• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.37-44
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• 2013

It is well known that thermal deformation of electronic packages with Pb-Sn solder and with lead-free solder is significantly affected by material properties consisting the package, as well as those of the solder itself. In this paper, the method for determining coefficient of thermal expansion(CTE) of new material is established by using temperature characteristic of strain gages, and the CTE of molding compound are obtained experimentally. The temperature-dependent CTE of molding compound for Pb-Sn solder and that for lead-free solder are obtained by using strain measurements with well known steel specimen and aluminium specimen as reference specimens, and the CTE's are also measured non-contactly by using moire interferometry. Those results are compared, and the agreement between the two types of strain gage experiment and the moire experiment show the strain gage method used in this paper to be reliable. In the case of the molding compound for Pb-Sn solder, the CTE is measured as approximately $15.8ppm/^{\circ}C$ regardless of the temperature. In the case for the lead-free solder, the CTE is measured as of approximately $9.9ppm/^{\circ}C$ below the temperature of $100^{\circ}C$, and then the CTE is increased sharply depending on the temperature, and reaches to $15.0ppm/^{\circ}C$ at $130^{\circ}C$.

• The Optical Journal
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• s.121
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• pp.51-54
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• 2009

• The Optical Journal
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• s.87
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• pp.37-43
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• 2003

• Fire Protection Technology
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• s.47
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• pp.15-24
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• 2009

• Proceedings of the KSME Conference
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• 2001.06c
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• pp.275-280
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• 2001

Seismic isolator system is one of the most widely used base isolation system in order to control the vibration of structure against earthquake excitation. The evaluation of vulcanization time in molding the rubber bearing is very important for both proper ability of isolator and efficiency of manufacture. This paper deals with experimental measurement of temperature of isolator with senor inside in it, and compared with the result of FEA in order to evaluate the vulcanization time. Properties of rubber bearing which is used in the FEA are obtained by controlling the specific heat of rubber. With the obtained properties of rubber, the isolator is analysed by FEA. As a result, an appropriate analytical vulcanization time is obtained. This time is regarded as an appropriate temperature, which is used to effective manufacture.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.297-304
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• 2012

Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.362-365
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• 2000

Rapid Prototyping(RP) techniques have revolutionized traditional manufacturing methods. These techniques allow the user to fabricate a part directly from a conceptual model before investing in production tooling and help develop new models with significant short time. This paper suggests to new process to manufacture large size hollow shape parts for prototype-car using Rapid Prototyping technology and Vacuum Molding with the reduction of delivery time. In addition, This paper introduces the dividing and combining method to make large size RP master model in spite of the limit of the build chamber dimensions of commercialized RP system and post-processing method to achieve sufficient surface quality.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.4
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• pp.36-44
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• 2020

This study analyzed the deformation behavior of the high density polyethylene (HDPE) bottle in the blow molding process. We carried out finite element (FE) simulations using ANSYS Polyflow. First, the axisymmetric model was executed by 2D FE-simulation to determine the change of bottle wall thickness during the molding process. Then, the square model of the bottle was executed by 3D FE-simulation to gauge the effects of gas pressure on the change of wall thickness. The experiment results showed that the FE-simulations were able to upgrade the quality of the HDPE bottle in the blow molding process. These results can be used as guidance in adjusting gas pressure, as well as be extended for further study to determine process parameters such as temperatures, forming velocity, parison shape, etc.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.2043-2045
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• 2005

현재 점화코일은 소형화 및 친환경성을 위해 에폭시 몰딩 절연층으로 변화되었다. 그러나 에폭시 몰딩으로 변환됨에 따라 점화코일 내부 절연층에 대한 절연진단 및 노화에 대한 정확한 진단의 어려움으로 적절한 교체시기를 예측하기 더욱 어려워졌다. 그로 인해 점화장치부분에 대한 예기치 못한 사고는 대형사고 유발을 초래할 수 있다. 이에 본 논문에서는 비파괴검사의 일종인 부분방전을 이용한 열화검출을 연구하기 위해 열화에 따른 위상각-방전전하량-방전빈도수의 분포 특성을 조사하였다. 또한 방전 발생의 분포가 동일 조건에서도 매우 불규칙성을 가지고 있으므로 데이터의 정량화를 위해 불규칙적인 통계처리를 위한 와이블 분포를 사용하여 기기의 고장시간예측을 조사하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.509-510
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• 2013