• Proceedings of the KSME Conference
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• 2007.05a
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• pp.426-428
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• 2007

A simple method is presented for fabricating micro/nanoscale combined hierarchical structures using a two-step UV-assisted capillary molding technique. This lithographic method consists of two steps: (i) fabrication of partially cured polymer microstructures using a PDMS mold and (ii) subsequent nanofabrication using a high-resolution polyurethane acrylate (PUA) mold on top of the pre-formed microstructures. Using this technique, various micro/nano hierarchical structures were fabricated with minimum resolution down to 70 nm over a large area with very good reproducibility.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1995.11a
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• pp.289-292
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• 1995

In this experiment the specimen is selected for epoxy resin used in the molding compound materials for the power semiconductors. The specimen was divided into the two parts. one is a specimen without irradiation, the other is irradiated with electron beam, of which dose is 1[Mrad], 2[Mrad], 4[Mrad], 8[Mrad] and 24[Mrad], respectively. From the analysis for the physical properties of the specimen, the carbonyl group which is asffact the electrical properties is decreased according to increase the dose of the electron beam. In the measurement of dielectric characteristics among the electrical properties, the frequency dependance of the dielectric characteristics is confirmed that its ${\beta}$-peak is represented by one peak due to attribute to the main chain below 50[$^{\circ}C$], and two peak above the temperature 100[$^{\circ}C$].

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.402-405
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• 2002

This paper presented the characteristic of Heat-transfer on the winding composed with Epoxy-resin in a 50 kVA cast-resin dry type transformer The resin cast transformer is used widely in supplying electricity systems. However, to know the thermal characteristics of that is very useful in designing, manufacturing, and maintaining, there is no pertinent method to calculate this. In this paper, Based on the results of the physical characteristics and the simulation by commercial software using FEM method, we established the Prototype Model for this. According to that Model, an analysis on a variation of the hottest spot temperature was discussed as a function of thermal conductivity for the individual windings composed with Epoxy-resin. The thermal conductivity of the individual windings with reference to upper way was discussed.

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.370-372
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• 1995

This paper mainly, describes the electrical characteristics caused by the change of structure in solid state of specimen by electron beam irradiation of high temperature-low expension type molding materials of power semiconductor element. The experiments on physical properties and electrical characteristics for the specimen irradiated electron beam are carried ont. For the investigation on physical properties, XRD analysis is used. And for the experiment of electrical characteristics, measurement of volumn resistivity is used.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.79-82
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• 2005

Fresnel lens has number of applications in the optical systems because of its advantages. It is nearly flat lens that has small weight. It is conventionally used in lighthouse beacons, condensing unit of overhead projector and etc. Recently, demands of small size optical systems such as display units, information storage systems, optical detecting units had increased. Conventional manufacturing process of high quality Fresnel lens is direct machining. But it is not suitable for mass production because of high cost and long cycle time. Replication process is more suitable for mass production. But the Fresnel lens has number of sharp blade shape prism. In the replication process, this blade shape causes defects that can affect optical efficiency. In this study, replication process of blade shape pattern that has maximum height of $280{\mu}m$, aspect ratio 1.4 for Fresnel lens application.

• Ceramist
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• v.4 no.3
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• pp.18-28
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• 2001

세라믹스 부품의 실형상 제조기술은 실형상 성형기술과 더불어 반응소결기술의 발달에 의하여 거의 수축율이 제로인 기술로 발달하고 있다. 분말사출성형으로 대표되던 실형상 성형기술도 젤 캐스팅과 열경화 몰딩과 같은 화학적 성형기술의 도입에 따라 플라스틱과 같이 쉽게 부품을 성형할 수 있는 상태에 도달하고 있다. 특히, 나노분말의 실형상 성형은 화학적 방법에 의해서만 가능할 것으로 예상된다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.1
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• pp.38-41
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• 2010

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.5
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• pp.32-37
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• 2004

Polishing processes are widely used in the glass, optical, die and semiconductor industries. Chemical Mechanical Polishing (CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. CMP is conventionally carried out using abrasive slurry and a polishing pad. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. This paper introduces the basic concept and fabrication technique of the next generation CMP pad using micro-molding method to obtain uniform protrusions and pores on the pad surface.

• Proceedings of the Korean Society of Computer Information Conference
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• 2011.06a
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• pp.351-354
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• 2011

The electrical degradation phenomena of epoxy composites to be used as a molding material for transformers were studied. The electrets were first manufactured by applying high voltages to five kinds of specimens given a mixing rate, and then TSC(Thermally Stimulated Current) values at the temperature range of $-160{\sim}200[^{\circ}C]$ were measured from a series of experiments. The behaviour of carrier and its origin in epoxy composites were examined, respectively. And various effects of electrical degradation on epoxy composites were also discussed in this study.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.1
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• pp.31-39
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• 2014

For mobile application, semiconductor packages are increasingly moving toward high density, miniaturization, lighter and multi-functions. Typical wafer level packages (WLP) is fan-in design, it can not meet high I/O requirement. The fan-out wafer level packages (FOWLPs) with reconfiguration technology have recently emerged as a new WLP technology. In FOWLP, warpage is one of the most critical issues since the thickness of FOWLP is thinner than traditional IC package and warpage of WLP is much larger than the die level package. Warpage affects the throughput and yield of the next manufacturing process as well as wafer handling and fabrication processability. In this study, we investigated the characteristics of warpage and main parameters which affect the warpage deformation of FOWLP using the finite element numerical simulation. In order to minimize the warpage, the characteristics of warpage for various epoxy mold compounds (EMCs) and carrier materials are investigated, and DOE optimization is also performed. In particular, warpage after EMC molding and after carrier detachment process were analyzed respectively. The simulation results indicate that the most influential factor on warpage is CTE of EMC after molding process. EMC material of low CTE and high Tg (glass transition temperature) will reduce the warpage. For carrier material, Alloy42 shows the lowest warpage. Therefore, considering the cost, oxidation and thermal conductivity, Alloy42 or SUS304 is recommend for a carrier material.