• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.598-603
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• 2019

Three-dimensional shape measurement technology is used in various industries. Among them, optical three-dimensional shape measurement techniques based on the optical trigonometry are mainly used in the field of semiconductor product inspection, where large quantities of three-dimensional shape measurements are made daily in factories and fine measurements are also required. The light source and the drive circuit, which are components of three-dimensional measurement equipment based on this optical trigonometry, produce heat generated by prolonged operation, and may be exposed to conditions where the ambient temperature is not constant, resulting in temperature-induced measurement errors. In this study, the compensation method of the Thermal Errors for Phase Measuring Profilometry is proposed. Three-Dimensional Shape Measurement Equipment based on Phase Measuring Profilometry is implemented to measure the height of an object and ambient temperature for 10 Hours, and a regression line was obtained line by making simple linear regression using measured temperature and height values. This regression line was used to correct the error of the height measurement according to the temperature, and thermal error was from 139.88 um(Micrometer) to 13.12 um.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.14-18
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• 2019

The conductivity of a semiconductor is primarily determined by the carriers. To achieve higher conductivity, the number of carriers should be high, and an energy trap level is created so that the carriers can cross the forbidden zone with low energy. Carriers have a crystalline binding structure, and interfacial mismatching tends to make them less conductive. In general, high-concentration doping is typically used to increase mobility. However, higher conductivity is also observed in non-orthogonal conjugation structures. In this study, the phenomena of higher conductivity and higher mobility were observed with space charge limiting current due to tunneling phenomena, which are different from trapping phenomena. In an atypical structure, the number of carriers is low, the resistance is high, and the on/off characteristics of capacitances are improved, thus increasing the mobility. ZTO thin film improved the on/off characteristics of capacitances after heat treating at $150^{\circ}C$. In charging and discharging tests, there was a time difference in the charge and discharging shapes, there was no distinction between n and p type, and the bonding structure was amorphous, such as in the depletion layer. The amorphous bonding structure can be seen as a potential barrier, which is also a source of space charge limiting current and causes conduction as a result of tunneling. Thus, increased mobility was observed in the non-structured configuration, and the conductivity increased despite the reduction of carriers.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.6
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• pp.604-609
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• 2019

In this study, we fabricated a capacitive humidity sensor with interdigitated (IDT) electrodes using a thermosetting polyimide as a humidifying material. First, the number of electrodes, thickness, and spacing of the polyimide film were optimized, and a mask was designed and fabricated. The sensor was fabricated on a silicon substrate using semiconductor processing equipment. The area of the sensor was $1.56{\times}1.66mm^2$, and the width of the electrode and the gap between the electrodes were each $3{\mu}m$. The number of electrodes was 166, and the length of an electrode was 1.294 mm for the sensitivity of the sensor. The sensor was then packaged on a PCB for measurement. The sensor was inserted into a chamber environment with a temperature of $25^{\circ}C$ and connected to an LCR meter to measure the change in capacitance at relative humidity (RH) of 20% to 90%, 1 V, and 20 kHz. The results showed a sensitivity of 26fF/%RH, linearity of < ${\pm}2%RH$, and hysteresis of < ${\pm}2.5%RH$.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.6
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• pp.467-478
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• 2019

This paper describes the development and measurement results of a wide-band planar active phase array antenna system for an electronic warfare jamming transmitter. The system is designed as an $8{\times}8$ triangular lattice array using a $45^{\circ}$ slant wide-band antenna. The 64-element transmission channel is composed of a wide-band gallium nitride(GaN) solid state power amplifier and a gallium arsenide(GaAs) multi-function core chip(MFC). Each GaAs MFC includes a true-time delay circuit to avoid a wide-band beam squint, a digital attenuator, and a GaAs drive amplifier to electronically steer the transmitted beam over a ${\pm}45^{\circ}$ azimuth angle and ${\pm}25^{\circ}$ elevation angle scan. Measurement of the transmitted beam pattern is conducted using a near-field measurement facility. The EIRP of the designed system, which is 9.8 dB more than the target EIRP performance(P), and the ${\pm}45^{\circ}$ azimuth and ${\pm}25^{\circ}$ elevation beam steering fulfill the desired specifications.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.9
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• pp.551-557
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• 2019

Diagnosis of abnormal faults is essential for producing high quality products. The role of real-time diagnosis is quite increasing in the batch processes of producing high value-added products such as semiconductors, pharmaceuticals, and so forth. In this study, we evaluate the effect of variable selection and future-value estimation techniques on the performance of the diagnosis system, which is based on nonlinear classification and measurement data. The diagnostic performance can be improved by selecting only the variables that are important and have high contribution for diagnosis. Thus, the diagnostic performance of several variable selection techniques is compared and evaluated. In addition, missing data of a new batch, called future observations, should be estimated because the full data of a new batch is not available before the end of the cycle. In this work the use of different estimation techniques is analyzed. A case study on the polyvinyl chloride batch process was carried out so that optimal variable selection and estimation methods were obtained: maximum 21.9% and 13.3% improvement by variable selection and maximum 25.8% and 15.2% improvement by estimation methods.

• The Journal of Society for e-Business Studies
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• v.24 no.3
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• pp.19-33
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• 2019

Recently, manufacturers have been struggling to efficiently use production equipment as their production methods become more sophisticated and complex. Typical factors hindering the efficiency of the manufacturing process include setup cost due to job change. Especially, in the process of using expensive production equipment such as semiconductor / LCD process, efficient use of equipment is very important. Balancing the tradeoff between meeting the deadline and minimizing setup cost incurred by changes of work type is crucial planning task. In this study, we developed a scheduling model to achieve the goal of minimizing the duedate and setup costs by using reinforcement learning in parallel machines with duedate and work preparation costs. The proposed model is a Deep Q-Network (DQN) scheduling model and is a reinforcement learning-based model. To validate the effectiveness of our proposed model, we compared it against the heuristic model and DNN(deep neural network) based model. It was confirmed that our proposed DQN method causes less due date violation and setup costs than the benchmark methods.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.20 no.4
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• pp.639-647
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• 2019

Recently, as the semiconductor integration technology due to miniaturization and high density of electronic equipment have developed, it is importantly recognized the application of thermal control system in order to release inner heat generated from chips, modules, In this study, we considered the heat transfer and pressure drop characteristics in a horizontal channel with four blocks using k-${\omega}$ SST turbulence model During CFD (Computational Fluid Dynamics) analysis, the parameters applied block width, block height, heat source and turbulence generator placement etc. As the boundary conditions of analysis, the channel inlet temperature and flow velocity were respectively 300 K and 3.84 m/s, the heat flux was $358W/m^2$. As a result, the heat transfer performance was decreased as the block width ratio (w/h) was increased, while it was increased as the block height ratio (h/w) was increased. In addition, as the arrangement of heat source size was increased to high heat flux from low heat flux, it was influenced by heat source size and the heat transfer coefficient showed a tendency to increase, When the turbulence generator was installed in the upper part of block No. 1 position the closely to the channel entrance, the heat transfer characteristics was greatly influenced on the whole of four heating blocks. and in oder to consider the pressure drop characteristics, we are able to select the most appropriate turbulence generator's position.

• Journal of Adhesion and Interface
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• v.22 no.2
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• pp.57-62
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• 2021

Recently, the atomically thin two-dimensional transition-metal dichalcogenides (TMDs) have received considerable attention for the application to next-generation semiconducting devices, owing to their remarkable properties including high carrier mobility. However, while a technique for growing graphene is well matured enough to achieve a wafer-scale single crystalline monolayer film, the large-area growth of high quality TMD monolayer is still a challenging issue for industrial application. In order to enlarge the size of single crystalline MoS₂ monolayer, here, we systematically investigated the effect of process parameters in molten-salt-assisted chemical vapor deposition method. As a result, with optimized process parameters, we found that single crystalline monolayer MoS₂ can be grown as large as 420 ㎛.

• Journal of the Korea Institute of Building Construction
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• v.21 no.5
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• pp.459-468
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• 2021

Blocking electromagnetic waves on the exterior walls of buildings effectively reduces the intensity of electromagnetic fields in buildings, which leads to attenuation of electromagnetic disturbances, so there is a great interest in developing technologies. In this study, SiC by-products and graphite generated in the semiconductor field were selected and mixed into mortar after pretreatment such as pulverization to evaluate their physical properties and electromagnetic wave shielding performance. Considering the economic efficiency of each shielding material, only 10% volume of the outermost side of the experiment was mixed with each shielding material to evaluate the shielding performance. The shielding performance was predicted when the experiment was manufactured by mixing the shielding material with the entire volume of the experiment using the shielding effect evaluation formula. The results of the experiment showed that the shielding performance was up to 20 dB when SiC grains were mixed with shielding materials, the shielding performance was up to 18 dB when graphite powder was mixed with shielding materials, and the shielding performance was up to 28 dB when SiC powder was mixed with shielding materials, and the shielding performance was close to 30 dB, which is known to have a shielding rate of 99.9%.