• The Transactions of the Korean Institute of Power Electronics
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• v.26 no.5
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• pp.325-333
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• 2021

A 3 kW grid-tied PV inverter with Gallium nitride high-electron mobility transistor (GaN HEMT) for domestic commercialization was developed using boost converter and full-bridge inverter with LCL filter topology. Recently, many GaN HEMTs are manufactured as surface mount packages because of their lower parasitic inductance characteristic than standard TO (transistor outline) packages. A surface mount packaged GaN HEMT releases heat through either top or bottom cooling method. IGOT60R070D1 is selected as a key power semiconductor because it has a top cooling method and fairly low thermal resistances from junction to ambient. Its characteristics allow the design of a 3 kW inverter without forced convection, thereby providing great advantages in terms of easy maintenance and high reliability. 1EDF5673K is selected as a gate driver because its driving current and negative voltage output characteristics are highly optimized for IGOT60R070D1. An LCL filter with passive damping resistor is applied to attenuate the switching frequency harmonics to the grid-tied operation. The designed LCL filter parameters are validated with PSIM simulation. A prototype of 3 kW PV inverter with GaN HEMT is constructed to verify the performance of the power conversion system. It achieved high power density of 614 W/L and peak power efficiency of 99% for the boost converter and inverter.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.19-31
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• 2022

With the advent of technologies based on big data, the trend of electronics towards high performance and high integration density continues. However, this development of electronics suffers from overheating issues, which seriously threaten the reliability of the devices. To develop effective strategies for thermal management, it is crucial to accurately evaluate the temperature distribution and design the heat dissipation path within the device in the operating condition. This paper introduces thermoreflectance microscopy that can observe the temperature distribution of a device with high spatial and temporal resolutions in a non-contact way. Specifically, the working principle and various forms of thermoreflectance microscopy are presented along with the latest research trends to improve the temperature, space, and time resolutions. We further review several examples in which thermoreflectance microscopy is applied to investigate the temperature and thermal characteristics of electronic devices.

• Journal of IKEEE
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• v.26 no.4
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• pp.537-544
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• 2022

This paper analyzes the occurrence and cause of bond wires fusing used in the manufacture of pulsed high power amplifiers. Recently GaN HEMT has been spotlight in the fields of electronic warfare, radar, base station and satellite communication. In order to produce the maximum output power, which is the main performance of the high-power amplifier, optimal impedance matching is required. And the material, diameter and number of bond wires must be determined in consideration of not only the rated current but also the heat generated by the transient current. In particular, it was confirmed that compound semiconductor with a wide energy band gap such as GaN trigger fusing of the bond wire due to an increase in thermal resistance when the design efficiency is low or the heat dissipation is insufficient. This data has been simulated for exothermic conditions, and it is expected to be used as a reference for applications using GaN devices as verified through IR microscope.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.4
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• pp.50-60
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• 2023

Ball Grid Array (BGA) is a widely used package type due to its high pin density and good heat dissipation. In BGA, solder balls play an important role in electrically connecting the package to the PCB. Therefore, understanding the inelastic deformation of solder balls under various mechanical loads is essential for the robust design of semiconductor packages. In this study, the geometrical effect on the inelastic deformation and fracture of solder balls were analyzed by finite element analysis. The results showed that fracture occurred in both tilted and hourglass shapes under shear loading, and no fracture occurred in all cases under compressive loading. However, when bending was applied, only the tilted shape failed. When shear and bending loads were combined with compression, the stress triaxiality was maintained at a value less than zero and failure was suppressed. Furthermore, a comparison using the Lagrangian-Green strain tensor of the critical element showed that even under the same loading conditions, there was a significant difference in deformation depending on the shape of the solder ball.

• Journal of Advanced Marine Engineering and Technology
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• v.38 no.6
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• pp.737-743
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• 2014

This paper dealt with a retrofit high power LED searchlight to replace conventional 1kW halogen searchlights. The design specification meets KDS 6230-1046-1 and KS V 8469. An optical lens with the beam angle of $6^{\circ}$ was used to meet the luminous intensity of 800,000cd at $0^{\circ}$ in horizontal line. Heat dissipation of the LED searchlight adopted a free air cooling type which does not use a fan or a heat-pipe. From the test results, power consumption of the prototype LED searchlight was 148W which was saved by 85% comparing a halogen searchlight of 1kW. Luminous intensity was 945,000cd at $0^{\circ}$ in horizontal line, satisfying KS V 8469. Luminous efficacy was improved by 4.7 times higher than that of the halogen searchlights. Beam angle, color temperature, and color rendering index(CRI) was $5.4^{\circ}$, 5,500K, and 70, respectively. Surface temperature of the LED searchlight was below $60^{\circ}C$ and surrounding temperature of the SMPS installed inside was below $50^{\circ}C$ which were satisfied with the IEC 60092-306.

• Journal of IKEEE
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• v.21 no.4
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• pp.368-374
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• 2017

In this Paper, we developed a low power type LED security light using LED lighting that substitutes a 220[V] commercial power source for a solar cell module instead of a halogen or a sodium lamp. in addition, a PWM type drive control circuit is designed to minimize the heat generation problem and the drive current of the LED drive controller. in developed system, The light efficiency measurement value is 93.6[lm/W], and a high precision temperature sensor is used inside the controller to control the heat generation of the LED lamp. In order to eliminate the high heat generated from the LED lamp, it is designed to disperse quickly into the atmosphere through the metal insertion type heat sink. The heat control range of LED lighting was $50-55[^{\circ}C]$. The luminous flux and the lighting speed of the LED security lamp were 0.5[s], and the beam diffusion angle of the LED lamp was about $110[^{\circ}C]$ by the light distribution curve based on the height of 6[m].

• The Journal of Korea Institute of Information, Electronics, and Communication Technology
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• v.10 no.6
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• pp.487-495
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• 2017

The thermal characteristics of the electrodeless lamp are one of the main factors that determine the design and performance of the lamp. The coupler changes the impedance characteristic by heat and its use temperature is usually within about $150^{\circ}C$. In this study, we observed the phenomenon when the coupler was exposed at a temperature of $150^{\circ}C$ or higher, which has not been discussed so far. Two types of coupler A and coupler B with different spacing between the inner tube and the coupler were analyzed for electrical, thermal and optical properties and deterioration characteristics with different heat and heat shielding conditions. First, the impedance of the system is obtained and used as a criterion for analyzing the electrical characteristics through it. The diameters of the two types of couplers are 1 mm, and the experimental result shows that the coupler diameter is 1 mm, which can cancel out the loss of the magnetic field strength. Therefore, based on these results, when the coupler is exposed to high temperature of about $200^{\circ}C$, the efficient design method corresponding thereto is proposed.

• Journal of Bio-Environment Control
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• v.30 no.4
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• pp.278-286
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• 2021

In this study, based on the Computational Fluid Dynamics (CFD) simulation model developed through previous study, inner environmenct of the modified glass greenhouse was predicted. Also, suggested the optimal shape of the greenhouse and location of the heat exchangers for heat energy management of the greenhouse using the developed model. For efficient heating energy management, the glass greenhouse was modified by changing the cross-section design and the location of the heat exchanger. The optimal cross-section design was selected based on the cross-section design standard of Republic of Korea's glass greenhouse, and the Fan Coil Unit(FCU) and the radiating pipe were re-positioned based on "Standard of greenhouse environment design" to enhance energy saving efficiency. The simulation analysis was performed to predict the inner temperature distribution and heat transfer with the modified greenhouse structure using the developed inner environment prediction model. As a result of simulation, the mean temperature and uniformity of the modified greenhouse were 0.65℃, 0.75%p higher than those of the control greenhouse, respectively. Also, the maximum deviation decreased by an average of 0.25℃. And the mean age of air was 18 sec. lower than that of the control greenhouse. It was confirmed that efficient heating energy management was possible in the modified greenhouse, when considered the temperature uniformity and the ventilation performance.

• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.157-157
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• 2010

RDF는 장기저장이 가능한 것이 특징 중의 하나이지만, 우리나라보다 앞서 대량저장을 시작한 일본의 RDF 저장 사일로에서 폭발사고가 발생한 사례가 있어, RDF를 실제로 저장하여 RDF 온도 및 가연성가스 발생상황 등을 장기간 감시 측정하여 사일로 안전관리지표를 도출하였다. 실험에 사용한 RDF 저장조는 직경 3.1m, 높이 11.4m의 사일로방식으로 제작하였다. RDF 저장량은 $70m^3$이었으며, 저장기간은 475일이었다. 사일로에는 15개의 열전대를 설치하여 사일로 표면, 직경방향 1.2m 지점 및 기온을 측정하여 수직방향 및 수평방향의 온도변화를 분석하였다. 가스 샘플링포트는 온도측정지점과 동일한 위치 설치하여 진공펌프로 흡인하여 테트라 백에 포집하여 GC로 분석하였으며, 가스샘플링은 17회 실시하였다. 비교적 대형 저장설비이고 RDF가 열전도성이 낮은 물질임에도 불구하고 사일로 내부온도는 기온보다는 높았지만, 기온의 영향을 많이 받아 7월에 정점, 1월에 하점을 나타내는 사인곡선과 같은 패턴을 보였다. 측정지점별 온도차는 수평방향 보다 수직방향에서 높게 나타났으며, RDF층으로 전열 및 축열이 진행되고 생화학반응을 촉진시키는 상승작용의 결과로 월평균온도가 $49^{\circ}C$를 나타내는 지점도 있었다. 실제 사일로는 RDF의 투입과 배출이 연속적으로 진행되어 방열이 이루어지므로 하계에 대량저장을 실시하지 않는 한 RDF층 내부에서 생화학적 반응열이 생성되더라도 $40^{\circ}C$를 상회할 가능성은 매우 희박할 것으로 판단된다. RDF 저장시 발생하는 가스는 대부분 $CO_2$였으며, 미량이지만 $H_2$, CO, $CH_4$도 검출되었다. 가연성 가스는 저장 후 2개월 동안은 발생하지 않았으며, 하계에는 타 계절에 비해 상대적으로 고농도로 검출되었다. 발생가스와 온도 및 $CO_2$와 $H_2$농도의 상관성은 높게 나타나지 않았지만, 정의 상관관계를 나타내었다. 저장한 RDF의 성상(수분, 발열량, 분화물)은 실험개시 전의 RDF분석결과와 실험종료 후 분석결과에서는 큰 차이가 나타나지 않았다. 따라서 RDF의 안전 저장을 위해서는 (1) 반입되는 RDF성상관리, (2) RDF가 2개월 이상 장기간 체류하는 데드스페이스가 발생하지 않고 선입선출이 확보되는 저장조 설계, (3) 사일로 내부에 최소 3개 이상의 지점에서 온도를 측정하여 상시감시하고 $40^{\circ}C$이하로 관리, (4) 발생가스는 CO, $CO_2$, $H_2$, $CH_4$ 등의 가연성가스를 모두 측정 감시하는 것이 바람직하지만, 최소 $CO_2$와 $H_2$는 상시감시하고 각각 1%와 100ppm 미만으로 관리, (5) 배풍기 등을 이용한 상시 환기실시, (6) 하계에는 대량저장이 이루어지지 않도록 저장조 운용계획 수립 등을 실시해야 한다.

• Journal of Astronomy and Space Sciences
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• v.26 no.3
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• pp.403-416
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• 2009

COMS (Communication, Ocean and Meteorological Satellite) is a geostationary satellite and developed by KARl for communication, ocean and meteorological observations. It will be tested under vacuum and very low temperature conditions in order to verify thermal design of COMS. The test will be performed by using KARI large thermal vacuum chamber, which was developed by KARI, and the COMS will be the first flight satellite tested in this chamber. The purposes of thermal balance test are to correlate analytical model used for design evaluation and predicting temperatures, and to verify and adjust thermal control concept. KARI has plan to use heating plates to simulate space hot condition especially for radiator panels of satellite such as north and south panels. They will be controlled from 90 K to 273 K by circulating GN2 and LN2 alternatively according to the test phases, while the main shroud of the vacuum chamber will be under constant temperature, 90 K, during all thermal balance test. This paper presents thermal modelling including test chamber, heating plates and the satellite without solar array wing and Ka-band reflectors and discusses temperature prediction during thermal balance test.