• Restorative Dentistry and Endodontics
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• v.21 no.1
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• pp.107-120
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• 1996

복합레진은 조작이 용이하고 강도가 우수하며 중합시간이 짧고 법랑질과 상아질에 접착이 가능하며 연마성이 뛰어나고 자연스러운 색상을 나타내므로 심미적 수복에 가장 일반적으로 선택되는 재료의 하나이다. 대부분의 복합레진 kit에는 shade guide가 포함되어 있어 이를 기준으로 중합된 후의 복합레진 색조를 예상하여 선택하게 된다. 그러나 이러한 shade guide들은 대개 복합레진이 아닌 plastic으로 제조된 것으로 중합된 복합레진의 실제 색조와는 차이가 생기게 되며 결국 shade guide 자체의 문제점으로 인해 이상적인 색조선택이 어려워진다. 이에 본 연구에서는 국내에 시판되고 있는 5종의 복합레진 제품을 선정하여 분광 광도계를 이용해서 shade guide와 중합된 복합레진 사이의 색조차이를 측정, 비교 연구하였다. 직경 16mm. 두께 1.6mm의 plastic mold에 5종의 광중합형 복합레진(Z100, Prisma TPH, Tetric, Silux Plus, Herculite XR)을 충전하고 응축기에 넣어 압축한 후 제조사의 지시에 따라 광중합기로 중합시킨 후 mold에서 시편을 제거하여 보관했다가 젖은 sandpaper 상에서 순차적으로 연마하였다. shade guide는 step부분을 갈아내어 복합레진 시편과 동일한 두께로 만든후 연마하였다. 분광광도계에 shade guide를 넣고 CIE illuminant D65 하에서 spectral reflectance를 측정하고 해당 색조의 복합레진 시편도 통일한 방법으로 측정하고 $L^*$, $a^*$, $b^*$값과 ${\Delta}E^*$값을 얻은후 분석하여 다음과 같은 결과를 얻었다. 1. Z100의 D3, A3, B2 shade와 Prisma TPH의 B2 shade를 제외한 모든 시편에서 shade guide와 복합레진간에 육안으로 인지할 수 있는 색차(${\Delta}E^*$ > 1.0)가 관찰되었다. 2. 평균적으로 Z100이 가장 적은 색차를 나타내었고 Prisma TPH, Tetric, Silux Plus, Herculite XR 순으로 색차가 증가하였다. 3. Prisma TPH의 A2 shade. Tetric의 W shade. Silux Plus의 YB, U shade, Herculite XR의 L, LY shade는 ${\Delta}E^*$값이 3.3 이상으로 나타났다. 4. Z100, Prisma TPH, Tetric, Silux Plus에서는 복합레진보다 shade guide가 더 높은 $L^*$값을 보이는 경향이 나타났으며, Herculite XR에서만 복합레진이 더 높은 $L^*$값을 나타냈다. 5. 모든 시편에서 $b^*$ 값은 (+)로 관찰되었고, Z100, Prisma TPH, Tetric, Silux Plus의 shade guide는 복합레진에 비해 높은 $b^*$값을 보였다. 6. 모든 시편에서 $a^*$값은 (-)로 관찰되었고. Herculite XR 및 Silux Plus에서는 복합레진이 shade guide 에 비 해 낮은 $a^*$값을 나타냈다.

• The korean journal of orthodontics
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• v.39 no.2
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• pp.95-104
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• 2009

Objective: The purpose of this study was to evaluate the effect of length and shape of cutting flute on mechanical properties of orthodontic mini-implants. Methods: Three types of mini-implants with different flute patterns (Type A with 2.6 mm long flute, Type B with 3.9 mm long and straight flute, Type C with 3.9 mm long and helical flute) were inserted into the biomechanical test blocks (Sawbones Inc., USA) with 2 mm and 4 mm cortical bone thicknesses to test insertion and removal torque. Results: In 4 mm cortical bone thickness, Type C mini-implants showed highest maximum insertion torque, then Type A and Type B in order. Type C also showed shortest total insertion time and highest maximum removal torque, but Type A and B didn't showed statistically significant difference in insertion time and removal torque. In 2 mm cortical bone thickness, there were no significant difference in total insertion time and maximum removal torque in three types of mini-implants, but maximum insertion torque of Type A was higher than two other Types of mini-implants. Conclusions: Consideration about length and shape of cutting flute of mini-implant is also required when the placement site has thick cortical bone.

• Korean Journal of Crystallography
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• v.12 no.2
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• pp.70-75
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• 2001

The purpose of this study is to investigate the effect of V₂O/sub 5/ addition on physical and magnetic properties of NiCuZn ferrite for multi-layer chip inductors. NiCuZn ferrite pastes doped with 0, 0.1, 0.3 and 0.5 wt% V₂O/sub 5/ were prepared and samples of ferrite sheets were prepared by the screen printing method. They were sintered at 870, 880, 890 and 900℃, and then their physical and magnetic properties were analyzed. After sintering at 870℃, the sintered density of the ferrite sheet doped with 0.5wt% V₂O/sub 5/ showed the highest value to 5.08g/cm³due to the best densification by the liquid phase sintering, while the microstructures of ferrite sheets doped with 0.1 and 0.3 wt% V₂O/sub 5/ showed and inhibited grain growth. Irrespective of the sintering temperature, the initial permeability of ferrite sheet doped with 0.5 wt% V₂O/sub 5/ was highest and after sintering beyond 880℃, the quality factor of 0.3 wt% V₂O/sub 5/-doped sample appeared to be highest.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.145-152
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• 2010

This study evaluated the fatigue degradation in a SUS316L specimen using the nonlinear ultrasonic method. The nonlinearity of the ultrasonic wave was estimated by a relative nonlinear parameter defined as the ratio of the amplitudes for the fundamental wave to the second harmonic wave. In the experiment, a measurement system with contact transducers was constructed; reliable measurements were assured by keeping measurement conditions consistent and reducing extra harmonics generated in the measurement system. Two types of SUS316L specimen were used in experiments; a rotating bar fatigue specimen and a tensile fatigue specimen. The fatigue condition used was high cycle fatigue. The former specimen had a cylindrical shape and was used to observe the change in the nonlinear parameter after fatigue accumulation in a specimen. The latter was a plate-shaped specimen and was used to confirm the change in the nonlinear parameter at the position where the fatigue stress was concentrated. The measured nonlinear parameter showed a strong correlation to the damage level in both fatigue tests.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.29-35
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• 2003

The Sn-based lead-free solders with varying microstructure were prepared by changing the cooling rate from the melt. Bulky as-cast SnAg, SnAgCu, and SnCu, alloys were cold rolled and thermally stabilized before the creep tests so that there would be very small amount of microstructural change during creep (TS), and thin specimens were water quenched from the melt (WQ) to simulate microstructures of the as-reflowed solders in flip chips. Cooling rates of the WQ specimens were 140∼150 K/sec, and the resultant $\beta-Sn$ globule size was 5∼10 times smaller than that of the TS specimens. Subsequent creep tests showed that the minimum strain rate of TS specimens was about $10_2$ times higher than that of the WQ specimens. Fractographic analyses showed that creep rupture of the TS-SnAgCu specimens occurred by the nucleation of voids on the $Ag_3Sn$ Sn or $Cu_6Sn_5$ particles in the matrix, their subsequent growth by the power-law creep, and inter-linkage of microcracks to form macrocracks which led to the fast failure. On the other hand, no creep voids were found in the WQ specimens due to the mode III shear rupture coming from the thin specimens geometry.

• Journal of the Korean Society for Nondestructive Testing
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• v.16 no.4
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• pp.215-224
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• 1997

A study has been made to investigate the acoustic emission(AE) behavior during the tensile and fracture tests of an Al-Li 8090 alloy, and to correlate it with the deformation mechanisms as a function of microstructure and plate orientation. Mechanical tests and AE measurements were conducted on the specimens with different microstructures (the ${\delta}'$ phase dominant microstructure and the $S'+{\delta}'$ microstructure) and with different orientations (L and ST). In the ${\delta}'$ structure, continuous emissions were produced in both the L and ST oriented specimens, while only the burst emissions were observed to occur in the $S'+{\delta}'$ structure. It was inferred from the above results that continuous type emissions were mainly attributed to the shearing of coherent ${\delta}'$ precipitates in the ${\delta}'$ structure, while the burst type emissions were produced due to the shearing or microcracking of incoherent S' phase in the $S'+{\delta}'$ structure. As to the effect of plate orientation, the ST oriented specimens showed more burst emissions than the LT oriented ones. A large number of burst emissions produced in the ST specimen were presumably due to the rapid crack propagation along the intergranular boundary located parallel to the crack propagation direction.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.2
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• pp.1-5
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• 2003

In this project, the efficiency of localized heating for micro systems packaging is developed by using a forced potential scheme microheater. Less than 0.2 Mpa contact pressure was used for bonding with a 200 mA current input for $50{\mu}m$ width, $2{\mu}m$ height and $8mm{\times}8mm$, $5mm{\times}5mm$, $3mm{\times}3mm$ sized phosphorus-doped poly-silicon microheater. The temperature can be raised at the bonding region to $800^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3 minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional microheaters. For performing the gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for conducting a gross leak check. The pass ratio of bonded dies was 67%, for conventional localized heating, and 85% for our newly developed FP scheme. The bonding strength was more than 25Mpa for FP scheme packaging, which shows that FP scheme can be a good candidate for micro-scale hermetic packaging.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.16 no.3
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• pp.116-120
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• 2006

We have investigated plasma spray coated $Al_2O_3$ layers on Al-60 series substrates for development of wafer electrostatic chuck in semiconductor dry etching system. Samples were prepared without/with cooling bar on backside of samples, at various distances, and with different powder feed rates. There were many cracks and pores in the $Al_2O_3$ layers coated on Al-60 series substrates without cooling bar on the backside of samples. But the cracks and pores were almost disappeared in the $Al_2O_3$ layers on Al-60 series substrates coated with cooling bar on the back side of samples, 15 g/min. powder feed rate and various 60, 70, 80 mm working distances. Then the surface morphology was not changed with various working distances of 60, 70, 80 mm. When the powder feed rate was changed from 15 g/min to 20 g/min, the crack did not appear, but few pores appeared. Also the $Al_2O_3$ layer was coated with many small splats compared with $Al_2O_3$ layer coated with 15 g/min powder feed rate. The deposited rate of $Al_2O_3$ layer was higher when the process was done without cooling bar on the back side of sample than that with cooling bar on the back side of sample.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.6
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• pp.372-378
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• 2019

Traditional ceramic glazes formulated with copper oxide (CuO) exhibited antibacterial properties on Staphylococcus aureus (Gram Positive) and Escherichia coli (Gram Negative). All the ceramic glazes containing CuO showed antibacterial behavior when fired in reducing atmosphere. However, some of copper glazes presented antibacterial behavior and had no antibacterial properties at all when sintered in an oxidizing atmosphere. To elucidate the antibacterial mechanism, ceramic glazes were studied for phase and microstructure analysis, dissolution behavior and surface zeta potential. Metallic copper was precipitated in the glaze layer when sintered in reducing atmosphere. Less than 0.05 ppm of Cu ion was dissolved from glazes. Ca ion was most dissolved among all the samples. Glaze surface was highly negatively charged when CuO was added over 3 wt.% regardless of the sintering atmosphere. The antibacterial behavior of ceramic glazes seemed to be directly related to the dissolution behavior of cations, but the antibacterial behavior of oxidized specimens was not explained by the dissolution behavior. Surface potential of ceramic glazes appeared to play an auxiliary role in antibacterial properties.

• Composites Research
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• v.28 no.5
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• pp.316-321
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• 2015

This study investigated the effects of microcapsules on mechanical properties and thermal stability of the composite material containing self-healing microcapsules. To this end, tensile specimens and flexural specimens containing melamine-urea-formaldehyde (M-U-F) shell walled microcapsules with diameters of $70{\sim}130{\mu}m$ were manufactured. Varying amount of microcapsules in the specimens was considered: 0 wt%, 0.5 wt%, and 1.0 wt%. The tensile and flexural tests were conducted to evaluate mechanical properties of the specimens containing the microcapsules and the thermogravimetric analysis test was performed to evaluate the thermal stability of the specimens containing the microcapsules. The results show that the tensile strength of the specimens was sensitive to the amount of the microcapsules compared to the tensile modulus even though the tensile modulus of the specimens was not significantly affected by the amount of the microcapsules. However, reduction of the tensile strength was not linearly proportional to the amount of microcapsules; similar results were observed in the flexural test. The weight changes of the specimens containing the microcapsules, as a function of temperature, were similar to those specimens without microcapsules. The thermal stability of the specimens was not affected significantly by the microcapsules embedded in the specimens.