• Proceedings of the Korea Database Society Conference
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• 1999.06a
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• pp.477-486
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• 1999

1990년대 중반에 한국기업에 도입된 ERP 시스템은 현재 많은 기업에서 현업에 활용되고 있거나 혹은 도입 의사결정을 하고 있는 상태이다. 특히 IMF 구제금융 이후 ERP 시스템은 단순한 효율성제고의 차원을 넘어 기업의 생존전략 및 경쟁력제고전략의 수단으로 활용되고 있는 추세이다. ERP시스템이 이렇게 전략적 차원의 수단으로 활용되고 있는 가장 중요한 요인은 ERP시스템이 기존의 수주개발시스템과 단위패키지시스템과 비교할 때, 시스템 통합에 기반한 양질의 비즈니스 프로세스를 제공하고 있다는 점과, 투자비용이 비교적 적고 개발기간이 비교적 짧다는 점을 들 수 있다. ERP의 발전과정은 기능별 시스템의 통합과정으로 이해할 수 있고, 또한 ERP시스템과 기존의 수주개발시스템 또는 단위패키지시스템의 가장 뚜렷한 차이가 바로 통합이라는 사실을 상기할 때, ERP시스템의 최대 가치는 통합에 있다. 한편 거대한 기업정보시스템의 통합을 가능하게 한 것은 바로 고급정보기술이다.(중략)

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.3
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• pp.35-39
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• 2023

ESG (Environment, Social, Governance) has become a major guideline for many companies to improve corporate value and enable sustainable management. Among them, the environment requires a technological approach. This is because technological solutions are needed to reduce or prevent environmental pollution and save energy. Semiconductor package technology has been developed to better satisfy the essential roles of semiconductor packaging: chip protection, electrical/mechanical connection, and heat dissipation. Accordingly, technologies have been developed to improve heat dissipation effect, improve electrical/mechanical properties, improve chip protection reliability, stacking and miniaturization, and reduce costs. Among them, heat dissipation technology increases thermal efficiency and reduces energy consumption for cooling. Also, technology to improve electrical characteristics has had an impact on the environment by reducing energy consumption. Technologies that recycling or reducing material consumption reduce environmental pollution. And technologies that replace environmentally harmful substances contribute to environmental improvement, in particular. In this paper, I summarize trends in semiconductor package technologies to prevent pollution and improve environment.

• The Korean Journal of Archival Studies
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• no.16
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• pp.97-146
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• 2007

Those days when people used paper to make up and manage all kinds of documents in the process of their jobs are gone now. Today electronic types of documents have replaced paper. Unlike paper documents, electronic ones contribute to the maximum job efficiency with their convenience in production and storage. But they too have some disadvantages; it's difficult to distinguish originals and copies like paper documents; it's not easy to examine if there is a change or damage to the documents; they are also prone to alteration and damage by the external influences in the electronic environment; and electronic documents require enormous amounts of workforce and costs for immediate measures to be taken according to the changes to the S/W and H/W environment. Despite all those weaknesses, however, electronic documents increasingly account for more percentage in the current job environment thanks to their job convenience and efficiency of production costs. Both the government and private sector have made efforts to come up with plans to maximize their advantages and minimize their risks at the same time. One of the methods is the Authorized Retention Center which is described in the study. There are a couple of prerequisites for its smooth operation; they should guarantee the legal validity of electronic documents in the administrative aspects and first secure the reliability and authenticity of electronic documents in the technological aspects. Responding to those needs, the Ministry of Commerce, Industry and Energy and the Korea Institute for Electronic Commerce, which were the two main bodies to drive the Authorized Retention Center project, revised the Electronic Commerce Act and supplemented the provisions to guarantee the legal validity of electronic documents in 2005 and conducted researches on the ways to preserve electronic documents for a long term and secure their reliability, which had been demanded by the users of the center, in 2006. In an attempt to fulfill those goals of the Authorized Retention Center, this study researched technical standard for electronic record information package of the center and applied the ISO 14721 information package model that's the standard for the long-term preservation of digital data. It also suggested a process to produce and manage information package so that there would be the SIP, AIP and DIP metadata features for the production, preservation, and utilization by users points of electronic documents and they could be implemented according to the center's policies. Based on the previous study, the study introduced the flow charts among the production and progress process, application methods and packages of technical standard for electronic record information package at the center and suggested some issues that should be consistently researched in the field of records management based on the results.

• Korean Journal of Construction Engineering and Management
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• v.15 no.5
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• pp.3-12
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• 2014

With the scale of program management getting larger and complexity, More accurate and precise method for management cost estimate is demanded. However, most of project management cost estimates are based on similar cases and hence can not reflect distinct features of each project. Cost estimate precision is also not up to the standards, and also troublesome to policy-making and budget allocation. Therefore, project typical model for cost estimate of Comprehensive Project Management is developed, and makes it easier to manage level of effort and allocate cost by applying characteristic factor of each project. This study categorized the project package by phase; planning, detailed design, and bid procurement, to develop typical model. And by designating specific level of effort required for each field and rank, the study aims to improve the method for calculating the detailed and objective program cost. Outcome of this study will prevent conflicts between client and contractor, accurately calculate program management contract cost for the client, and become a reference for the contractor to receive rational and practical payments for their work.

• Journal of the Korea Society of Computer and Information
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• v.14 no.10
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• pp.149-157
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• 2009

This study aims to empirically examine the factors influencing mobile channel loyalty. This study has been reviewed various theoretical research relating to mobile channel loyalty and transaction cost theory. The model was tested Structural Equation Modeling(SEM) using AMOS 7.0 analysis on the sample collected from 240 respondents. The result of hypothesis testing is as follows. First, asset specificity, uncertainty and transaction frequency were influenced by chanel satisfaction. Second, asset specificity was influenced negatively by chanel preference. Third, chanel satisfaction was influenced positively by chanel preference. Finally, chanel satisfaction and chanel preference were influenced positively by chanel loyalty.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.31-35
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• 2013

TSOP(Thin Small Outline Package) is the IC package using lead frame, which is the type of low cost package for white electronics, auto mobile, desktop PC, and so on. Its performance is not excellent compared to BGA or flip-chip CSP, but it has been used mostly because of low price of TSOP package. However, it has been issued in TSOP package that thermal deflection of lead frame occurs frequently during molding process and Au wire between semiconductor die and pad is debonded. It has been required to solve this problem through substituting materials with low CTE and improving structure of lead frame. We focused on developing the lead frame structure having thermal stability, which was carried out by numerical analysis in this study. Thermal deflection of lead frame in TSOP package was simulated with positions of anti-deflection adhesives, which was ranging 198 um~366 um from semiconductor die. It was definitely understood that thermal deflection of TSOP package with anti-deflection adhesives was improved as 30.738 um in the case of inside(198 um), which was compared to that of the conventional TSOP package. This result is caused by that the anti-deflection adhesives is contributed to restrict thermal expansion of lead frame. Therefore, it is expected that the anti-deflection adhesives can be applied to lead frame packages and enhance their thermal deflection without any change of substitutive materials with low CTE.

• Proceedings of the Korea Society for Industrial Systems Conference
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• 2000.05a
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• pp.145-149
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• 2000

표본조사 교육의 효과적인 학습을 위하여 컴퓨터를 이용한 다양한 표본조사 기법들과 이에 따른 추정이론들을 비교 분석하는 소프트웨어를 개발하고자 한다. 또한 일반적인 표본조사 실습에는 시간과 비용이 많이 들게 되므로 충분한 실습을 하기 어렵다. 따라서 본 연구에서는 이러한 문제점을 극복하기 위하여 사용자에게 사용이 편리한 멀티미디어 툴과 멀티미디어 툴에서의 한계인 수학적 계산은 통계 패키지를 이용하여 보다 사용하기 쉽고 실시간에 모수추정이 가능한 표본조사 실습 프로그램을 개발하데 목적으로 하였다.

• Proceedings of the KAIS Fall Conference
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• 2002.11a
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• pp.152-154
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• 2002

중소기업이 업무 통합 시스템인 ERP패키지를 구입하여 이를 자사에 커스터마이징하는 비용은 과도하다. 본 논문에서는 스프레드시트 수준에서 처리하고 있는 중소기업의 업무를 통합하여 신속, 원활하게 수행할 수 있는 ERP수준의 전산시스템을 웹에 기반하여 설계하고 구현한다. 먼저, 각종 업무에서 사용되는 스프레드시트를 분석하여 통합 데이터베이스를 설계/구축하고, 구축된 데이터베이스와 연동을 갖는 업무 관리프로그램을 설계/구현한다. 개발된 시스템은 각 업무간에 완벽한 통합성을 제공하고, 인터넷상에서 사용 할 수 있는 장점을 제공한다.

• Proceedings of the Korean Information Science Society Conference
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• 1998.10b
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• pp.571-572
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• 1998

인터넷의 급속한 보급과 웹 인터페이스를 기반으로 하는 사내 전산 시스템인 인트라넷(Intranet) 어플리케이션 개발이 보편화되고 있다. 그러나 인트라넷 도입에는 기존 시스템 및 데이터베이스와의 연동, 사내의 고유한 업무흐름(Workflow), 성능 및 보안 요구사항이 있어 패키지 형태의 인트라넷 제품은 그 확장성와 적용성에 한계를 가지고 있다. 본 논문에서는 인트라넷 어플리케이션 개발에 재사용될 수 있는 공통 기능 모듈들을 재사용 신기술인 '객체지향 프레임워크' 방식을 적용함으로써, 기업에서 인트라넷 어플리케이션을 개발할 때에 비용이나 기간을 단축하여 높은 효율을 갖고자 한다.