• Journal of the Korean Society for Precision Engineering
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• v.12 no.10
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• pp.113-120
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• 1995

여러가지 두꺼운 복합재료 구조물은 3차원 압축 부하 상태에 노출되는 경우가 발생한다. 이런 경우에 있어 서의 복합재료 압축 강도는 압축 평균 응력을 이용하면 예측이 가능할지도 모른다. 이번 연구 에서는 압축 평균 응력을 이용하여 탄소섬유 강화 복합재료들의 압축 강도를 예측하는 모델을 개발 하고자 한다. 이 모델은 압축강도에 영향을 주는 요소, 초기 misalignment를 고려하였고, 탄소섬유와 수지사이에 접합강도가 임계값을 초과할때 복합재료의 파괴가 일어난다고 가정한다. 또 여라가지 문헌들을 통하여 유압이 접합강도에 미치는 점들을 보여준다. 본 모델을 이용한 예측값들은 가해지는 유압에 따라 증가되며, 실험값들과 비교 분석될 것이다.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Conservation Science in Museum
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• v.7
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• pp.3-10
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• 2006

The bronze bowl with lid excavated from Eunnyeongchong Tumulus in Gyeongju had been united in the past and then damaged. We removed deteriorated adhesive and other impurities from it and reunited it. Some fragments of the artifact has been lost; in particular, only half of the whole main body remains. Therefore, it needed restoration treatment for exhibition and conservation. The lid, relatively much part of which remains, was treated with the method that could easily detach the restored part; the main body with much restored part was united using epoxy resin so that the restored part could well bear the weight of the artifact.

• Polymer(Korea)
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• v.34 no.1
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• pp.52-57
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• 2010

The low viscous epoxy resin(bisphenol F) with carboxylic acid as the reductants was introduced for high performance and reliability in the ACA with a low melting point alloy filler system. The curing characteristics of the epoxy resin and temperature dependant viscosity characteristic of epoxy resin at the melting temperature of LMPA were investigated by dynamic mode of differential scanning calorimetry (DSC) and rheometer, respectively. Based on these thermo-rheological characteristics of epoxy resin and LMPA, the optimum process system was designed. In order to remove the oxide layer on the surface of LMPA particle, three different types of carboxyl acid-based reductant were added to the epoxy resin. The wetting angles were about $18^{\circ}$ for carboxypropyldisilioxane, and $20.3^{\circ}$ for the carboxy-2-methylethylsiloxane, respectively.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2001.10a
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• pp.724-728
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• 2001

In this study, the dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. The dielectric breakdown characteristics origin in epoxy composites were examined and various effects of dielectric breakdown on epoxy composites were also discussed. As a result, first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. And the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since this suggests that silane coupling agent improves interfacial combination and relaxs electric field concentration. Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1%, the applied field value needed to be under 21.5㎹/cm.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.779-783
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• 2002

The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. As a result, first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. And the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since this suggests that silane coupling agent improves interfacial combination and relaxs electric field concentration. Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1%, the applied field value needed to be under 21.5MVcm.

• Journal of the Korean Society for Railway
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• v.17 no.6
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• pp.391-396
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• 2014

In this study, the strength of magnesium-GFRP/epoxy single-lap bonded joints are experimentally evaluated with different end shapes. In order to achieve this, four different single-lap joints with different end shapes are fabricated and the failure load is measured under tensile loading tests. From the test results, the single-lap joint with a square end exhibits the lowest failure load while the single-lap joint with reverse tapering and a spew fillet has the highest stress values. It has 11.1% higher failure strength than the single-lap joint with a square end.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.04a
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• pp.115-119
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• 1992

산업의 발전과 더불어 새로운 재료의 개발에 대한 요구가 날로 증가하고 있으며 이와 같은 요구에 부응하기위하여 각종의 신소재가 개발되고있다. 이들 신소재 중에서 섬유강화 복합재료는 높은 비탄성과 비강도특성 때문에 구조물의 경량화가 요구되는 우주선, 항공기 등에 주로 이용 되어 왔으며 최근에는 복합재료의 가격이 저렴해 지면서 이 재료의 높은 비탄성과 감쇠특성을 이용하고자 스포츠용품 및 기계 부품에도 섬유강화 복합재료의 이용이 증가 되고 있다. 항공기나 고속회전체의 부품을 복합재료로 제작하였을 경우 복합재료를 다른 금속이나 다른 복합재료부품에 접합(joining)시켜야 하는데 이 때문에구조물의 효율은 Joint에서 주로 죄우된다. Joint를 제작하기 위해서는 복합재료의 표면을 가공한 수 Adhesive를 이용하거나 Bolt로 체결하기 위해 구멍 뚫기 작업이 필요하여 드릴링을 하였을때 이 재료가 매우 연마성이 강하여 심한 공구마멸을 일으키며, 드릴의 입구와 출구쪽에서 각 ply들의 박리 현상이 발생하고, 드릴가공된 벽면으로부터 섬유 또는 레진의 탈락현상등이 발생하는 결점을 가지고 있다. 따라서 본 연구에서는 이러한 결점을 최소화하여 고정밀도의 높은 생산성을 얻기위한 가공기술에 대한 자료를 만들고 최적 절삭조건 및 복합재료가공용 드릴의 설계를 위한 지침을 제시하고자 고속도강 표준드릴을 사용하여 유리섬유 에폭시 복합재료및 탄소섬유 에폭시 복합재료의 드릴링 실험에서 절삭조건이 가공면 생성, 공구마멸, 절삭력에 미치는 영향에 대하여 조사하였다.

• Composites Research
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• v.12 no.1
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• pp.19-27
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• 1999

A design development test for carbon/epoxy composite laminates for an aircraft flight control system is performed. The design development test includes moisture absorbing test, tensile, compressive, bearing and lap shear tests. The moisture absorbing behavior for different fiber orientation angles is investigated and the changes in mechanical characteristics are compared. In the in-plane tensile test, the effect of damages such as scratches and impacts is studied. The bearing test is performed for different fastening types. The resulting design allowable stress and environmental load enhancement factor are used for the structural analysis and certification tests for the flight control system.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.