• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.31 no.2
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• pp.57-62
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• 2003

Nano-bending method is presented to measure the Poisson's ratio of thinfilms for MEMS (Micro-Electro-Mechanical Systems) applicaiton. The douvle-ring specimen is designed and fabricated based on the surface micromachining process to facilitate the measurement of the Poisson's ratio. The Poisson's ratio can be obtained through analyzing the linear load-displacement relationship of the double ring specimen subjected to nano-indenter loading. The Present nano-bending mehod is an in-situ measurement approach due to the compatibility to the surface micromachining process. The Poisson's ratio is locally obtained at the location of the double ring specimen with micro dimension. To validate the nano-bending method, the Poisson's ratio of LPCVD (Low Pressure Chemical Vapor Deposition) poly-silicon with thickness of 2.3㎛ is investigated. Experimental results reveal that the Poisson's ratio of the poly-silicon film is 0.2569. The standard deviation of the nano-bending measurement for the stiffness of double ring specimens is 2.66%.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.1
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• pp.199-203
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• 1989

본 연구에서 제작된 시험기는 연구자 개인의 경제적 수준에서 충분이 제작이 가능한 것이다.

• Journal of the Korean Ceramic Society
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• v.40 no.7
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• pp.657-661
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• 2003

The elastic moduli or fracture strengths of multi-layered film (SiO$_2$/po1y-Si/SiN/SiO$_2$, 2.77 $\mu\textrm{m}$ thick), CVD diamond film (1.6 $\mu\textrm{m}$ thick), SiO$_2$ film (1.0 $\mu\textrm{m}$ thick) and SiN film (0.43 $\mu\textrm{m}$ thick) made for the membrane of ink-jet printer head were measured with cantilever beam bending method using nanoindenter after fabricating in the form of micro cantilever beam (${\mu}$-CLB). And the elastic moduli of ${\mu}$-CLB of SiO$_2$ film and SiN film were compared with the value of each film on silicon substrate determined with nanoindentation method. The results showed that the modulus and strength of multi-layered film decrease from 68.08 ㎬ and 2.495 ㎬ to 56.53 ㎬ and 1.834 ㎬, respectively as the width of CLB increases from 18.5 $\mu\textrm{m}$ to 58.5 $\mu\textrm{m}$. And the elastic moduli of SiO$_2$ and SiN films measured with ${\mu}$-CLB bending method are 68.16 ㎬ and 215.45 ㎬, respectively and the elastic moduli of these films on silicon substrate measured with nanoindentation method are 98.78 ㎬ and 219.38 ㎬, respectively. These results show that with ${\mu}$-CLB bending technique, moduli can be measured to within 2%.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.1
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• pp.160-169
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• 1998

The purpose of this study for the prediction of fatigue crack propagation behavior, Stress Intensity Factor(F) of round bar with 3-Dimensional half circular, semi-elliptical icro surface crack under rotary bending stress for the variable aspect, size, rotation angle was analyzed by Boundary Element Method (BEM). It is predicted that behavior of crack growth is half circular or circular crack (b/a.geq.1) and propagate to b/a.leq.0.85.

• Composites Research
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• v.21 no.6
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• pp.15-22
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• 2008

Reversed plane bending fatigue tests were conducted on SiC particle aluminum composite. The initiation and growth behaviors of small surface fatigue cracks were continuously monitored by the replica technique and investigated in detail. The fatigue life of MMC is shorter than that of matrix because there exists interface debonding of SiC particles and matrix on the whole face of the notch part in the casting metal matrix composite(MMC). The coalescence of micro-cracks was observed in the tests conducted at high stress levels. Due to the coalescence, a higher crack growth rate of small cracks rather than those of long cracks was recognized in da/dn-$K_{max}$ relationship.

• Composites Research
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• v.22 no.3
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• pp.74-81
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• 2009

Reversed plane bending fatigue tests were conducted on SiC particle reinforced and SiC whisker reinforced aluminum composite. The initiation and growth behaviors of small surface fatigue cracks were continuously monitored by the replica technique and the causes of fracture and fracture mechanism were investigated by SEM. The relationship between da/dn and $K_{max}$ show that da/dn increases in high stress level while decrease and again increases with increasing of $K_{max}$ in low stress level for two materials.

• Transactions of the Korean Society of Mechanical Engineers
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• v.14 no.4
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• pp.1008-1014
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• 1990

본 연구에서는 실시간법을 사용하여 터빈 블레이드가 회전할때 받는 원심력과 굽힘력에 의한 변형을 측정하였다.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.20 no.1
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• pp.60-64
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• 1984

To calculate the bending frequency of a beam with a crack, the author has developed the computor programe. With a simple example, numerical calculations and experiments were carried out. The results were as follows. 1) As the values of experiments have comparatively agreed with those of calculations, it was proved that the computor program could he applied to a beam with a crack. 2) In the case that the shape of crack is narrow and deep at the fixed edges, the value of experiment may not considerably correspond with that of calculation. 3) If the bending frequency was varied a few % due to a crack, it was turned out that the beam might be fatal on strength.

• Proceedings of the Optical Society of Korea Conference
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• 2003.07a
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• pp.200-201
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• 2003

광섬유 OTDR 센서는 전자기 잡음이 없으며 원거리 가시 및 다중화가 가능한 유망한 센서이다. 광섬유 내부를 진행하는 빛은 광섬유의 밀도 변화에 따라 미소한 광산란이 연속적으로 발생하게 되는데 이러한 광산란을 레일리 (Rayleigh) 광산란이라고 한다. OTDR 센서는 펄스광을 광섬유에 입사한후 되돌아오는 레일리 산란광을 측정하면서 임의의 위치에 주어지는 외란의 영향을 후방 산란광의 감소로 알아내는 센서이다. 광섬유 OTDR 센서에 관련한 연구는 다음과 같다. (중략)

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.6 s.177
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• pp.1584-1592
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• 2000

Reversed plane bending fatigue tests were conducted on SiC whisker reinforced aluminum composite which were consolidated by squeeze casting process. Initiation and growth of small surface fatigue c racks were investigated by means of a plastic replica technique. The fatigue crack initiated in the vicinity of SiC whisker/matrix interface. It was found that a fatigue crack deflected along SiC whisker and grew in a zig-zag manner microscopically, although the crack propagated along the direction normal to the loading axis macroscopically. The coalescence of micro-cracks was observed in the tests conducted at high stress levels, but were not evident in tests in which lower levels of stress were applied. Due to the coalescence, a higher crack growth rate of small cracks rather than those of long cracks was recognized in da/dn -ΔK realtionship.