• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.3
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• pp.293-302
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• 2004

In this study the optimization of plate-fin type heat sink for the thermal stability is peformed numerically. The optimum design variables are obtained when the temperature rise and the pressure drop are minimized simultaneously. The flow and thermal fields are predicted using the finite volume method and the optimization is carried out by using the sequential quadratic programming (SQP) method which is widely used in the constrained non-linear optimization problem. The results show that when the temperature rise is less than 34.6K, the optimal design variables are as follows; B$_1$=2.468mm, B$_2$=1.365mm, and t=10.962mm. The Pareto optimal solutions are also presented for the pressure drop and the temperature rise.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.16 no.12
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• pp.1156-1166
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• 2004

The shape of plate-fin type heat sink is numerically optimized to acquire the minimum pressure drop under the required temperature rise. In constrained nonlinear optimization problems of thermal/fluid systems, three fundamental difficulties such as high computational cost for function evaluations (i.e., pressure drop and thermal resistance), the absence of design sensitivity information, and the occurrence of numerical noise are commonly confronted. Thus, a sequential approximate optimization (SAO) algorithm has been introduced because it is very hard to obtain the optimal solutions of fluid/thermal systems by means of gradient-based optimization techniques. In this study, the progressive quadratic response surface method (PQRSM) based on the trust region algorithm, which is one of sequential approximate optimization algorithms, is used for optimization and the heat sink is optimized by combining it with the computational fluid dynamics (CFD).

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.983-984
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• 2012

• Bulletin of the Korean Space Science Society
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• 2007.10a
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• pp.112-112
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• 2007

• Solar Energy
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• v.19 no.4
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• pp.71-80
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• 1999

For developing a new measuring device which enables the thermal resistance at comers of the building envelope in addition to the plate wall measuring device, computer simulations were performed to clarify the problems produced during previous tests. For the optimum design to reduce the temperature deviation in measuring device, the specifications of the measuring devices are to be as follows : Dimension of the device is $500{\times}500{\times}100mm$ in size, heating plate is seperated to some degree from the inner surface of the measuring device, lower temperature of heating plate is as effective as possible, fans should be located at the upper part in the measuring device and face to downward.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.1
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• pp.170-178
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• 2019

Recently, as the interest in energy savings has increased, there has been increasing use of LED lighting, which is an eco-friendly device that replaces high energy consuming fluorescent lamps and incandescent lamps. In the case of a high output LED, however, the life time is shortened due to deterioration caused by heat generation. As a solution to this problem, this paper evaluated the LED life extension effect by increasing the convective heat transfer coefficient of the heat sink surface for LED packaging. A roughing process was carried out using sandpaper and sand blasting. The changes in surface roughness and surface area after each surface treatment process were evaluated quantitatively and the convective heat transfer coefficient was measured. When sandblasting and sandpaper were used to roughen the aluminum surface, a higher convection heat transfer coefficient was obtained compared to the untreated case, and a high heat dissipation efficiency of 82.76% was obtained in the sandblast treatment. Therefore, it is expected that the application of heat dissipation to the heat sink will extend the lifetime of the LED significantly and economically by increasing the heat efficiency.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.2243_2244
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• 2009

본 논문에서는 알루미늄 재질로 된 방열판과 PCB에 1[W]급 LED 14개를 모듈 방열 설계 하여 COMSOL Multiphysics로 시뮬레이션을 통한 결과, 경계면 온도는 약 $80^{\circ}C$, Max.온도$141^{\circ}C$, Min.온도$20^{\circ}C$까지 변화로 실 제작에 근접한 온도 확인이 가능함을 확인 할 수 있었다.

• Proceedings of the KIPE Conference
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• 2015.07a
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• pp.197-198
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• 2015

본 논문에서는 전력 변환기의 방열 능력 극대화를 위한 선택적 스위칭 기법을 제안한다. 제안하는 선택적 스위칭 기법은 전력 변환기의 온도에 따라 IGBT의 스위칭 기법을 달리함으로써 스위칭 손실을 줄일 수 있었으며, 온도가 높아지면 출력 전력을 감소시키던 기존 기법과 달리 출력을 유지하면서도 방열판의 온도를 효과적으로 낮출 수 있다. 제안된 선택적 스위칭기법은 시뮬레이션 및 실험 결과를 통해 타당성이 검증되었다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.1163-1164
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• 2011

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.1
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• pp.81-85
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• 2011

Recently, the electronic parts are to be thinner plate, smaller size, light weight material and CPU, HDD and DRAM in all the parts have been produced on the basis of the high speed and greater capacity. Also, conventional goods have replaced a LED (Light-Emitting Diode) in lighting products so; such industry devices need to have cooling. To maximize all the performance on the heat-radiated products, the area of heat-radiated parts is required to be cooled for keeping the life time extension and performance of product up. Existing cooling systems are using radiant heat plate of aluminum, brass by extrusion molding, heat pipe or hydro-cooling system for cooling. There is a limitation for bringing the light weight of product, cost reduction, molding of the cooling system. So it is proposed that an alternative way was made for bringing to the cooling system. EP (Engineering Plastic) of low-cost ABS (Acrylonitrile butadiene styrene Resin) and PC (Polycarbonate) was coated with brass and the coating made the radiated heat go up. The performance of radiant heat plate is the similar to the existing part. We have studied experimentally on the radiated heat plate for the light-weight, molding improvement and low-cost. From now on, we are going to develop the way to replace the exiting plate with exterior surface of product as a cooling system.