• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.297-297
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• 2011

일반적으로 고출력 반도체 레이저 다이오드는 발진 파장 및 광출력에 따라 다양한 분야에 응용되고 있으며, 특히 발진파장이 808 nm 대역인 고출력 레이저 다이오드의 경우 재료가공, 펌핌용 광원, 의료 분야 등 다양한 응용분야를 가진 광원 중의 하나라고 할 수 있다. 808 nm 대역의 레이저 다이오드 제작에는 현재 InGaAsP/InGaP/GaAs 및 InGaAlAs/GaAs 양자우물을 이용하여 제작되고 있으나 양자우물과 이를 둘러싸는 장벽물질간의 band-offset이 적어 효율적인 고출력 레이저 다이오드의 제작에 다소 어려움이 있기 때문에 강한 캐리어 구속 효과를 지니는 양자점 혹은 양자대쉬 구조를 사용하는 것이 고출력 레이저 다이오드를 제작할 수 있는 한 방법이다. 실험에 사용된 InP/InGaP 양자구조는 Riber사의 compact21 MBE 장치를 사용하여 성장하였으며 GaAs기판을 620-630도에서 가열하여 표면의 산화층을 제거하고 580도에서 약 100 nm 두께의 GaAs 버퍼층 및 50 nm 두께의 InGaP층을 성장하였다. 양자 구조는 MEE (migration enhanced epitaxy) 방식으로 성장되었는데, 이는 InP/InGaP 의 lattice mismatch율이 작아 양자 구조 형성이 어렵기 때문에 InP/InGaP 양자 구조 성장에 적합하다고 생각하였으며, Indium 2초, growth interuption time 10초, phosphorous 2초 그리고 growth interuption time 10초를 하나의 시퀀스로 보고, 그 시퀀스를 반복하여 양자 구조를 성장하였다. 본 실험에 사용된 P 소스는 Riber사의 KPC-250 P-valved cracker모델을 사용하였으며 InP의 성장률은 0.985${\AA}/s$이다. InP/InGaP 양자구조 성장 중에, 성장 온도, 시퀀스 수의 변화 등 다양한 조건을 변화 시켜 샘플을 성장시켰고, 양자 구조 성장을 확인하기 위하여 AFM 및 SEM을 통해 구조적 분석을 하였으며 PL 측정을 통해 광학적 분석을 진행하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.8.2-8.2
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• 2009

구리(Cu)-인듐(In)-갈륨(Ga)-셀레늄(Se)의 4 원소 화합물 반도체인 Cu(InGa)$Se_2$ (CIGS) 태양전지 세계 최고 셀효율은 2008년 현재 19.9% 로서 박막형 태양전지 중 가장 높은 효율을 보이고 있다. 이는 다결정(폴리) 실리콘 태양전지의 20.3%와 대등한 수준이다. 이 CIGS 태양전지는 제조단가를 표준 결정형 실리콘 태양전지 대비 50% 대로 획기적으로 낮출 수 있어 가장 경쟁력이 있는 차세대 재료로 꼽히고 있다. 본 연구에서는 CIGS태양전지를 고진공 물리 증작법으로 제작하였으며 표면과 박막의 순도를 외부오염을 방지하기 위하여 후면전극, 광흡수체 및 전면전극을 동일 진공에서 제작할 수 있는 멀티 챔버 클러스터 증착 시스템을 이용하였다. 기판으로 소다라 임유리, 후면전극으로 Mo, 전면전극으로 I-ZnO/Al:ZnO 및 ITO를 이용하였다. 버퍼층으로 CdS를 chemical bath deposition (CBD)를 이용하였다. 소자는 무반사막을 사용하지 않고 Al/Ni전극 그리드를 이용하였다. 이 소자로부터 0.22 $cm^2$에서 16%의 효율을 얻었다. 각 박막층 간 계면의 분석을 전기적인 특성, ellisometry에 의한 광특성, 표면과 결정성에 대한 SEM 및 XRD의 특성을 보고한다. 또한, 대표적 화합물 반도체 박막 태양전지인 CIGS 태양전지의 기술의 현황, 학문적인 과제 및 실용화의 문제점을 발표하기로 한다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2012.05a
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• pp.686-689
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• 2012

In this paper, the GaN-based LED characteristics are analyzed using ISE-TCAD. The LED consists of GaN barriers, active region of InGaN quantum well, AlGaN EBL(Electron Blocking Layer) and AlGaN HBL(Hole Blocking Layer) on GaN buffer layer. The output power characteristics of LED considering Auger recombination rate, thickness of quantum well and number of quantum wells are analyzed and some criteria for the design of LED are proposed.

• Journal of the Korea Society of Computer and Information
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• v.9 no.1
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• pp.9-15
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• 2004

New WSW(Wrap Side Wall) is proposed to decrease junction electric field in this paper. WSW process is fabricated after first gate etch, followed NM1 ion implantation and deposition & etch nitride layer. New WSW structure has buffer layer to decrease electric field. Also we compared the hot carrier characteristics of WSW and conventional. Also, we design a test pattern including pulse generator, level shifter and frequency divider, so that we can evaluate AC hot carrier degradation on-chip. It came to light that the universality of the hot carrier degradation between DC and AC stress condition exists, which indicates that the device degradation comes from the same physical mechanism for both AC and DC stress. From this universality, AC lifetime under circuit operation condition can be estimated from DC hot carrier degradation characteristics.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.10
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• pp.1702-1705
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• 2016

We propose a novel hydrogen-reduced p-type amorphous silicon oxide buffer layer between $TiO_2$ antireflection layer and p-type silicon window layer of silicon thin film solar cells. This new buffer layer can protect underlying the $TiO_2$ by suppressing hydrogen plasma, which could be made by excluding $H_2$ gas introduction during plasma deposition. Amorphous silicon oxide thin film solar cells with employing the new buffer layer exhibited better conversion efficiency (8.10 %) compared with the standard cell (7.88 %) without the buffer layer. This new buffer layer can be processed in the same p-chamber with in-situ mode before depositing main p-type amorphous silicon oxide window layer. Comparing with state-of-the-art buffer layer of AZO/p-nc-SiOx:H, our new buffer layer can be processed with cost-effective, much simple process based on similar device performances.

• Journal of the Korean Applied Science and Technology
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• v.19 no.1
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• pp.68-72
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• 2002

We have seen the effects of buffer layer in organic light-emitting diodes(OLEDs) using poly(N-vinylcarbazole)(PVK) depending on a concentration of PVK. Polymer PVK buffer layer was made using spin casting technique. Two device structures were fabricated; one is ITO/TPD/$Alq_{3}$/Al as a reference, and the other is ITO/PVK/TPD/$Alq_{3}$/Al to see the effects of buffer layer in organic light-emitting diodes. Current-voltage-luminance characteristics and an external quantum efficiency were measured with a variation of spin-casting rpm speeds and PVK concentration. We have obtained an improvement of external quantum efficiency by a factor of four when the PVK concentration is 0.1wt% is used. The improvement of efficiency is expected due to a function of hole-blocking of PVK in OLEDs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.174-177
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• 2001

We have seen the effects of buffer layer in organic light-emitting diodes using poly(N-vinylcarbazole)(PVK). Polymer PVK buffer layer was made using spin casting techniques. Two different types of spin casting have been applied; static coating and dynamic coating. Two device structures were fabricated; one is ITO/TPD/Alq$_3$/Al as a reference, and the other is ITO/PVK/TPD/Alq$_3$/Al to see the effects of buffer layer in organic light-emitting diodes. Current-voltage characteristics and luminous efficiency were measured with a variation of spin-casting methods and rpm speeds. We have obtained an improvement of luminous efficiency by a factor of two and half when the PVK buffer layer is used.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.305-309
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• 2002

We have successfully fabricated a Metal-Ferroelectric-Insulator-Semiconductor (MFIS) structure using Bi$\sub$4-x/La$\sub$x/Ti$_3$O$\sub$12/ (BLT) ferroelectric thin film and SiO$_2$/Nitride/SiO$_2$ (ONO) stacked buffer layers for single transistor type ferroelectric nonvolatile memory applications. BLT films were deposited on 15 nm-thick ONO buffer layer by sol-gel spin-coating. The dielectric constant and the leakage current density of prepared ONO film were measured to be 5.6 and 1.0 x 10$\^$-8/ A/$\textrm{cm}^2$ at 2MV/cm, respectively, It was interesting to note that the crystallographic orientations of BLT thin films were strongly effected by pre-bake temperatures. X-ray diffraction patterns showed that (117) crystallites were mainly detected in the BLT film if pre-baked below 400$^{\circ}C$. Whereas, for the films pre-baked above 500$^{\circ}C$, the crystallites with preferred c-axis orientation were mainly detected. From the C-V measurement of the MFIS capacitor with c-axis oriented BLT films, the memory window of 0.6 V was obtained at a voltage sweep of ${\pm}$8 V, which evidently reflects the ferroelectric memory effect of a BLT/ONO/Si structure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.768-771
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• 2004

Pb0.5,Sr0.5TiO3(PST) thin films were deposited on Si with MgO (100) buffer layer by the alkoxide-based sol-gel method. Structural and dielectric properties of PST thin films for the tunable microwave device applications were investigated. For the MgO/Si buffer layer, the PST thin films exhibited highly (100) orientation. The MgO buffer layer affects the stress state of the (100)-oriented PST thin films. The dielectric constant, tunability, and FOM of the highly (100)-oriented PST thin film increased with increasing annealing temperature due to the decrease in lattice distortion. The differences in dielectric properties may be attributed to the change in the film stress. The dielectric constants, dielectric loss and tunability of the PST thin films deposited on the MgO/Si substrates measured at 10 kHz were 822, 0.025, and 80.1%, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.7
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• pp.491-495
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• 2012

The effects of various buffer layers on the $In_2O_3$ transparent conducting films grown on glass substrates by radio-frequency reactive magnetron sputtering were investigated. The $In_2O_3$ thin films were deposited at $400^{\circ}C$ of growth temperature and 100% of oxygen flow rate. The optical, electrical, and structural and morphological properties of the $In_2O_3$ thin films subjected to buffer layers were examined by using ultraviolet-visible spectrophotometer, Hall-effect measurements, and X-ray diffractometer, respectively. The properties of $In_2O_3$ thin films showed different results, depending on the type of buffer layer. As for the $In_2O_3$ thin film deposited on ZnO buffer layer, the average transmittance was 89% and the electrical resistivity was $7.4{\times}10^{-3}\;{\Omega}cm$. The experimental results provide a way for growing the transparent conducting film with the optimum condition by using an appropriate buffer layer.