• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.1
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• pp.107-114
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• 2017

A turbocharger is an engine supercharger that is driven by exhaust gas. It improves the output and fuel efficiency by increasing the charging efficiency of the mixture gas, which is achieved by changing the rotatory power of the turbine connected to the exhaust passage. It is important to control the supercharging for this purpose. A nozzle slide joint is one of the core parts. Austenitic stainless steel is currently used as the material for this part, and its excellent mechanical properties include high heat resistance and corrosion resistance. However, because of its poor machinability, there are many difficulties in producing products with complicated shapes. Machining is used in the production of nozzle slide joints for high dimensional accuracy after metal powder injection molding. As design variables in this study, we investigated the sintering temperature, product stress, deformation rate, radius of curvature of the punch, and angle of the chamfer punch, which are related to the strain and shapes. The goal is to suggest a forming process using Nitronic 60 that does not require machining to manufacture a nozzle slide joint for a turbocharger. Accordingly, we determined the best process environment using finite-element analysis, the signal-noise ratio, and the Taguchi method for experiment design. The relative density and hydrostatic pressure of the final product were in accordance with the results of the finite element analysis. Therefore, we conclude that the Taguchi method can be applied to the design process of metal powder injection molding.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.41-47
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• 2007

Today lots of investigations on Embedded Passive Technology using materials and chip components have been carried out. We fabricated diplexers with 1005 sized-passives, which were made by burying chips in PCB substrate and surface mounting chip on PCB. 6 passive chips (inductors and capacitors) were used for the frequency divisions of $880\;MHz{\sim}960\;MHz(GSM)$ and $1.71\;GHz{\sim}1.88\;GHz(DCS)$. Two types of diplxer were characterized with Network analyzer. The chip buried diplexer showed extra 5db loss and a little deviation of 0.6GHz at aimed frequency areas, whereas the chip mounted diplexer showed man. 0.86dB loss within GSM field and max. 0.68dB within DCS field respectively. But few degradations were observed after $260^{\circ}C$ for 80min baking and $280^{\circ}C$ for 10sec solder floating.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.27-27
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• 2009

드라이브 샤프트는 일반적으로 엔진에서 발생된 회전력을 바퀴에 직접 전달하는 동시에 조향기능을 수행하는 자동차 부품이다. 최근에 경량화를 통한 에너지 절감을 위하여 기존 스틸소재를 알루미늄으로 대체하는 방안에 대한 연구가 집중되고 있다. 그러나 알루미늄 단일소재로 드라이브 샤프트를 제조하는 것은 비경제적이며 또한 기 개발된 자동차 부품들과의 연결을 고려하여 알루미늄 튜브와 스틸 요크의 이종금속 접합기술이 요구된다. 전자기 펄스용접은 전자기력을 이용하여 용접대상물을 고속으로 충돌시켜 용접하는 기술로서 열 발생이 적어 재료의 특성차로 인한 결함 및 변형이 발생하지 않아, 이종금속간 고품질 용접이 가능하며, 전자기 펄스 용접부의 품질과 밀접한 관계를 갖는 공정변수 경우 모재와 접합재의 재질 따라 적정 공정변수 범위가 변화되므로 공정에 따른 데이터의 축적은 대단히 중요하다. 전자기 펄스 용접을 이용한 이종금속 접합시 접합부 품질에 영향을 미치는 공정변수는 충전전압, 모재와 접합재 사이의 간격 및 접합재의 직경과 두께의 비(D/T비)로서 보고되었으며, Al/Steel 이종 금속 접합시 이들 공정변수가 접합부에 미치는 영향 및 최적의 공정변수 도출을 위한 연구는 시도되지 않았다. 따라서 본 연구는 전자기 펄스 용접기술을 이용한 Al/Steel 이종금속 접합 실험을 통하여 전자기 펄스용접의 적정성과 최적의 충전전압, 모재와 접합재 사이의 간격, D/T비를 도출하고자 한다. 전자기 펄스 용접 장치는 한국생산기술연구원과 웰메이트(주)에서 공동으로 개발한 $120{\mu}F$의 캐패시터 6개로 구성된 'W-MPW36'을 사용하였으며 이 장치의 최대충전전압과 최대접합용량은 각각 10kV, 36kJ이다. 접합재는 전기 전도율의 높은 Al 1070 파이프를 사용하였으며 모재는 기존 스틸 요크재인 SM45C 환봉을 사용하였다. 기보고된 연구를 통하여 코일과 접합재 사이의 간격이 좁을수록 높은 전자기력이 접합재에 작용하는 것을 확인하였으나 코일내 접합재와 모재 삽입 편의를 위하여 1mm로 설정하였다. 접합부의 품질 평가를 위하여 수압시험을 실시하였으며, 시험 후 접합부 단면을 주사전자현미경(SEM)을 이용하여 관찰하였다.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.11 no.5
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• pp.796-805
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• 2000

A 30GHz band low noise amplifier module, which has linear gain of 30dB and noise figure of 2.6dB, for 30GHz satellite communication transponder was developed by use of MMIC and thin film MIC technologies. Two kinds of MMIC circuits were used for the low noise amplifier module, the first one is ultra low noise MMIC circuit and the other is wideband and high gain MMIC circuit. The pHEMT technology with 0.15$mu extrm{m}$ of gate length was applied for MMIC fabrication. Thin film microstrip lines on alumina substrate were used to interconnect two MMIC chips, and the thick film bias circuit board were developed to provide the stabilized DC bias. The input interface of the low noise amplifier module was designed with waveguide type to receive the signal from antenna directly, and the output port was adopted with K-type coaxial connector for interface with the frequency converter module behind the low noise amplifier module. Space qualified manufacturing processes were applied to manufacture and assemble the low noise amplifier module, and space qualification level of environment tests including thermal and vibration test were performed for it. The developed low noise amplifier was measured to show 30dB of minimum gain, $\pm$0.3dB of gain flatness, and 2.6dB of maximum noise figure over the desired operating frequency range from 30 to 31 GHz.

• Journal of Korea Society of Industrial Information Systems
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• v.12 no.3
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• pp.116-123
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• 2007

Despite the number of backlight manufacturer is increased as the market of flat panel display equipments and related development devices is enlarged, the inspection based on the human eye is still used in many backlight production lines. The defects such as particle, spot and scratch on the light emitting surface of the backlight prevent the LCD device from displaying the colors correctly. From that manual inspection it is difficult to maintain the quality of backlight consistently because the accuracy and the speed of the inspection may change with the physical condition of the operater. In this paper we studied on the development of automatic backlight surface defect inspection system. For this, we made up of the computer vision system and we developed the main program with various user interfaces to operate the inspection system effectively. And we developed the image processing module to extract the defect information. Furthermore, we presented the labeling process to reconstruct defect regions using the labeling table and the defect index. From the experimental results, we found that our system can detect all defect regions identified from human eye and it is sufficient to substitute for the conventional surface inspection.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.75-80
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• 2019

Silicon solar cells have been widely used as a most promising renewable energy source due to eco-friendliness and high efficiency. As modules of silicon solar cells are connected in series for a practical electricity generation, a large voltage of 500-1,500 V is applied to the modules inevitably. Potential-induced degradation (PID), a deterioration of the efficiency and maximum power output by the continuously applied high voltage between the module frames and solar cells, has been regarded as the major cause that reduces the lifetime of silicon solar cells. In particular, the migration of the $Na^+$ ions from the front glass into Si through the anti-reflection coating and the accumulation of $Na^+$ ions at stacking faults inside Si have been reported as the reason of PID. In this research, the thickness effect of $SiO_x$ layer that can block the migration of $Na^+$ ions on the reduction of PID is investigated as it is incorporated between anti-reflection coating and p-n junction in p-type PERC solar cells. From the measurement of shunt resistance, efficiency, and maximum power output after the continuous application of 1,000 V for 96 hours, it is revealed that the thickness of $SiO_x$ layer should be larger than 7-8 nm to reduce PID effectively.

• International Area Studies Review
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• v.21 no.4
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• pp.101-124
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• 2017

This study is to examine the current situation of the AEC (ASEAN Economic Community) and analyze macroeconomic situation of Vietnam since the launch of AEC. According to recent trade indicators, Vietnam is expected to be more productive in the manufacturing and processing sectors because it is at the heart of the global value chains (GVCs) in electronics, telephones, and textiles and shoes industry. Vietnam has signed or is negotiating free trade agreements with various countries around the world including Korea, Israel, EU and RCEP and so on. Therefore, it is expected that Vietnam's trade dependency and FDI inflows to Vietnam increase more and more. However, the fact that the proportion of exports by foreign-invested companies accounts for about 70% of the total exports implies the uncertainty of Vietnam's economy in the future. Attracting FDI investment can further reduce the competitiveness of domestic companies in Vietnam. Therefore, in order for Vietnam to maintain sustainable development in the future, it is necessary to reform the momentum of foreign-invested enterprises to the development of Vietnamese companies.

• Journal of the Korean Institute of Intelligent Systems
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• v.14 no.7
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• pp.914-919
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• 2004

When the motor is rotating, the torque and rpm are varying as the loads or the driving status connecting through reduction units are changing. On the contrary, one can monitor the changes of the loads or the driving status in the manner of measuring motor torque and rpm. There is a torque measuring method using the strain gauge and bridge circuit. But, because this is the contact method, it has the life time which is dependent on rotating velocity and used time. So this system demands on replacement of some Parts or whole system itself for maintenance. And this system is also relatively big and expensive, requiring preceding annoying process. In this paper, we are going to suppose non-contact method to measure torque and rpm using the Hall effects sensor For this we have made the planetary geared reduction motor with Hall sensors and with the monitoring system. The monitoring system displays the sensing data(torque, rpm) and calculated data( power) and also has the network capability with Bluetooth protocol. Our solution is much more inexpensive ;md simple method to measure torque and rpm than before.

• Communications of Mathematical Education
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• v.26 no.2
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• pp.177-203
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• 2012

The purpose of this research was to look at whether small group drawing activities can be applied to learning content that combine mathematics and art, by analyzing the changes in $10^{th}$ grade students' interests in mathematics and particular features of their strategic thinking that were reflected in small group drawing activities using graphs and inequations. The results of the study are as follows: 1. The small group drawing activity using graphs and inequations demonstrated that students interests in mathematics could experience positive changes. 2. The small group drawing activity using graphs and inequations was effective in stimulating the students' strategic thinking skills, which are higher level thinking activities necessary for creating problem solving. As the students went through the whole process of accomplishing a complete goal, the students engaged in integrated thinking activities that brought understandings of basic graphs and inequations together, and were also found to use such higher level thinking functions needed in achieving creative problem solving such as critical thinking, flexible thinking, development-oriented thinking, and inferential thinking. 3. The small group drawing activity using graphs and in equations could be expected to constitute learning content that integrate mathematics and art, and is an effective solution in boosting students' strengths in mathematics by way of activities that consider students' unique cognitive and qualitative peculiarities and through integration with art.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.35.2-35.2
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• 2009

최근 본 연구실에서 무연 솔더를 위한 새로운 Cu-Zn 합금 젖음층을 개발하였다. 전해도금을 통하여 Cu-Zn 합금층을 형성한 뒤 그 위에 Sn-4.0wt% Ag-0.5wt% Cu (SAC 405) 솔더를 리플로 솔더링을 통해 솔더접합부를 형성하였으며 계면에서 생성된 금속간 화합물의 형성 및 성장 거동을 연구하였다. SAC/Cu 시스템의 경우, $150^{\circ}C$에서 시효 처리를 실시하는 동안 솔더와 도금된 Cu 계면에서 $Cu_6Sn_5$ 상과 미세한 공공이 형성된 $Cu_3Sn$ 상이 발견되었다. 반면에 SAC/Cu-Zn 시스템에서는 계면에서 $Cu_6Sn_5$ 상만이 형성되었다. 또한 큰 판상형의 $Ag_3Sn$ 상이 SAC/Cu 시스템에 비해 현저하게 억제되었다. SAC/Cu-Zn 계면에서의 금속간 화합물의 성장 속도가 SAC/Cu 계면에서 형성된 금속간 화합물의 성장 속도보다 느리게 나타났다. Cu-Zn 젖음층의 Zn가 솔더와 Cu-Zn 층 사이에서 Cu와 Sn 원자의 상호 확산을 방해하기 때문이다. 본 연구에서는 Cu와 Cu-Zn 층을 이용한 솔더 접합부의 낙하 충격 신뢰성을 연구하였다. 낙하 충격 시험 시편은 두 개의 인쇄 회로 기판을 SAC 405 솔더볼을 이용하여 리플로를 통해 상호연결 하여 제조되었다. 이 때, 각각의 인쇄 회로 기판의 패드에는 Cu 층과 Cu-Zn층을 전해도금을 통하여 각각 $10{\mu}m$두께의 젖음층을 형성하였다. 낙하 시험 시편을 제조한 뒤, 시효 처리에 대한 낙하 저항 신뢰성의 특성을 연구하기 위해 250, 500 시간동안 시효처리를 한 후 각 조건에서 계면에 형성된 금속간 화합물의 성장 거동을 관찰하였으며, 낙하 충격 시험을 실시하였다. 낙하 시험은 daisy chain으로 연결된 시편의 저항이 100 Ohm 이상 측정되었을 때 중단되도록 하였다. Cu-Zn/SAC/Cu-Zn 시편의 경우 초기 리플로를 하였을 때 불량이 발생하는 평균 낙하 수는 350이며, Cu/SAC/Cu 시편의 평균 낙하수는 200 미만으로 나타났다. Cu/SAC/Cu 시편의 경우, 시효처리 시간이 증가함에 따라 평균 낙하수는 큰 폭으로 감소하였지만, Cu-Zn/SAC/Cu-Zn 시편은 불량이 발생하는 평균 낙하수의 감소폭이 보다 완만하게 나타났다. Cu 층에 Zn를 첨가함으로써 솔더와 젖음층 사이에서 형성된 금속간 화합물의 성장 및 미세 공공의 형성이 억제되었고, 솔더 접합부의 과냉을 감소시킴으로써 큰 판상형의 $Ag_3Sn$ 상의 형성을 억제함으로써 Cu-Zn/SAC/Cu-Zn 솔더 접합부에서 Cu/SAC/Cu 솔더 접합부보다 낙하 충격에 대한 저항성 및 신뢰성이 향상되었다. 이는 무연 솔더에 Zn를 첨가하여 낙하 충격 신뢰성을 향상시킨 것과 동일한 효과를 나타냈음을 확인하였다. 본 연구는 한국 과학 기술 재단의 전자패키지 재료 연구 센터(CEPM)와 지식 경제부의 부품 소재 기술 개발 사업의 지원을 받아 수행되었습니다.