• Transactions of the Korean Society of Mechanical Engineers B
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• v.35 no.4
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• pp.385-390
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• 2011

In this study, we developed a micromixer based on the non-equilibrium electrokinetics at the junction of a microchannel and nanochannel. Two fluid streams were mixed by an electro-osmotic flow and a vortex flow created as a result of the non-equilibrium electrokinetics at the junction of the microchannel and nanochannel. Initially, the microchannel was fabricated using Polydimethylsiloxane (PDMS) by the general soft lithography process and the nanochannel was created at a specific position on the microchannel by applying a high voltage. To evaluate the mixing performance of the micromixer, fluorescent distribution was analyzed by using the fluorescent dye, Rhodamine B. About 90% mixing was achieved with this novel micromixer, and this micromixer can be used in microsystems for biochemical sample analysis.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.8
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• pp.1119-1127
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• 2010

In this paper, the design and nonlinear simulation of a multistable electromagnetic microactuator, which provides four stable equilibrium positions within its operating range, have been discussed. Quadstable actuator motion has been made possible by using both X- and Y-directional bistable structures with snapping curved beams. Two pairs of the curved beams are attached to an inner frame in both X- and Y-directions to realize independent bistable behavior in each direction. For the actuation of the actuator at the micrometer scale, an electromagnetic actuation method in which Lorentz force is taken into consideration was used. By using this method, micrometer-stroke quadstability in a plane parallel to a substrate was possible. The feasibility of designing an actuator that can realize quadstable motion by using the electromagnetic actuation method has been thoroughly clarified by performing nonlinear static and dynamic analyses and electrothermal coupled-field analysis of the multistable microactuator.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2005.05a
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• pp.389-394
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• 2005

Microfactory is effective method for machining micro size component. Electro-chemical machining can be more suitable to a microfactory than other machining methods in terms of maintaining high accuracy. Surface profile of EDM Machined component is predicted by micro EDM simulation using superpositioning spark crater. Planar motor and micro pump are developed to construct microfactory system.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.163-170
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• 2006

By removing sacrificial layer through ashing process, movable MEMS structure on substrate can be fabricated in surface micromachining. However, MEMS structure includes, during the ashing process, the warping or buckling effects due to stress gradient along the vertical direction of thin film. In this study, we presented method for counteracting the unwanted deflection of MEMS structure and designed using character of deposit process to overcome limited design conditions. Unit cell patterns were designed with character of deposit shape, and their final shapes were adopted using Finite Element Method. Finally, RF MEMS switch was fabricated by surface micro machining as test vehicles. We checked out that alleviation effect for deformation of switch improved by 35%.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.7-13
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• 1995

마이크로솔더링에 의한 전자기기는, 사회기능의 중추가 되는 컴퓨터, 통신 기기, 항공기 인공위성 등의 제어계를 구성하므로, 그 접속부에 대한 높은 신뢰성의 요구는 그 무엇보다 중요하다. 전자기기에 있어서의 솔더 접속부는 집과 기판의 전기 적.기계적 접속의 역할을 하고 있으며, 따라서 개개의 접속부의 파단은 전체의 불량 으로 연결된다. 실제 전자콤포넌트와 그 시스템의 단선 등의 사고에 있어서 자주 발생 하는 사고중의 하나가 솔더접속부의 단선에 의한 것이며, 그 단선중에서도 가장 보편 적이며 또한 대단히 심각한 문제로서 주목을 받고 있는 것이 솔더접속부의 열피로파단 이다. 전자기기를 사용할 때, 스위치의 on-off에 의한 power cycle과 환경의 온도변화 에 기인하는 반복열 사이클은 솔더접속부의 피로를 일으키게 되고, 결국에는 사용중에 파단을 초래하게 된다. 이러한 온도변화의 범위는 약 -55.deg. - 150.deg.C로 예상할 수 있으며, 여기서 최고온도인 150.deg.C는 Pb-Sn 공정합금의 경우 0.9Tm.p.이상의 고온에 해당한다. 이 피로는 등온적으로 또는 열사이클중에 발생하기도 한다. 솔더접 속부의 열피로수명은 대부분의 공업재료에서 나타나는 저사이클피로거동과 유사하게 발생하며, 솔더 접속부에 인가되는 열변형/응력(thermal strain/stress)의 크기에 크게 의존하는 것으로 알려져 있다. 솔더는 서로 다른 열팽창계수를 갖는 칩과 회로 기관의 두종류의 재료를 접속하기 때문에, 상기한 바와 같은 반복열사이클에 의하여 발생하는 열변형/응력이 접속부의 피로.파단을 야기시킨다. 이러한 솔더접속부에 대한 주기적인 응력/변형의 인가는 접속부에 내.외적으로 현저한 변화를 야기시키게 되고, 열피로로 연결되며 결국에는 시스템의 전기적 단선을 초래하게 된다. 또한 열피로파단 현상는 변형/응력의 크기 뿐 만아니라 솔더합금자체의 야금학적인 물성에도 크게 의존 하며, 내적.외적인 열변화에 의한 야금학적인 특성변화도 크게 영향을 미친다. 솔더 접속부의 신뢰성에 대한 연구는, 그 중요성에 비추어 볼 때, 지금까지 수많은 연구가 행하여져 왔다. 그러나 신뢰성과 관련된 열피로파단현상에 대한 야금학적인 면에서의 연구는 비교적 적은 편이다. 따라서 본 해설에서는 전자기기의 마이크로 솔더접속부 에서 발생하는 열피로파단현상에 대한 야금학적인 면에 중점을 두어 서술하고자 한다.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.1 s.38
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• pp.57-61
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• 2006

Fuel cells are direct current (DC) power generators. They generate electricity through an electrochemical process that converts the energy stored in a fuel directly into electricity. Fuel cells have many benefits, which produce no particulate matter, nitrogen or sulfur oxides. And they have few moving parts and produce little or no noise. When fueled by hydrogen, they yield only heat and water as byproducts. Their wide application can reduce our dependence on fossil fuels and foreign sources of petroleum. This paper is studied on a high efficiency power conditioning system (PCS) applied to the proton exchange membrane fuel cell (PEMFC) generation system. This paper is designed to a novel PCS circuit topology of high efficiency. Some experimental results of the proposed PCS is confirmed to the validity of the analytical results.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.89-94
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• 2021

The mechanical reliability of flexible devices has become a major concern on their commercialization, where the importance of reliable bonding is highlighted. In terms of component materials' properties, it is important to consider thermal damage of polymer substrates that occupy large area of the flexible device. Therefore, room temperature bonding process is highly advantageous for implementing flexible device assemblies with mechanical reliability. Conventional epoxy resins for the bonding still require curing at high temperatures. Even after the curing procedure, the bonding joint loses flexibility and exhibits poor fatigue durability. To solve this problems, low-temperature and adhesive-free bonding are required. In this work, we develop a room temperature bonding process for polymer substrates using carbon nanotube heated by microwave irradiations. After depositing multiple-wall carbon nanotubes (MWNTs) on PET polymer substrates, they are heated locally with by microwave while the entire bonding specimen maintains room temperature and the heating induces mechanical entanglement of CNT-PET. The room temperature bonding was conducted for a PET/CNT/PET specimen at 600 watt of microwave power for 10 seconds. Thickness of the CNT bonding joint was very thin that it obtains flexibility as well. In order to evaluate the mechanical reliability of the joint specimen, we performed lap shear test, three-point bending test, and dynamic bending test, and confirmed excellent joint strength, flexibility, and bending durability from each test.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.

• Proceedings of the KIEE Conference
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• 2006.07c
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• pp.1637-1638
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• 2006

HVAC 시스템은 쾌적하고 깨끗한 운전환경을 만들어 줌으로써 운전자에게 향상된 안락성과 안전성을 제공한다. 이때 센서는 시시각각으로 변화하는 차실 내외의 환경변화에 대한 정보를 검출하여 HVAC 제어 유니트에 제공한다. 현재 HVAC 시스템에 사용되고 있는 후막 가스센서는 소자 크기와 소비전력이 크고, 제작공정이 까다로워 생산성이 낮은 단점이 있다. 이와 같은 문제점을 해결하기 위해서 최근에는 초소형화, 저소비전력, 대량생산에 의한 저가격화가 가능한 MEMS 가스센서의 연구개발이 활발히 진행되고 있다. 본 연구에서는 MEMS 구조체를 이용한 마이크로 가스센서를 설계 및 제작하였고, 감도특성을 고찰하였다. 가스 감지막은 금속산화물 페이스트를 스크린 프린팅 하는 종래의 방법 대신 MEMS 구조체에 적용 가능한 sol-gel 프로세스에 의해 형성하였다. 또 가스 감지전극과 micro-heater를 동일 평면상에 제작, 공정을 간소화하여 저가화를 시도하였다. MEMS 구조체 위에 제작된 Pt 박막 micro-heater의 인가전압에 따른 발열특성을 조사한 결과, 발열온도가 인가전압에 비례하는 이상적인 선형성을 나타내었으며, $300^{\circ}C$의 동작 온도에 도달하기 위해 65mW 이하의 저전력 동작이 가능하였다. 가스 센서의 감도특성 확인 실험은 CO 가스 10ppm, NO 가스 0.3ppm을 기준으로 수행되었으며, CO 및 NO에 대해 Rs(sensitivity, 가스반응저항/초기저항) 값은 각각 0.753 과 2.416로 우수한 성능을 나타내었다.