• Title/Summary/Keyword: 마이크로조직시험

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A Study on the Implementation of Wave Soldering Process and the Solder Joint Reliability Using Sn-Cu-Ni Lead-free Solder (Sn-Cu-Ni계를 이용한 Pb-free Wave Soldering의 공정 적용 및 신뢰성에 관한 연구)

  • 유충식;정종만;김진수;김미진;이종연
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.4
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    • pp.47-52
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    • 2001
  • Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shuck test. $(Cu,Ni)_6/Sn_5$-type intermetallic compound of which thickness is about 5 $\mu\textrm{m}$ was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was fecund at the solder joint. The newly developed product was superior to conventional one in terms of productivity and reliability.

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A Study on the Development and the Practical Approach for Repair Method of RC Structures Subjected to the Chemical Attack (화학적 침식을 받은 콘크리트구조물의 보수기술 개발과 실용화연구)

  • Moon, Han-Young;Shin, Dong-Gu;Kwon, Young-Jin
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.9 no.2
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    • pp.155-162
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    • 2005
  • This paper presents an invetigation into the cause of deterioration of wet surrounding RC structures subjected to checmical attacks such as sewage. The antibacterial-reforming agent is developed after determining the permeability of the RC structure. After application of the anitbacterial-reforming agent through SEM, the permeability, compressive strength properties and the micro-structure of the concrete were evaluated for durability. In addition, the antibacterial-reforming agent was combined with a protective coating for the wet surrounding RC structure and evaluated for durability. The combined effect of the antibacterial-reforming agent and the protective coating were evaluated in field tests in both sewer system and tunnel sites.

Transient Liquid Phase Sinter Bonding with Tin-Nickel Micro-sized Powders for EV Power Module Applications (주석-니켈 마이크로 분말을 이용한 EV 전력모듈용 천이액상 소결 접합)

  • Yoon, Jeong-Won;Jeong, So-Eun
    • Journal of the Microelectronics and Packaging Society
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    • v.28 no.2
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    • pp.71-79
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    • 2021
  • In this study, we have successfully fabricated the Sn-Ni paste and evaluated the bonding properties for high-temperature endurable EV (Electric Vehicle) power module applications. From evaluating of the micro-structural changes in the TLPS (Transient Liquid Phase Sintering) joints with Sn and Ni contents in the Sn-Ni pastes, a lack of Ni powders and Ni particle agglomerations by Ni surplus were observed in the Sn-20Ni and Sn-50Ni joints (in wt.%), respectively. In contrast, relatively dense microstructures are observed in the Sn-30Ni and Sn-40Ni TLPS joints. From differential scanning calorimetry (DSC) thermal analysis results of the fabricated Sn-Ni paste and TLPS bonded joints, we confirmed that the complete reactions of Sn with Ni to form Ni-Sn intermetallic compounds (IMCs) at bonding temperatures occurred, and there is no remaining Sn in the joints after TLPS bonding. In addition, the interfacial reactions and IMC phase changes of the Sn-30Ni joints under various bonding temperatures were reported, and their mechanical shear strength were investigated. The TLPS bonded joints were mainly composed of residual Ni particles and Ni3Sn4 intermetallic phase. The average shear strength tended to increase with increasing bonding temperature. Our results indicated a high shear strength value of approximately 30 MPa at a bonding temperature of 270 ℃ and a bonding time of 30 min.

Effect of Sn Decorated MWCNT Particle on Microstructures and Bonding Strengths of the OSP Surface Finished FR-4 Components Assembled with Sn58%Bi Composite Solder Joints (OSP 표면처리된 FR-4 PCB기판과 Sn58%Bi 복합솔더 접합부의 미세조직 및 접합강도에 미치는 Sn-MWCNT의 영향)

  • Park, Hyun-Joon;Lee, Choong-Jae;Min, Kyung Deuk;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.26 no.4
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    • pp.163-169
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    • 2019
  • Sn-Pb solder alloys in electronics rapidly has been replaced to Pb free solder alloys because of various environmental regulations such as restriction of hazardous substances directive (RoHS), European Union waste electrical, waste electrical and electronic equipment (WEEE), registration evaluation authorization and of chemicals (REACH) etc. Because Sn58%Bi (in wt.%) solder alloy has low melting point and higher mechanical properties than that of Sn-Pb solder, it has been studied to manufacture electronic components. However, the reliability of Sn58%Bi solder could be lowered because of the brittleness of Bi element included in the solder alloy. Therefore, we observed the microstructures of Sn58%Bi composite solders with various contents of Sn-decorated multiwalled carbon nanotube (Sn-MWCNT) particles and evaluated bonding strength of the FR-4 components assembled with Sn58%Bi composite solder. Also, microstructures and bonding strengths of the Sn58%Bi composite solder joints were evaluated with the number of reflows from 1 to 7 times, respectively. Bonding strengths and fracture energies of the Sn58%Bi composite solder joints were measured by die shear test. Microstructures and fracture modes were observed with scanning electron microscope (SEM). Microstructures in the Sn58%Bi composite solder joints were finer than that of only Sn58%Bi solder joint. Bonding strength and fracture energy of Sn58%Bi composite solder including 0.1 wt.% of Sn-decorated MWCNT particles increased up to 20.4% and 15.4% at 5 times in reflow, respectively.

Experimental Study for Establishing Rail Grinding Period in the Urban Railway (도시철도 레일연마주기 산정을 위한 시험적 연구)

  • Sung, Deok-Yong;Go, Dong-Chun;Park, Yong-Gul;Kong, Sun-Yong
    • Journal of the Korean Society for Railway
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    • v.13 no.4
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    • pp.447-454
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    • 2010
  • The defects of rail head induced by fatigue and deterioration are mainly classified by two types ; one occurred on the surface of rail head the another occurred on the inner rail head. This study performed the surface irregularity measurement of rail head according to the passing tonnage in the urban railway. Also, we carried out microscopic structure test, chemical component test and micro-hardness test for the specimen which is the used rail on metro line by accumulated passing tonnage. As a result of this study, for new rail, it should be performed initial grinding in order to remove 0.3mm of de-carbonized layer. The preventive-cyclic grinding for preventing RCF defects is proposed two options : grinding by the whole line and grinding by specified sections.

Effect of Multiple Reflows on Mechanical and Electrical Properties of ENIG/Sn-3.5Ag/ENIG Ball Grid Array (BGA) Solder Joint (리플로우 횟수가 ENIG/Sn-3.5Ag/ENIG BGA 솔더 조인트의 기계적, 전기적 특성에 미치는 영향)

  • Sung, Ji-Yoon;Pyo, Sung-Eun;Koo, Ja-Myeong;Yoon, Jeong-Won;Noh, Bo-In;Won, Sung-Ho;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.1
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    • pp.7-11
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    • 2009
  • In this study, solder joints were made with Sn-3.5Ag (wt%) solder ball. Electroless nickel / immersion gold (ENIG) printed circuit board (PCB) substrates were employed in this work. The mechanical and electrical properties were measured as a function of the number of reflow. Die shear strength was measured with increasing reflow number. Until the forth or fifth reflow, shear force increased and after the fifth reflow the shear force of die decreased. The electrical resistivity of solder joint linearly increased with increasing reflow number.

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Friction Welding of Ni-Base ODS Alloy Prepared by Mechanical Alloying (기계적 합금법으로 제조된 Ni기 산화물 분산강화 합금의 마찰압접에 관한 연구)

  • 강지훈;박성계;김지순;권영순
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 1994.10b
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    • pp.15-15
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    • 1994
  • M MA ODS 합금의 보다 폭넓용 실용확훌 위해 크게 요구되고 있는 적정 접합기술 개발의 한 방안£로, 마찰압접(Friction Welding) 방법의 가능성옳 조사하기 위하여 마찰압력과 시간, 마 찰 후 접촉압력(Upset Pressure) 풍을 다양하게 변화시켜 접합체톨 제조한 후, 접합체 강도에 대한 인장시험과 접합계연의 결합 및 미세구조에 대한 현미경 관찰, EDS에 의한 원소분석, 접 합이옴부의 경도분포와 파단면 분석 풍율 행하였다. 실험에 사용된 모재는 기계적 합금법으로 제조된 Inca사의 Ni기 MA 754 합금이었으며, 직경 l 10 mm, 길이 50 mm로 가공한 후, 아세통£로 초음파 세척하여 접합에 사용하였다. 접합온 브 레이크식 마찰압접기틀 사용하여 행하였으며, 회전시험편의 회전수는 2400 rpm이었A며, 다른 한쪽의 고정시험편과의 마찰압력 및 마찰시간온 각각 50 - 500 MPa과 1-5초로, 또한 업셋압 력도 50 - 600 MPa로 변화시켰다. 이때 업셋압력은 모든 시편에 대해 일정하게 6초동안 가하 였다. 얻어진 접합체는 각 압접조건 당 2개 이상의 접합시험편에 대해 상온 인장강도톨 측정하 였으며, 파단이 일어난 위치를 확인한 후 파면에 대한 분석율 주사전자현미경(SEM)과 에너지 분산형 분광분석기mDS)릎 사용하여 행하였다. 컵합이옴부의 첩합성올 확인하기 위하여, 접합 체를 접합변에 수직으로 절단, 연마한 후 광학현미경과 SEM, EDS 퉁으로 관찰, 분석하여 접 합부의 형상과 결합형성 여부, 접합계면의 미세조직 퉁옳 조사하였다. 또한 마찰압접에 따론 모재와 접합계연부의 경도분포훌 접합이옴부로부터 모재쪽으로 일정 간격율 두어 마이크로 비 커스 경도기로 측정, 조사하였다. 이상의 설험 결과, 다옴과 같온 결론옳 얻었다. ( (1) 접합체 강도가 모채 강도의 95% 이상이 되는 양호한 렵합체흩 얻기 위한 마찰압력 조건 온, 2400 rpm의 회전속도와 6초의 업셋압력 유지시간에서 마찰압력과 업셋압력, 그리고 마찰시 간이 각각 400 MPa 이상과 500 MPa 이상,2초입율 확인하였다. ( (2) 컵합이옴부의 관찰 결과, 모든 마찰압접 조건에서 컵합이옴부는, 기폰 모재의 texture 조직 을 유지하고 있는 모재부 영역(영역 ill)과 첩합계면부에 인접하여 업셋압력이 주어질 때 단조 효과에 의해 계연 외부로 metal flow가 일어나면서 형성된 영역 II, 매우 미세한 결정립으로 구성된 중앙부의 영역 1 로 이투어져 있옴융 확인하였다. ( (3) 최적접합조건이 충족되지 않온 경우, 접합부의 영역 I 에서 관찰된 void와 균열, 불균일한 접합계면 통의 접합결함에 Al과 Y. Ti 퉁£로 구성된 산화물률이 용집되어 있옴을 확인하였 다-( (4) 접합체의 파단 양상온 크게 접합부 파단과 모재부 파단, 이률의 혼합형 파단i로 나눌수 있었다. 모재부 파단의 경우, 파단면이 매끄럽고 파변상의 결정립도 매우 미세하였으며, 산확물 의 용집도 찾아보기 어려웠 나, 접합부 파단의 경우에는 파변의 굴곡이 비교척 심하고 연성 입계파괴의 형태를 보였£며, 결정립도 모채부 파단의 경우에 비해 조대하였다. 조대하였다.

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Evaluation of Defects of Thermal Barrier Coatings by Thermal Shock Test Using Eddy Current Testing (열차폐 코팅층의 고온 열충격 시험후 ECT를 이용한 결함 평가)

  • Heo, Tae-Hoon;Cho, Youn-Ho;Lee, Joon-Hyun;Oh, Jeong-Seok;Lee, Koo-Hyun
    • Journal of the Korean Society for Nondestructive Testing
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    • v.29 no.5
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    • pp.450-457
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    • 2009
  • Periodical thermal shock can introduce defects in thermal barrier coating made by layers of CoNiCrAlY bond coating(BC) and $ZrO_2-8wt%Y_2O_3$ ceramic top coating(TC) on Inconel-738 substrate using plasma spraying. Thermal shock test is performed by severe condition that is to heat until $1000^{\circ}C$ and cool until $20^{\circ}C$. As the number of cycle is increased, the fatigue by thermal shock is also increased. After test, the micro-structures and mechanical characteristics of thermal barrier coating were investigated by SEM, XRD. The TGO layer of $Al_2O_3$ is formed between BC and TC by periodical thermal shock test, and its change in thickness is inspected by eddy current test(ECT). By ECT test, it is shown that TGO and micro-crack can be detected and it is possible to predict the life of thermal barrier coating.

The Study of Corrosion Behavior for Solution and Aging Heat Treated Ti alloy (Ti 합금의 용체화열처리와 시효열처리에 따른 부식거동)

  • Baik, Shin-Young
    • Journal of the Korean Society of Marine Environment & Safety
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    • v.22 no.1
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    • pp.138-144
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    • 2016
  • Titanium is resistant to general corrosion and in sea water because of the passivity layer film on the surface of material, but may be attacked by environments that cause breakdown of the protective oxide layer including hydrochloric, sulfuric and phosphoric acids. In this study, the Ti alloys were solution heat treatment 5hours at $1066^{\circ}C$ and $966^{\circ}C$, and followed by aging heat treated, 1, 4, 8 and 16 hours in $500^{\circ}C$, $600^{\circ}C$ and $650^{\circ}C$ respectively. The heat treated specimens were measured micro Vicker's hardness, and then accomplished electrochemical polarization test for comparing corrosion in 1N sulfuric acid solution. Additionally, micro structures were taken for corrosion tested specimens. The results showed that corrosion resistance was higher in solution heat treated alloy than base and age heat treated metal. Measured corrosion resistants were increased as increasing aging heat treatment time and temperature.

Evaluation of Degradation of Isothermally Aged Plasma-Sprayed Thermal Barrier Coating (플라즈마 용사 열차폐 코팅의 열화 평가)

  • Koo, Jae-Mean;Seok, Chang-Sung;Kang, Min-Sung;Kim, Dae-Jin;Lee, Dong-Hoon;Kim, Mun-Young
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.4
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    • pp.475-480
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    • 2010
  • The thermal barrier coating of a gas turbine blade was degraded by isothermal heating in a furnace and by varying the exposure time and temperature. Then, a micro-Vickers hardness test was conducted on the cross section of the bond coat and Ni-based superalloy substrate. Further, the thickness of TGO(Thermally Grown Oxide) was measured by using an image analyzer, and the changes in the microstructure and element contents in the coating were analyzed by using an optical microscope and by performing SEM-EDX analysis. No significant change was observed in the Vickers hardness of the bond coat when the coated specimen was degraded at a high temperature; delamination was observed between the top coat and the bond coat when the coating was degraded for 50 h at a temperature $1,151^{\circ}C$.