1 |
Pecht, M., 1990, "Handbook of Electronics Package Design," Marcel Dekker, Inc. pp. 40-43.
|
2 |
Pastukhov, V. G., Maidanik, Y. F., Vershinin, C. V. and Korukov, M. A., 2003, "Miniature Loop Heat Pipes for Electronics Cooling," Applied Thermal Engineering, Vol. 23, Issue 10, pp. 1125-1135.
DOI
ScienceOn
|
3 |
Shah, R. K., 1985, "Compact Heat Exchangers in Handbook of Heat Transfer Applications," Rohsenow, W. M., Hartnett, J. P., Ganic, E. N. eds., pp. 181-200.
|
4 |
CFX Release 11.0 Training Manual, ANSYS Inc.
|
5 |
Cha, D. A., Kwon, O. K., Yun, J. H. and Oh, M. D., 2009, "Heat Transfer and Fluid Flow Evaluation of Radiator for Computer Cooling," Proceedings of the SAREK Summer Annual Conference, pp. 1153-1158.
|
6 |
Choi, J. T., Cha, D. A., Kwon, O. K., Yun, J. H. and Kim, Y. C., 2010, "A Numerical Study of the Flow and Heat Transfer for Computer Cooling Radiators with Different Tube Insertion," Proceedings of the KSME Spring Annual Conference, pp. 333-338.
|
7 |
Tang, L. H., Zeng, M., Xie, G. N. and Wang, Q. W., 2009, "Fin Pattern Effects on Air Side Heat Transfer and Friction Characteristics of Fin-and-Tube Heat Exchangers with Large Number of Large-Diameter Tube Rows," Heat Transfer Engineering, Vol. 30, pp. 171-180.
DOI
ScienceOn
|
8 |
Choi, M. J., Kwon, O. K. and Yun, J. H., 2009 "Flow Distribution and Heat Transfer Characteristic of the Microchannel Waterblock with Different Shape of Inlet," Trans. of the SAREK, Vol.21, pp. 386-393.
과학기술학회마을
|