Browse > Article
http://dx.doi.org/10.4191/KCERS.2003.40.7.657

Nanoindentation Experiments on MEMS Device  

한준희 (한국표준과학연구원 물질량표준부)
박준협 (동명정보대학교 메카트로닉스공학과)
김광석 (한국항공대학교 재료공학부)
이상율 (한국항공대학교 재료공학부)
Publication Information
Abstract
The elastic moduli or fracture strengths of multi-layered film (SiO$_2$/po1y-Si/SiN/SiO$_2$, 2.77 $\mu\textrm{m}$ thick), CVD diamond film (1.6 $\mu\textrm{m}$ thick), SiO$_2$ film (1.0 $\mu\textrm{m}$ thick) and SiN film (0.43 $\mu\textrm{m}$ thick) made for the membrane of ink-jet printer head were measured with cantilever beam bending method using nanoindenter after fabricating in the form of micro cantilever beam (${\mu}$-CLB). And the elastic moduli of ${\mu}$-CLB of SiO$_2$ film and SiN film were compared with the value of each film on silicon substrate determined with nanoindentation method. The results showed that the modulus and strength of multi-layered film decrease from 68.08 ㎬ and 2.495 ㎬ to 56.53 ㎬ and 1.834 ㎬, respectively as the width of CLB increases from 18.5 $\mu\textrm{m}$ to 58.5 $\mu\textrm{m}$. And the elastic moduli of SiO$_2$ and SiN films measured with ${\mu}$-CLB bending method are 68.16 ㎬ and 215.45 ㎬, respectively and the elastic moduli of these films on silicon substrate measured with nanoindentation method are 98.78 ㎬ and 219.38 ㎬, respectively. These results show that with ${\mu}$-CLB bending technique, moduli can be measured to within 2%.
Keywords
MEMS; Micro cantilever beam bending; Modulus, Strength; Nanoindentation; Ink-jet printer;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 Measuring the Strenght and Stiffness of Thin Film Materials by Mechanically Deflecting Cantilever Microbeams /
[ T.P.Weihs;S.Hong;J.C.Bravman;W.D.Nix ] / Mat. Res. Soc. Symp. Proc.
2 Mechanical Deformation of Cantilever Microbeams: A New Technique for Testing the Mechanical Properties of Thin Films /
[ T.P.Weihs;S.Hong;J.C.Bravman;W.D.Nix ] / J. Mater. Res.   DOI   ScienceOn
3 An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments /
[ W.C.Oliver;G.M.Pharr ] / J. Mater. Res.   DOI
4 Nanoindentation Experiments on Some Thin Films on Silicon /
[ J.H.Hahn ] / J. Kor. Ceram. Soc.   과학기술학회마을
5 /
[ S.P.Timoshenko;J.M.Gere ] / Mechanics of Materials