• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.177-177
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• 2007

ZnO는 3.36eV의 넓은 밴드캡을 가지는 II-IV족 반도체로써 태양전지, LED와 같은 광학적 소자로 이용이 기대가 되는 물질이다. 더욱이, 상온에서의 60meV에 해당하는 큰 엑시톤 에너지와 밴드캡 에지니어링이 가능하다는 장점 때문에 광학적 소자로 널리 이용되고 있는 GaN을 대체할 수 있는 물질로 주목을 받고 있다. 하지만, p-type ZnO는 형성이 어렵고 낮은 이동도와 케리어 농도의 특성을 보이고, 대기 중에 장시간 노출할 경우 n-type ZnO의 특성으로 돌아가는 불안정성을 보이고 있다. 최근에 몇몇의 연구자들에 의해 V족의 원소인 P(phosphorous), N(nitrogen), As(arsenic))를 도핑하여 p-type ZnO의 형성에 대한 논문이 발표되고 있다. 또한, V족 원소 중에 P는 p-type ZnO 형성에 효과적인 도핑 물질로 보고되 고 있다. 본 연구는 마그네트론 스퍼터링을 이용하여 다양한 온도에서 성장된 P도핑 ZnO 박막의 특성에 대해 연구하였다. P도핑된 ZnO 박막은 사파이어 기판에 buffer층을 사용한 Insulator 특성의 ZnO박막위에 400, 500, 600, $700^{\circ}C$에서 성장되 었다. 박막의 특성 분석에는 325nm의 파장을 가지는 He-Cd의 레이져 광원을 사용하여 10K의 저온 PL과 0.5T의 자기장을 사용한 van der Pauw configuration에 의한 Hall effect측정, 그리고 결정성 분석에는 XRD와 TEM을 이용하였다. 상온 Hall-effect 측정 결과, $400{\sim}600^{\circ}C$ 에서 성장된 박막은 n-type의 특성을 보였고, $700^{\circ}C$에서 성장된 Phosphorous 도핑 ZnO박막은 $1.19{\times}10^{17}$의 캐리어 농도를 가지는 p-type의 특성을 보였다. 그리고 XRD분석과 TEM분석을 통하여 박막의 성장온도가 증가 할수록 P도핑된 ZnO박막의 결정성이 향상되는 것을 알 수 있었다. 또한 10K의 저온 PL분석을 통해 p도핑에 의한 액셉터에 관련된 피크들을 관찰할 수 있었다.

• Korean Journal of Materials Research
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• v.21 no.11
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• pp.634-638
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• 2011

We report growth of epitaxial AlN thin films on c-plane sapphire substrates by plasma-assisted molecular beam epitaxy. To achieve two-dimensional growth the substrates were nitrided by nitrogen plasma prior to the AlN growth, which resulted in the formation of a two-dimensional single crystalline AlN layer. The formation of the two-dimensional AlN layer by the nitridation process was confirmed by the observation of streaky reflection high energy electron diffraction (RHEED) patterns. The growth of AlN thin films was performed on the nitrided AlN layer by changing the Al beam flux with the fixed nitrogen flux at 860$^{\circ}C$. The growth mode of AlN films was also affected by the beam flux. By increasing the Al beam flux, two-dimensional growth of AlN films was favored, and a very flat surface with a root mean square roughness of 0.196 nm (for the 2 ${\mu}m$ ${\times}$ 2 ${\mu}m$ area) was obtained. Interestingly, additional diffraction lines were observed for the two-dimensionally grown AlN films, which were probably caused by the Al adlayer, which was similar to a report of Ga adlayer in the two-dimensional growth of GaN. Al droplets were observed in the sample grown with a higher Al beam flux after cooling to room temperature, which resulted from the excessive Al flux.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.4
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• pp.173-178
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• 2019

In this study, we demonstrated a characterization of ${\alpha}-Ga_2O_3$ grown on a cone-shape patterned sapphire substrate by using the halide vapor phase epitaxy. An ${\alpha}-Ga_2O_3$ was grown on different size of PSS and c-plane sapphire substrate for comparison to confirm the effect of PSS. In addition, growth time of ${\alpha}-Ga_2O_3$ was gradually increased to confirm growth mechanism of ${\alpha}-Ga_2O_3$ grown on the PSS. A growth temperature was changed to $470-550^{\circ}C$. It can be analyzed growth conditions and mechanisms on the cone-shape PSS, resulting in a significant decrease in the FWHM value of an asymmetric plane (10-14) of ${\alpha}-Ga_2O_3$, due to lateral growth that occurs during the growth process.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.3
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• pp.83-90
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• 2019

In this paper, Mg-doped AlN epilayers for power semiconductor devices are grown by mixed-source hydride vapor phase epitaxy. Magnesium is used as p-type dopant material in the grown AlN epilayer. The AlN epilayers on the GaN-templated sapphire substrate and GaN-templated-patterned sapphire substrate (PSS), respectively, as the base substrates for device application, were selectively grown. The surface and the crystal structures of the AlN epilayers were investigated by field emission scanning electron microscopy (FE-SEM) and high-resolution-X-ray diffraction (HR-XRD). From the X-ray photoelectron spectroscopy (XPS) and Raman spectra results, the p-type AlN epilayers grown by using the mixed-source HVPE method could be applied to power devices.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.55-60
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• 2021

In order to produce wearable displays with high adhesion while maintaining flexible characteristics, the adhesive method using electro plating method was carried out. Laser lift-off (LLO) transcription was also used to remove sapphire substrates from LEDs bonded to fibers. Afterwards, the SEM and EDS data of the sample, which conducted the adhesion method using electro plating, confirmed that copper actually grows through the lattice of the fiber fabric to secure the light source and fiber. The adhesion characteristics of copper were checked using Universal testing machine (UTM). After plating adhesion, the characteristics of the LLO transcription process completed and the LED without the transcription process were compared using probe station. The electroluminescence (EL) according to the enhanced current was measured to check the characteristics of the light source after the process. As the current increases, the temperature rises and the bandgap decreases, so it was confirmed that the spectrum shifted. In addition, the change in the electrical characteristics of the samples according to the radius change is confirmed using probe station. The radius strain also had mechanical strength that copper could withstand bending stress, so the Vf variation was measured below 6%. Based on these results, it is expected that it will be applied to batteries, catalysts, and solar cells that require flexibility as well as wearable displays, contributing to the development of wearable devices.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.5
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• pp.500-504
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• 2023

In this study, the heteroepitaxial thin film growth of β-Ga₂O₃ was studied according to the position of the susceptor in mist-CVD. The position of the susceptor and substrate was moved step by step from the center of the hot zone to the inlet of mist in the range of 0~50 mm. It was confirmed that the average thickness increased to 292 nm (D1), 521 nm (D2), and 580 nm (D3) as the position of the susceptor moved away from the center of the hot zone region. The thickness of the lower region of the substrate is increased compared to the upper region. The surface roughness of the lower region of the substrate also increased because the nucleation density increased due to the increase in the lifetime of the mist droplets and the increased mist density. Therefore, thin film growth of β-Ga₂O₃ in mist-CVD is performed by appropriately adjusting the position of the susceptor (or substrate) in consideration of the mist velocity, evaporation amount, and temperature difference with the substrate, thereby determining the crystallinity of the thin film, the thickness distribution, and the thickness of the thin film. Therefore, these results can provide insights for optimizing the mist-CVD process and producing high-quality β-Ga₂O₃ thin films for various optical and electronic applications.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.22 no.1
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• pp.5-10
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• 2012

In general, the fabrications of the LEDs with mesa structure are performed grown by MOCVD method. In order to etch and separate each chips, the LEDs are passed the RIE and scribing processes. The RIE process using plasma dry etching occur some problems such as defects, dislocations and the formation of dangling bond in surface result in decline of device characteristic. The SAG method has attracted considerable interest for the growth of high quality GaN epi layer on the sapphire substrate. In this paper, the SAG method was introduced for simplification and fabrication of the high quality epi layer. And we report that the size of selective area do not affect the characteristics of original LED. The diameter of SAG circle patterns were choose as 2500, 1000, 350, and 200 ${\mu}m$. The SAG-LEDs were measured to obtain the device characteristics using by SEM, EL and I-V. The main emission peaks of 2500, 1000, 350, and 200 ${\mu}m$ were 485, 480, 450, and 445 nm respectively. The chips of 350, 200 ${\mu}m$ diameter were observed non-uniform surface and resistance was higher than original LED, however, the chips of 2500, 1000 ${\mu}m$ diameter had uniform surface and current-voltage characteristics were better than small sizes. Therefore, we suggest that the suitable diameter which do not affect the characteristic of original LED is more than 1000 ${\mu}m$.

• Journal of the Korean Vacuum Society
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• v.17 no.1
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• pp.34-39
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• 2008

We have investigated the characteristics of $Al_{0.55}Ga_{0.45}N$/GaN heterostructures with and without low-temperature (LT) AlN interlayer grown by metalorganic chemical vapor deposition. The structural and optical properties were systematically studied by Rutherford backscattering spectroscopy (RBS), X-ray diffraction (XRD), optical microscopy (OMS), scanning electron microscopy (SEM), and photoluminescence (PL). The Al content (x) of 55% and the structural properties of $Al_xGa_{1-x}N$/GaN heterostructures were investigated by using RBS and XRD, respectively. We carried out OMS and SEM experiments and obtained a decrease of the crack network in $Al_{0.55}Ga_{0.45}N$ layer with LT-AlN interlayer. A two-dimensional electron gas (2DEG)-related PL peak located at ${\sim}3.437eV$ was observed at 10 K for $Al_{0.55}Ga_{0.45}N$/GaN with LT-AlN interlayer. The 2DEG-related emission intensity gradually decreased with increasing temperature and disappeared at temperatures around 100 K. In addition, with increasing the excitation power above 3.0 mW, two 2DEG-related PL peaks were observed at ${\sim}3.411$ and ${\sim}3.437eV$. The observed lower-energy and higher-energy side 2DEG peaks were attributed to the transitions from the sub-band level and the Fermi energy level of 2DEG at the AlGaN/LT-AlN/GaN heterointerface, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.425-426
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• 2013

IIIN계 물질 기반의 광 반도체는 직접 천이형 넓은 밴드갭 구조를 갖고 있기 때문에 적외선부터 가시광선 및 자외선까지를 포함한 폭 넓은 발광파장 조절이 가능하여 조명 및 디스플레이 관련 차세대 광원으로 많은 관심을 받고 있다. 일반적인 청색 및 녹색 발광영역의 활성층으로는 InGaN/GaN 다중양자우물구조를 사용하고 있으나, 장파장의 녹색 발광을 얻기 위해서는 인듐의 함유량이 증가하여야 한다. 하지만, 인듐의 함유량이 증가함에 따라서 InGaN/GaN 다중양자우물 구조내에서 인듐의 편석현상의 발생이 용이하게 되어 계면 특성을 저하할 뿐 아니라, 비발광 센터를 증가하여 발광 효율을 급격히 감소시키는 원인이 되고 있다. 또한, InGaN과 GaN의 큰 성장온도의 차이에 따라 800도 부근의 저온 영역에서 성장된 InGaN층이 1,000도 이상의 고온 영역에서 GaN층이 성장시 InGaN층의 열화 현상이 급격히 발생되고 있다. 이를 억제하기 위해서 금속유기화학증착법의 성장 변수 최적화, 응력제어, 도핑 등의 편석 억제기술 및 보호층이 사용되고 있다. 본 연구에서는 인듐함유량이 증가된 녹색 InGaN/GaN 다중양자우물구조에서 InGaN 우물층 상하부에 도입된 GaN 보호층에 따라 발생되는 양자우물구조의 광학 및 결정학적 특성 분석을 통해 GaN 보호층의 역할을 분석하고자 한다. 본 연구에서는 금속유기화학증착장치를 이용하여 사파이어 기판위에 GaN 템플릿을 성장하고, n-형 GaN, InGaN/GaN 다중양자우물구조 및 p-형 층을 성장하였다. 앞선 언급하였듯이, InGaN/GaN 다중양자우물구조내에 GaN 보호층의 역할을 규명하기 위하여 샘플 A의 경우는 보호층이 전혀 없는 구조이고, 샘플 B의 경우는 InGaN 우물층의 상단부에만, 샘플 C의 경우에는 우물층 상부 및 하단부 모두에 약 2.0 nm 두께의 GaN 보호층을 형성하였다. 이 보호층의 유무에 따른 다중양자우물구조의 계면 특성을 확인하기 위한 X-선 회절을 이용하였고, 광학적 특성을 확인하고 상온 포토루미네선스법을 이용하여 녹색 발광 파장의 변화 및 발광세기를 관찰하였다. 우선적으로, 상온 포토루미네선스법을 이용하여 각 샘플의 발광특성을 확인한 바 상하부 모두에 GaN 보호층이 존재하는 샘플 C의 경우 약 510 nm 부근에서 발광이 관찰되었지만, 상단부에 GaN 보호층이 존재하는 샘플 B는 약 495 nm영역에 발광이 확인되었다. 특히, 전혀 보호층이 존재하지 않는 샘플 A의 경우 약 440 nm에서 발광하는 현상을 관찰하였다. 이는 우물층 상단부 및 하단부에 존재하는 GaN 보호층이 In의 확산을 억제하는 것으로 판단된다. 또한, 발광파장 및 세기를 확인한 바, 보호층의 존재하지 않을수록 단파장화가 발생함에도 불구하고 발광세기는 급격히 약해지는 것으로 보아 계면특성이 저하되어 비발광센터가 증가되는 것으로 판단된다. 이를 구조적으로 확인하기 위하여 X-선 회절법을 통한 ${\omega}$/$2{\Theta}$ 스캔의 결과는 In의 0차 피크가 GaN 보호층이 없을 경우 GaN의 피크 방향으로 이동하는 것으로 보아 GaN 보호층은 우물층 성장 후 GaN 장벽층을 성장하기 위해 온도를 증가시키는 과정에서 In의 확산되는 것으로 판단된다. 또한, 하부 GaN 보호층의 경우 GaN 장벽층 성장 후 온도를 감소시키는 과정에서 성장되므로, 우물층으로부터 In의 탈착현상이 아닌 장벽층과의 상호 확산으로 판단된다. 또한, 계면특성을 확인하기 위해 InGaN의 X-선 위성 피크를 확인한 바 샘플 A의 경우 매우 넓고 약한 피크가 관찰된 반면, 보호층이 존재하는 샘플 B와 C의 경우 강하고 얇은 피크가 확인되었다. 이는 GaN 보호층의 도입으로 인해 계면특성이 향상되는 것으로 판단된다. 따라서, 우리는 InGaN/GaN 다중양자우물구조에서 GaN 보호층은 상부의 열화 억제 뿐아니라, 하부의 장벽층 및 우물층 사이의 상호확산을 억제하는 GaN 보호층의 도입을 통하여 우수한 계면 특성 및 비발광센터의 억제를 얻을 수 있을 것으로 생각되며, 이는 향후 GaN계 발광다이오드의 전계 발광특성을 증가하여 우수한 발광소자를 개발할 수 있을 것으로 기대된다.

• Journal of the Korean Vacuum Society
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• v.17 no.4
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• pp.359-364
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• 2008

We have investigated optical and structural properties of $Al_{0.3}Ga_{0.7}N$/GaN and $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ heterostructures (HSs) grown by metal-organic chemical vapor deposition, by means of Hall measurement, high-resolution X-ray diffraction, and temperature- and excitation power-dependent photoluminescence (PL) spectroscopy. A strong GaN band edge emission and its longitudinal optical phonon replicas were observed for all the samples. At 10 K, a 2DEG-related PL peak located at ${\sim}\;3.445\;eV$ was observed for $Al_{0.3}Ga_{0.7}N$/GaN HS, while two 2DEG peaks at ${\sim}\;3.42$ and ${\sim}\;3.445\;eV$ were observed for $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ HS due to the additional $Al_{0.15}Ga_{0.85}N$ layers. Moreover, the emission intensity of the 2DEG peak was higher in $Al_{0.3}Ga_{0.7}N/GaN/Al_{0.15}Ga_{0.85}N/GaN$ HS than in $Al_{0.3}Ga_{0.7}N$/GaN HS probably due to an effective confinement of the photo-excited holes by the additional $Al_{0.15}Ga_{0.85}N$ layers. The 2DEG-related emission intensity decreased with increasing temperature and disappeared at temperatures above 150 K. To investigate the origin of the new 2DEG peaks, the energy-band structure for multiple AlGaN/GaN HSs were simulated and compared with the experimental data. As a result, the observed high- and low-energy peaks of 2DEG can be attributed to the spatially-separated 2DEG emissions formed at different AlGaN/GaN heterointerfaces.