• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.9
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• pp.919-929
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• 2014

In recent, the requirements for the safety to the effects of high power electromagnetic wave have been increased along with the development of electricity and electronic equipments. The small sized electronic devices and the various components have been analyzed by using the full-EM simulation and solving a complete set of Maxwell equation. However, the deterministic approach has a drawback and much limitation in the electromagnetic analysis of an electrically large cavity with a high complexity of the structure. In this paper, statistical theory and topological modeling method are combined to analyze the large cavity with a complex structure. In particular, the PWB(Power Balance) method and BLT(Baum-Liu-Tesche) equation are combined and employed to solve the frequency response to the large-scaled cavity with remarkably reduced time-consumption. For instance, a PCB substrate inside box of box are considered as a large structure with a complexity.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.12
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• pp.4984-4990
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• 2010

In this paper, a Step-down CMOS DC-DC Converter using low power switched capacitor method is designed in a 0.5 ${\mu}m$ technology for the integration of devices. Conventional DC-DC converter is used inductor that can store energy in a magnetic field but have low efficiency because power consumption is caused by magnetic flux. And there were problems with size, weight and price to integrate chip. In this paper, a proposed Inductorless step-down CMOS DC-DC converter of low power using SC method is designed in a 0.5um technology to solve these problems. Designed DC-DC converter have 96% power efficiency with 200kHz frequency by using cadence simulation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.8
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• pp.917-923
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• 2014

Subminiature joining bolts are required for the electronic parts of gadgets such as mobile phones and watch phones. During the miniaturization of bolt heads, it is difficult to obtain sufficient joining force owing to the risk of shear fracture of the bolt head or severe plastic deformation on the bit region. In this study, the maximum joining torque for the bit depth was predicted using finite element analysis. A shear fracture test was conducted on a wire used in bolt forming. The results of this test were subjected to finite element analysis and a fracture criterion was obtained by comparing the experimental and analysis results. The shear fracture of the bolt head during joining was predicted based on the obtained criterion. Furthermore, the maximum joining torque was predicted for various bit depths. Fracture on the boundary between the bolt head and thread was found to occur in lower joining torque as bit depth increases.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.161.2-161.2
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• 2017

희토류계 영구자석은 대부분의 전기, 전자 제품의 핵심부품이며 높은 보자력, $BH_{max}$를 가지고 있어 자기기록저장매체, MEMS(엑츄에이터), 소형센서, 소형모터 등의 응용 분야에 적용시키기 위해 다양한 연구들이 진행되고 있다. 그러나 영구자석에 들어가는 희토류계 원소의 수급의 어려움 및 가격의 문제점으로 친환경 자석으로의 전환 및 희토류나 중희토류를 사용하지 않는 비희토류계 영구자석을 제조 및 개발하는데 많은 연구가 이루어지고 있다. 이 중 Fe-N 계 자성물질인 $Fe_{16}N_2$는 포화 자화 값이 현재까지의 비희토류계 자성물질 중 가장 높은 값(240emu/g)을 나타내며 상대적으로 높은 결정자기이방성 상수를 가지고 있어 비희토류계 영구자석 물질 중 하나로 주목받으며 연구되어지고 있다. 본 연구에서는 $Fe_{16}N_2$ 박막을 얻기 위해 DC Magnetron Sputtering 방법을 이용하여 Si wafer 위에 박막을 증착하고 증착시간에 따라 두께를 제어하여 제조한 후 박막의 미세구조, 상 분석, 자성 특성을 관찰을 통해 최적의 공정 조건을 찾고자 하였다. 증착 시간에 따른 박막의 성장 속도는 일정하게 증가하였으며, 증착 시간의 증가에 따라 박막 내 $Fe_{16}N_2$의 상대적인 분율은 감소하였다. 모든 공정 조건에서 $Fe_3N$, $Fe_4N$, $Fe_{16}N_2$ 상들이 섞여 성장하였으며 XRD를 통한 상분석과 더불어 VSM을 통한 자성 특성을 분석해본 결과 $Fe_{16}N_2$의 분율을 가장 높게 성장된 공정 조건은 증착 시간이 10분이며 박막의 두께가 ${\sim}1{\mu}m$ 일 때, 최적의 조건을 얻을 수 있었으며, 이 때의 자성 특성을 분석한 결과 ~2.45T의 포화 자화 값과 ~1.41T의 잔류 자화 값을 얻을 수 있었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.10a
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• pp.21-25
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• 2001

기계부품의 소형화 , 고속화, 그리고 저공해, 저소음이 요구되는 세계적인 추세에서 정밀가공기술은 기계 및 전자산 업에서 중요한 위치를 차지하게 되었다. 특히, 무심연삭공정(Centerless Grinding)은 높은 생산성과 정확한 치수 형성의 능력이 있어서 원통형상을 가공하는 중요한 생산공정으로 사용되어 왔다. 예컨대 VCR의 소형 축. Computer Disk Drive, 초소형 모터, 연료분사기등은 쎈터레스 연삭공정을 통하여 높은 정밀도를 얻고 있다. 하지만 이 공정의 특수성과 측정의 어려움으로 인하여 이러한 정밀형상의 형성과정은 아직도 잘 밝혀져있지 않다. 무심연연삭 공정에서는 부품이 기계에 고정되어 있지 않고 공작물 받침날 위에 올려져 있으며 조절바퀴와 연삭바퀴 사이에 눌려져 있다. 조절바퀴가 마찰력으로 공작물을 돌려주며 연삭바퀴에서 연삭가공이 일어나게 된다. 조절바퀴와 연삭바퀴사이의 거리는 기계 자체의 탄성변형으로 인하여 항시 변화하게 되며 이 거리의 변화가 공작물의 정밀형상 형성에 결정적인 영향을 미치게 된다. 본 연구에서는 무심연삭공정중 공작물과 받침날, 조절바퀴, 연삭바퀴의 상대운동을 기하학적으로 해석하였다. 특히 간섭조건을 사용하여 실제 공작물의 운동을 해석하여 순간 명목 절삭깊이를 구하였다. 또한 연삭 특성실험식을 이용하여 수직 연삭력을 구하고 연삭기의 탄성변형을 구하여 순간 실제 절삭깊이를 계산하였다. 그로부터 진원도형성에 관한 기본식을 유도하였다. 본 연구에서 유도된 진원도 형성 식을 이용하여 실험과 동일한 조건으로 컴퓨터 시뮬레이션을 수행하였다. 그리고 원형중의 어떤 이상형상, 즉, 홈또는 돌기는 반복되어서 다른 돌기 또는 홈을 형성 하게되며 그 반복주기는 공작물이 조절바퀴와 연삭바퀴위에 떠있는 각도에 따라 결점 됨을 확인하였다.'유창성' 에 그 목표를 두고 있는 점을 감안한다면, 시작단계부터 반드시 정확한 발음을 지녀야 하는 가의 문제도 생각해 볼 필요가 있다. 경우에 따라서는, 정확한 발음은 그 언어에 대한 숙련도가 점차 높아짐에 따라 이와 병행하여 이루어지는 경우도 흔히 경험하는 일이기 때문이다. 결국 초등영어 교육과정에도 명시되어 있듯이 '...영어에 대한 친숙함과 자신감을 심어주고, 영어에 대한 흥미와 관심을 지속적으로 유지시키는 것이 중요하기' 때문에 무엇보다 중요한 측면은 흥미와 관심을 유지시키는 지적인 학습활동보다는 정의적인 학습활동의 전개가 필요하다고 하겠다. 유리된 AA의 세포독설과 관련된 세포내의 역할에 대해 의문이 제기되었다., PCL에 SOD-1도 경미하게 나타났으나, 경련이 나타난 쥐에서는 KA만을 투여한 흰쥐와 구별되지 않았다. 이상의 APT의 항산화 효과는 KA로 인한 뇌세포 변성 개선에 중요한 인자로 작용할 것으로 사료되나, 보다 명확한 APT의 기전을 검색하고 직접 임상에 응응하기 위하여는 보다 다양한 실험 조건이 보완되어야 찰 것으로 생각된다. 항우울약들의 항혈소판작용은 PKC-기질인 41-43 kD와 20 kD의 인산화를 억제함에 기인되는 것으로 사료된다.다. 것으로 사료된다.다.바와 같이 MCl에서 작은 Dv 값을 갖는데, 이것은 CdCl$_{4}$$^{2-}$ 착이온을 형성하거나 ZnCl$_{4}$$^{2-}$ , ZnCl$_{3}$$^{-}$같은 이온과 MgCl$^{+}$, MgCl$_{2}$같은 이온종을 형성하기 때문인것 같다. 한편 어떠한 용리액에서던지 NH$_{4}$

• Journal of the Korea Society for Simulation
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• v.18 no.3
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• pp.73-82
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• 2009

Due to the many advantages including low price, low power consumption, and miniaturization, the CMOS camera has been utilized in many applications, including mobile phones, the automotive industry, medical sciences and sensoring, robotic controls, and research in the security field. In particular, the 360 degree omni-directional camera when utilized in multi-camera applications has displayed issues of software nature, interface communication management, delays, and a complicated image display control. Other issues include energy management problems, and miniaturization of a multi-camera in the hardware field. Traditional CMOS camera systems are comprised of an embedded system that consists of a high-performance MCU enabling a camera to send and receive images and a multi-layer system similar to an individual control system that consists of the camera's high performance Micro Controller Unit. We proposed the SL-AVS (Small Size/Low power Around-View System) to be able to control a camera while collecting image data using a high speed synchronization technique on the foundation of a single layer low performance MCU. It is an initial model of the omni-directional camera that takes images from a 360 view drawing from several CMOS camera utilizing a 110 degree view. We then connected a single MCU with four low-power CMOS cameras and implemented controls that include synchronization, controlling, and transmit/receive functions of individual camera compared with the traditional system. The synchronization of the respective cameras were controlled and then memorized by handling each interrupt through the MCU. We were able to improve the efficiency of data transmission that minimizes re-synchronization amongst a target, the CMOS camera, and the MCU. Further, depending on the choice of users, respective or groups of images divided into 4 domains were then provided with a target. We finally analyzed and compared the performance of the developed camera system including the synchronization and time of data transfer and image data loss, etc.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.27-31
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• 2008

Due to the increasing need for miniaturization of electronic device, embedded resistor technology using thick film resistance paste to embed resistors currently mounted on the board thus effectively reducing board size, is being extensively researched. In this research, thick film resistor paste having $0.35{\sim}4k{\Omega}/sq$ range of resistivity were fabricated using mixtures of carbon black and epoxy resin. In order to adjust the TCR (temperature coefficient resistivity), TCR modifiers such as Ni-Cr alloy, $SiO_2$ powder were added and were able to improve on TCR value with $100ppm/^{\circ}C$. Finally embedded resistor board using thick film resistance paste were fabricated. Stable resistivity value and reliability results were achieved.

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.11 no.4
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• pp.388-393
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• 2018

In this paper, We developed a high efficiency reflector integrated type 50W AC direct connection type engine to realize miniaturization and weight reduction of product without using SMPS and to design a multistage varistor circuit Reduced costs by reducing the number of parts High reliability is achieved by using a circuit structure that does not use an electrolytic capacitor, thus increasing the lifetime of the LED. In addition, it is possible to manufacture an AC direct-coupled type driving device by using an IC semiconductor and apply an AC direct-coupled type driving device integrated with a reflector so that the lifetime of the device can be fully utilized for the lifetime of the LED, A light source having a plurality of light emitting diode channels including a plurality of light emitting diode channels arranged in series is driven with a rectified voltage.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.37 no.8
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• pp.798-804
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• 2009

A high-resolution electro-optical camera system, EOS-C, is under development in Satrec Initiative. This system is the mission payload of a 400-kg Earth observation satellite. We designed this system to give improved opto-mechanical and thermal performance compared with a similar camera system to be flown on the DubaiSat-1 system. The thermal control subsystem (TCS) of the EOS-C system uses heaters to meet the opto-mechanical requirements during in-orbit operation and it uses different thermal coating materials and multi-layer insulation (MLI) blankets to minimize the heater power consumption. We performed its thermal analysis for the mission orbit using a thermal analysis model and the result shows that its TCS satisfies the design requirements.