• Title/Summary/Keyword: 방열핀

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A Study on the radiant Heat Characteristic According to Type and Array of LED Lighting Heatsink (LED 조명등 히트싱크 형상과 배열에 따른 방열특성에 관한 연구)

  • Jang, Hyun;Suh, Jeong Se;Yi, Chung Seob
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.3
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    • pp.54-60
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    • 2013
  • Numerical analysis of the radiant heat characteristic around heatsink according to arrangement and shape of fin on 60W-LED lamp is conducted in this study. In the case of top blow blowing from upper side on LED lamp, there is just little difference in cooling characteristics according to the height of fin. On the other hand, the fin arranged side by side has the advantage of heat transfer enhancement by comparing with zig-zag type because it leads to more loss of flow. In case of making fin round to increase the amount of heat transfer, designing arrangement with the minimized loss of flow has the advantage of characteristic.

Development of a PTC Heater for Supplementary Heating in a Diesel Vehicle (디젤 차량의 보조 난방을 위한 PTC 히터 개발)

  • Shin, Yoon Hyuk;Kim, Sung Chul
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.2
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    • pp.666-671
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    • 2014
  • Using positive temperature coefficient (PTC) heater as supplementary heating for diesel engine vehicles with low heat source is a good method to enhance the heating performance during cold start. In this study, the PTC elements were made by using screen printing process for forming ohmic contact layer, and prototype of PTC heater was designed and made for a diesel engine vehicle. In process of designing the PTC heater, the thermal flow analysis of PTC element modules was conducted for verifying the effect of the shapes of contact surface between each of the components (cooling fin, insulator, ceramic element). We also investigated the performance characteristic (heating capacity, energy efficiency, pressure drop) of the PTC heater through the experiments. Therefore, the experimental results indicated that prototype of PTC heater had satisfactory performance. This study will be basis for improving the manufacturing process and increasing the performance of the PTC element and heater.

A Numerical Study of the Effects of Heat Transfer and Fluid Flow on Tube Insertion Length in Computer-Cooling Radiators (컴퓨터 CPU 냉각용 방열기 튜브 삽입길이에 따른 열유동 해석)

  • Choi, Jin-Tae;Kwon, Oh-Kyung;Yun, Jae-Ho;Kim, Yong-Chan
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.35 no.2
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    • pp.145-152
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    • 2011
  • The performance of flat-tube radiators with louvered fins was numerically investigated for different tube insertion lengths. The results of numerical analysis using CFX-11 were compared with experimental results. In this study, three types of flat-tube radiators with louvered fins were considered. An experiment was conducted to validate the numerical results. Flow rate ratio (FR) and Stotal were introduced to understand the uniformity of flow distribution easily. The results of numerical analysis revealed that the heat transfer rate and pressure drop increased as the mass flow rate increased. Further, the results showed that the heat transfer rate of sample 3 with h/D = 0.5 was higher than that of the other samples. The pressure drop increased as the insertion length toward the header part increased, and the pressure drop in the case of sample 3 appeared to be the highest. The factor Stotal showed that the uniformity of the flow distribution in the case of sample 1 with h/D = 0 was higher than that in the case of the other samples.

High Thermal Conductivity h-BN/PVA Composite Films for High Power Electronic Packaging Substrate (고출력 전자 패키지 기판용 고열전도 h-BN/PVA 복합필름)

  • Lee, Seong Tae;Kim, Chi Heon;Kim, Hyo Tae
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.95-99
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    • 2018
  • High thermal conductivity films with electrically insulating properties have a great potential for the effective heat transfer as substrate and thermal interface materials in high density and high power electronic packages. There have been lots of studies to achieve high thermal conductivity composites using high thermal conductivity fillers such alumina, aluminum nitride, boron nitride, CNT and graphene, recently. Among them, hexagonal-boron nitride (h-BN) nano-sheet is a promising candidate for high thermal conductivity with electrically insulating filler material. This work presents an enhanced heat transfer properties of ceramic/polymer composite films using h-BN nano-sheets and PVA polymer resins. The h-BN nano-sheets were prepared by a mechanical exfoliation of h-BN flakes using organic media and subsequent ultrasonic treatment. High thermal conductivities over $2.8W/m{\cdot}K$ for transverse and $10W/m{\cdot}K$ for in-plane direction of the cast films were achieved for casted h-BN/PVA composite films. Further improvement of thermal conductivity up to $13.5W/m{\cdot}K$ at in-plane mode was achieved by applying uniaxial compression at the temperature above glass transition of PVA to enhance the alignment of the h-BN nano-sheets.

A Study on Spatial Combining power Amplifiers for Backhaul of 5G cellular systems (5세대 이동통신 백홀용 공간 결합 전력 증폭기에 관한 연구)

  • Ki, Hyeon-Cheol
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.16 no.4
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    • pp.21-26
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    • 2016
  • In this paper we proposed a new structure of spatial combining power amplifier working in 60GHz global unlicensed band(56-64GHz) for the backhaul in the 5 generation mobile systems. The proposed structure is suitable to realize an antipodal finline transition in millimeter wave band, in which the size of cross section of waveguide becomes about a few mm ${\times}$ a few mm, due to its compact structure of the transition and shows effective heat sinking characteristics because its ground plane can contact to the body metal. However, the HFSS simulation results showed the return loss improvement by 1.27dB and the same insertion loss of -1.65dB compared with the conventional structure, which said nevertheless the advantages, there was no deterioration in the performance.

Thermal Energy Capacity of Concrete Blocks Subjected to High-Temperature Thermal Cycling (열사이클을 적용한 고온 조건 콘크리트 블록의 열용량 특성)

  • Yang, In-Hwan;Park, Ji-Hun
    • Journal of the Korean Recycled Construction Resources Institute
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    • v.8 no.4
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    • pp.571-580
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    • 2020
  • In this study, an experimental study on storage media for thermal energy storage system was conducted. For thermal energy storage medium, concrete has excellent thermal and mechanical properties and also has various advantages due to its low cost. In addition, the ultra-high strength concrete reinforced by steel fibers exhibits excellent durability against exposure to high temperatures due to its high toughness and high strength characteristics. Moreover, the high thermal conductivity of steel fibers has an advantageous effect on heat storage and heat dissipation. Therefore, to investigate the temperature distribution characteristics of ultra-high-strength concrete, concrete blocks were fabricated and a heating test was performed by applying high-temperature thermal cycles. The heat transfer pipe was buried in the center of the concrete block for heat transfer by heat fluid flow. In order to explore the temperature distribution characteristics according to different shapes of the heat transfer pipe, a round pipe and a longitudinal fin pipe were used. The temperature distribution at the differnent thermal cycles were analyzed, and the thermal energy and the cumulated thermal energy over time were calculated and analyzed for comparison based on test results.

Experimental Study on Effect of Inclination Angle on Natural Convection from Cylindrical Heatsinks with Plate Fins (평판-휜을 갖는 기울어진 원통형 히트 싱크의 자연 대류에 경사각이 미치는 영향에 대한 실험적 연구)

  • Park, Kuen Tae;Kim, Hyun Jung;Yoo, Jaisuk;Lee, Moon Gu;Kim, Dong-Kwon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.4
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    • pp.343-350
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    • 2015
  • The natural convection heatsink is the most commonly used cooling device, especially for high-power LED lights, because of its reliability and low long-term cost. High power LED lights are generally used in an inclined configuration for street lamps and security lamps. However, it was difficult to estimate the thermal performance of an inclined heatsink, because the results from previous studies are not applicable to the inclined configuration. In this study, we measured the thermal performance of an inclined cylindrical heatsink with plate fins. Various fin numbers, fin heights, base temperatures, and inclination angles ($30^{\circ}$ and $60^{\circ}$) were examined. Based on the experimental results, the Nusselt number correlation is presented. This correlation is applicable when the Rayleigh number, ratio of the fin height to cylinder diameter, and fin number are in the ranges 100,000-600,000, 1/6-1/2, and 9-72, respectively.

Numerical study on the thermal performance of passively cooled hybrid fins (수동적으로 냉각되는 하이브리드 휜들의 열성능에 대한 수치적 연구)

  • Jeon, Mun Soo;Kim, Kyoung Joon
    • Journal of Advanced Marine Engineering and Technology
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    • v.37 no.8
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    • pp.816-821
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    • 2013
  • This paper reports numerical study results with respect to the thermal performance of various hybrid fins (HFs) and a pin fin (PF) passively cooled under natural convection state. Investigated HFs are a basic hybrid fin (BHF), a hollow hybrid fin (HHF), and a solid hybrid fin (SHF). CFD models for both HFs and the PF have been developed to explore their thermal performance under various heat dissipations. Thermal performances of fins have been analyzed by quantifying array-based heat transfer coefficients, $h_a$, and mass-based heat transfer coefficients, $h_m$, for each fin. Study results show that $h_a$ of the SHF is 23% greater than that of the PF. $h_m$ of the HHF is found to be even 140% greater than that of the PF, and the HHF is found to be 40% better than the BHF in terms of the mass-based performance, $h_{m{\cdot}}$.

Operating Characteristics of LED Package Heat-sink with Multi-Pin's (멀티-핀을 갖는 LED 패키지 방열장치의 동작특성)

  • Choi, Hoon;Han, Sang-Bo;Park, Jae-Youn
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.28 no.7
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    • pp.1-12
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    • 2014
  • This paper is proposed to design the new heat-sink apparatus for improving the heat transfer characteristics in the power LED chip, and results of the operation characteristics were discussed. The core design is that the soldering through-hole on the FR-4 PCB board is formed to the effective heat transfer. That is directly filled with Ag-nano materials, which shows the high thermal conductivity. The heat transfer medium consisting of Ag-nano materials is classified into two structures. Mediums are called as the heat slug and the multi-pin in this work. The heat of the high temperature generated from the LED chip was directly transferred to the heat slug of the one large size. And the accumulated heat from the heat slug was quickly dissipated by the medium of the multi-pin, which is the same body with the heat slug. This multi-pin was designed for the multi-dissipation of heat by increasing the surface areas with a little pins. Subsequently, the speed of the heat transfer with this new heat-sink apparatus is three times faster than the conventional heat-sink. Therefore, the efficiency of the illuminating light will be improved by adapting this new heat-sink apparatus in the large area's LED.