing; Polishing temperature; Friction furco; Tribology; pH; Particle size distribution; CMP;
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