• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2004.05a
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• pp.132-137
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• 2004

반도체 소자의 마킹 / 표면 검사에 대한 적응적 reference 데이터 자동 획득 알고리즘과 검사에서의 실시간 정합 알고리즘을 개발하여, 모든 반도체 소자의 마킹 / 표면 검사에 대한 오류를 검출할 수 있는 마킹 / 표면 검사 시스템을 개발한다.

• Proceedings of the KAIS Fall Conference
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• 2010.11b
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• pp.631-633
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• 2010

최근 IT 및 반도체 산업이 발달함에 따라 많은 양의 반도체칩이 생산되어 그에 따른 반도체칩의 검사 요구가 급증하고 있다. 반도체칩의 전기적 특성을 검사하기 위해서는 리노핀을 이용한 탐침방법으로 통전검사를 통해 반도체칩의 이상유무를 판단하는 검사장비를 사용하고 있다. 많은 수의 반도체칩을 검사하기 위해서는 리노핀을 고속으로 구동할 수 있는 액튜에이터가 요구되는 바, 본 논문에서는 PZT 액튜에이터를 이용하여 리노핀을 고속으로 구동시키는 세라믹칩 성능검사용 액튜에이터를 개발했다.

• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.05a
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• pp.51-54
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• 2003

반도체 산업의 발전에 따라 생산과정에서의 반도체 소자의 특성을 검사하고, 오류를 검출하는 작업을 효율성 있게 하여 생산성을 향상시키는 것이 더욱 중요시 되고 있다. 이러한 흐름에 맞추어 반도체 test장비에 VFCS(voltage forcing current sensing)와 CFVS(current forcing voltage sensing)를 test 할 수 있게 개발하였다.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.6
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• pp.598-606
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• 2001

Recently, semiconductor packages trend to be thinner, which makes difficult to detect defects therein. A preconditioning test is generally performed to evaluate the reliability of semiconductor packages. The test procedure includes two scanning acoustic microscope (SAM) tests at the beginning and end of the entire test, in order to help detect physical defects such as delaminations and package cracks. In particular, of primary concern are package cracks and delaminations caused by moisture absorbed under ambient conditions. This paper discusses the failure mechanism associated with the moisture absorbed and encapsulated in semiconductors, and the use SAM to detect failures such as tracks and delaminations grown during the preconditioning test.

• Proceedings of the Korean Information Science Society Conference
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• 2001.10b
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• pp.334-336
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• 2001

반도체 제조와 같은 대량 생산 시스템에서 제품 검사는 매우 중요란 단계 중의 하나이다. 반도체 제조 공정 내에서의 시각 검사는 현재 사람의 육안에 주로 의존하고 있으나, 회로가 점점 복잡해지고 작아지는 추세에 비추어 볼 때 사람에 의한 시각 검사는 한계에 이를 것으로 보인다. 본 연구에서는 웨이퍼상의 결함을 자동으로 검출하고 검출된 길함을 분류하는 자동시각검사 시스템을 설계 구현하였다.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.327-332
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• 2021

At the package level, semiconductor reliability inspections involves mounting a semiconductor chip package on a test socket. The form of the test socket is basically determined by the form of the chip package. It also acts as a medium to connect with test equipment through mechanical contact of the leads and socket leads in the chip package, and it minimizes signal loss in a signal transmission process so that an inspection signal can be delivered well to the semiconductor. In this study, a technique was applied to examine the interdependence of adjacent electrical transfer routes and the structure of adjacent electrical transfer paths. The goal was to enable short-circuit testing of fewer than 100 silicon test sockets through a single interface for life tests and precision measurements. The test results of the developed device show a test precision of 99% or more and a simultaneous test speed characteristic of 0.66 sec or less.

• Journal of the Korean Institute of Intelligent Systems
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• v.22 no.6
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• pp.694-699
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• 2012

In this paper, semiconductor package inspection results using white light interferometer with large F.O.V., in order to apply semiconductor product inspection process, are shown. Experimental 3D data repeatability test results for the same special bumps of each substrate are shown. Experimental 3D data repeatability test results for all the bumps in each substrate are also shown. Semiconductor package inspection using white light interferometer with large F.O.V. is very important for the fast 3D data inspection in semiconductor product inspection process. This paper is surely helpful for the development of in-line type fast 3D data inspection machine.

• The Optical Journal
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• v.14 no.4 s.80
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• pp.56-58
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• 2002

최근들어 FPD(평판 디스플레이), MEMS, 반도체, 광부품 등의 분야에서 극미세화의 경향이 보이고 있다. 이들의 가공기술과 더불어 검사장비 역시 2차원 마이크로미터의 수준에서 3차원 나노미터 정밀도를 갖는 장비로 급속도로 교체되고 있는 것이 현실이다. 본 고에서는 반도체에 이어 한국의 기술력을 세계 1위로 끌어올린 FPD 분야에서 3차원 검사장비의 활용을 중심적으로 기술 및 시장동향을 살펴보고자 한다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.18 no.1
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• pp.105-114
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• 2004

In this paper, we design the circuits for DC parameter test of semiconductor devices. The DC parameter tester is the system which inspects the DC parameters of semiconductor devices. In the designed circuits, voltage(current) forcing current(voltage) sensing methods are used to inspect the parameters. The designed circuits are simulated by OR-CAD. The simulation results have good performance.

• Journal of the Korean Society for Nondestructive Testing
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• v.19 no.5
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• pp.369-377
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• 1999

Recently, it is gradually raised necessity that thickness of thin film is measured accuracy and managed in industrial circles and medical world. Ultrasonic signal processing method is likely to become a very powerful method for NDE method of detection of microdefects and thickness measurement of thin film below the limit of ultrasonic distance resolution in the opaque materials, provides useful information that cannot be obtained by a conventional measuring system. In the present research. considering a thin film below the limit of ultrasonic distance resolution sandwiched between three substances as acoustical analysis model, demonstrated the usefulness of ultrasonic signal processing technique using information of ultrasonic frequency for NDE of measurements of thin film thickness. Accordingly, for the detection of delamination between the junction condition of boundary microdefect of thin film sandwiched between three substances the results from digital image processing.