• Journal of the Korean Society of Industry Convergence
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• v.23 no.3
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• pp.427-431
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• 2020

In this Study, as the structure of IT module for smart phone display becomes thin to catch up with slim product trend, the reliability of display module is on the rise as a issue for product design. Especially, almost part of cellular phone should undergo thermal dissipation test. thus many manufacturers have considered design guide line using CAE and simulation for more effective usage of limited resources on the market. This test simulates the case when cellular phone slips through user's fingers while he is talking on the phone. This paper studies a thermal simulation of display module in smart phone. This design for reliability improvements are suggested on the basis of the results of FVM Analysis and display of IT module and smart phone design.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.11a
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• pp.326.2-326
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• 2002

A PDP(Plasma Display Panel) module consists of a discharge panel, a SMPS for power supply, driving boards for panel control, and a logic board. Driving boards supply high voltage pulses to induce glow dischargein the PDP panel. The electrical pulses excite the circuit elements and subsequentlyacoustic noises. The main sources of the noise in the circuit are the transformer of SMPS and the power MOSFET of driving boards, and the heat sinks often amplify the noise level. (omitted)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.711-712
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• 2009

MCP 기술을 이용한 반도체 칩에서 문제가 되는 방열문제를 해결하기 위한 방법으로 열전 냉각 소자를 이용하여 열을 방출 시키는 방법에 관하여 연구를 수행하였다. 시뮬레이션을 통하여 열전 소자가 작동할 때, 흡수하는 열량을 계산할 수 있었으며, 열전 소자의 냉각 성능도 평가 할 수 있었다. 이러한 열 해석 및 열전 해석을 통하여 적층 구조의 MCP 모듈을 위한 열 설계 및 효율적 냉각을 가능하게 할 수 있을 것이다.

• The Transactions of the Korean Institute of Power Electronics
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• v.28 no.1
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• pp.39-47
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• 2023

This paper applies a structural technique with uniform parallel switch characteristics in gates and power loops to minimize the ringing and current imbalance that occurs when a general discrete package (TO-247)-based power semiconductor device is operated in parallel. Also, this propose a heat sink integrated switching module with heat sink design flexibility and high power density. The developed heat dissipation-integrated switching module verifies the symmetry of the parasitic inductance of the parallel switch through Q3D by ansys and the validity of the structural technique of the parallel switch using the LLC resonant converter experiment operating at a rated capacity of 7.5 kW.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.40 no.1
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• pp.61-68
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• 2012

The purpose of Crash Protected Module in Black Box used at aircraft is to protect a stored information(Flight data & Cockpit Voice) safely even after extreme environment like a plane crash. This study shows the structure & thermal analyses and the comparisons of predictions and results of tests about CPM for Crash Survival through extreme environment such as Penetration Resistance, High Temperature Fire, Low Temperature Fire. Specially, the Effect of housing thickness change was studied through the Penetration Resistance analysis using LS-DYNA, and the influence of volume ratio change between phase change material and thermal insulation material was studied through the High Temperature & Low Temperature analysis using Icepak. Also, structural and thermal reliability of CPM was validated through the tests.

• The Transactions of the Korean Institute of Power Electronics
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• v.13 no.6
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• pp.420-429
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• 2008

This paper describes design procedure and control strategy of HDC(High side DC/DC Converter) and MCU(Motor Control Unit) for diesel hybrid electric vehicle. In designing HDC and MCU for HEV high power density and reliability is strongly needed to meet the demand of automotive industry. In order to achieve the high performance of a controller, MPC5554 based control board is developed. An optimized film capacitor and inductor are also developed for high efficiency driving. Skim 63 IGBT module of SEMIKRON for automotive is used for power switching device. The most efficient cooling model for optimal size and reliability were verified by simulation. These procedures are verified by bench or driving test and the results are present in this paper.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.47 no.4
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• pp.309-318
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• 2019

The thermal design of the Lunar Terrain Imager (LUTI) on the Korean Pathfinder Lunar Orbiter (KPLO) was performed and the soundness of the thermal design was verified by thermal analysis. The thermal environment of the lunar mission orbit should be reflected in the thermal design because the IR radiation of the lunar surface is important, unlike the earth orbit. The components or modules exposed to the outside of the satellite are insulated with MLI as much as possible, but the camera tube and the radiator are functionally exposed, so the thermal shield using the concept of radiation shape factor is mounted on the front to mitigate IR radiation. The IR emissivity is important in the front side of the radiator that receives little solar radiation, and components that are susceptible to thermal deformation such as the tube use a radiation heater to minimize the temperature gradient. Through the investigation of computational results, it was confirmed that the thermal design of LUTI is stable in various situations.

• Journal of Energy Engineering
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• v.2 no.3
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• pp.258-267
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• 1993

A mathematical model has been developed to describe heat transfer phenomena in a PCM (phase change material) module for development of an energy recovery system. The PCM module, melting point of which is around 1673 K, consists of silicon(96.8%), aluminium(2.7%) and marginal amounts of impurities such as Ca, Fe and Ti. The module is covered by a capsule that consists of SiC(58%) and graphite(42%). Physical properties that are required for model predictions were cited from the references. The apparent capacity method and the postiterative method wert used in the mathematical model to describe the phase changing mechanism. Temperature and velocity of fluid are the major variables in the model calculation. For the gas temperature of 1773 K that simulates real operating conditions, the prediction shows that PCM is rapidly melted to axial direction. However, for the gas temperature of 3000 K that is higher than the real conditions, PCM is melted rapidly to the radial direction. The gas velocity has no influence on the melting phenomena of the PCM except when the gas velocity is relatively low. At the low gas velocity asymmetry of the temperature profiles in PCM is obtained.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.67-72
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• 2015

A study on thermal properties for a single-layer metal and a 2-ply metal (clad metals) was investigated for the application of heat sink. For the single-layer metal, a stainless steel (STS) and an aluminum (Al) were selected. Also, a roll bonded clad metal with STS and Al was chosen for the 2-ply metal. The thermal conductivity of the sample was obtained from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared with the calculated values using the data from the references. For the single-layer metal, measured values for the thermal diffusivity and thermal conductivity were smaller than calculated values. Differences between measured and calculated values were about 6% and 18% for the STS and Al samples, respectively. For the clad metals, however, a large difference (55%) was observed. Here, a relatively small thermal conductivity measured by LFA was due to the existence of a interface between STS and Al in the clad metal. Such a interface reduces the moving velocity of free electrons and phonons in the clad metal. For the development of a high performance heat-issipation module with the multi-layer structure, the control of interface properties which determine thermal properties was confirmed to be important.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.2
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• pp.666-671
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• 2014

Using positive temperature coefficient (PTC) heater as supplementary heating for diesel engine vehicles with low heat source is a good method to enhance the heating performance during cold start. In this study, the PTC elements were made by using screen printing process for forming ohmic contact layer, and prototype of PTC heater was designed and made for a diesel engine vehicle. In process of designing the PTC heater, the thermal flow analysis of PTC element modules was conducted for verifying the effect of the shapes of contact surface between each of the components (cooling fin, insulator, ceramic element). We also investigated the performance characteristic (heating capacity, energy efficiency, pressure drop) of the PTC heater through the experiments. Therefore, the experimental results indicated that prototype of PTC heater had satisfactory performance. This study will be basis for improving the manufacturing process and increasing the performance of the PTC element and heater.