• Current Photovoltaic Research
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• v.10 no.4
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• pp.133-137
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• 2022

The economic feasibility of a photovoltaic (PV) system is greatly influenced by the initial investment cost for system installation. Also, electricity generation by PV system is highly important. The profits competitiveness of PV system will be maximized through intelligent operation and maintenance (O&M). Here, we developed a microconverter which can maximize electricity generation from PV modules by tracking the maximum power point of PV modules, and help efficient O&M. Also, the microconverter mitigates current mismatch caused by shading, hence maximize power generation. The microconverters were installed PV modules and demonstrated through the field tests. Power outputs such as voltage, string current were measured with variuos weather environments and partial shadings. We found that PV modules with the microconvertors shows 12.05% higher power generation compared to the reference PV modules.

• Proceedings of the Korea Information Processing Society Conference
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• 2010.04a
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• pp.190-193
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• 2010

본 논문은 최근 전세계적으로 유통물류를 비롯한 산업 전반에 걸쳐 RFID(Radio Frequency Identification) 기술이 새로운 성장 동력으로 각광을 받고 있다. 유비쿼터스 시대에서 RFID는 빼놓을 수 없는 시스템 이다. RFID/USN 사업 추진시 공부하는 학생들이 RFID 시스템을 학습하기 위해서 자료를 구할 때는 비밀유지계약서를 체결해야 한다. RFID 시스템을 대부분 수입에 의존하고 있고, 기술 인력도 현재 부족하여 어려움을 겪고 있다. 이런 문제점을 보안하기 위하여 공부하는 학생들이 RFID 시스템을 쉽게 접근할 수 있도록 제작하였다. 여러 가지 규약에 의해 제안되었던 문제점을 해결하는데 의의가 있다. 별도의 RFID 전용칩을 사용하지 않고, 마이크로콘트롤러를 사용하여 저가격 RFID 학습 시스템을 구현하였다. 13.56MHz RFID 시스템의 ISO14443A 읽기/쓰기 방법에 대해 설명하고, HF 대역의 13.56MHz RFID 시스템의 구성에 대해서 소개한다. 구현한 RFID 시스템을 활용하여 응용 프로그램을 제작하여 실습을 진행하였다. RFID 시스템의 구조를 쉽게 이해하기 위하여 각각의 모듈로 분류하여 나누어 제작하였다. 태그의 EEPROM 메모리에 정보가 어떻게 저장 되는지를 학습할 수 있도록 C#을 사용하여 응용 프로그램을 설계 및 구현하여 실습하였다. 학습자가 RFID 시스템이 산업분야에서 어떻게 활용되는지 이해를 돕기 위하여 학생증 발급 시스템을 구현하였다.

• Proceedings of the Korea Information Processing Society Conference
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• 2022.11a
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• pp.986-988
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• 2022

본 연구는 전기전자기기를 비접촉 ON/OFF제어와 기기의 수명연장을 개선 시키기위해 전기전자기기에 다용도로 활용되는 제어컨트롤러 모듈인 PLC(Programmable Logic Controller)의 입력측에 마이크로컨트롤러와 AI 비젼카메라를 설치하여, 비접촉 ON/OFF 제어에 관한 아이디어 제시하고, 이를 기반으로 구현하였다. 구현 결과 단순 I,O 신호에 의한 제어와는 다르게 이미지 인식을 구체적으로 구분하여 센싱하고, 다양한 인식 구분을 위해 머신러닝 기반으로 AI 비젼카메라를 학습시킨 결과 물체 및 색깔 구분에 따라서 전기전자기기를 제어 할 수 있었으며, 접촉이 아닌 비접촉 ON/OFF 제어가 간단하게 구현되어, 전기전자기기 수명연장도 기대 할 수 있게 되었다..

• Journal of the Korean Vacuum Society
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• v.20 no.3
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• pp.233-241
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• 2011

Currently, solar module is using the two methods such as a glass-filled method or a super-straight method. The common point of these methods is to use glass structure on the front of solar module. However, the reflectance of the solar module is high depending on the height of the incident sunlight due to the flat surface of the module front glass. Purposed to solve these problems, AG (anti-glare) structures were formed on the glass surface. Next is fabrication methods of AG structure. First, uneven structure made by micro blaster equipment was dipped in Hydro-fluidic acid (HF) acid. HF acid process was carried out to remove particles and to make high transmittance. The reflectance and transmittance of the anti-glare glass was compared to those of the bare glass. The reflectance of anti-glare glass decreased approximately 1% compared with bare glass. The transmittance of anti-glare glass was similar to bare glass. According to the sample angle, the difference of the reflectance between bare glass and the anti-glare glass was about 19%. Isc and efficiency value of anti-glare glass on bare solar cell appeared about 3.01 mA and 0.228% difference compared with bare glass. Anti-glare glass on textured solar cell appeared about 9.46 mA and 0.741% difference compared with bare glass. As a result, the role of anti-glare in the substrate is to reduces the loss of sunlight reflected from the surface. In this study, therefore, AG structure on the solar cell was used to improve the efficiency of solar cell.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.67-72
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• 2015

A study on thermal properties for a single-layer metal and a 2-ply metal (clad metals) was investigated for the application of heat sink. For the single-layer metal, a stainless steel (STS) and an aluminum (Al) were selected. Also, a roll bonded clad metal with STS and Al was chosen for the 2-ply metal. The thermal conductivity of the sample was obtained from the thermal diffusivity measured by the light flash analysis (LFA), specific heat and density. Measured thermal property values were compared with the calculated values using the data from the references. For the single-layer metal, measured values for the thermal diffusivity and thermal conductivity were smaller than calculated values. Differences between measured and calculated values were about 6% and 18% for the STS and Al samples, respectively. For the clad metals, however, a large difference (55%) was observed. Here, a relatively small thermal conductivity measured by LFA was due to the existence of a interface between STS and Al in the clad metal. Such a interface reduces the moving velocity of free electrons and phonons in the clad metal. For the development of a high performance heat-issipation module with the multi-layer structure, the control of interface properties which determine thermal properties was confirmed to be important.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.95-100
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• 2010

LED (Light Emitting Diode) is 85% of the applied energy is converted into heat that is already well known. Lately, LED chips increasing the capacity as result delivered to increase the heat of the LED products and module that directly related to life span and degradation. Thus, in industry the high-power LED chip to control the heat generated during the course of the study and the existing aluminum, copper adhesives, and uses MLC (Metal clad laminate) structures using low-cost FR4 and copper CCL (Copper Clad Laminate) to reduce costs by changing to a study being carried out. In this study, using low-cost CCL Class, mounted 1W LED chip to analyze changes in the thermal resistance. In addition, heat dissipation in the CCL to facilitate a variety of thermal via design outside of the heat generated by the LED chip to control and facilitate the optimal structure of the heat dissipation is suggested.

• Journal of Advanced Marine Engineering and Technology
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• v.37 no.4
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• pp.409-417
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• 2013

Mu-communication board supported by multi-communication is designed with Atxmega 128A1 which is a low power energy consuming of 8-bit microcontroller. ATxmega128A1 microcontroller consists of 8 UART(Universal asynchronous receiver/transmitter) ports which can be setting appropriate user interface having command line interpreter(CLI) program with each port, 2 kbytes EEPROM, 128 kbytes flash memory, 8 kbytes SRAM. 8 URAT ports are used for the multi communication modem, GPS module, etc. and EEPROM is used for saving a configuration for program running, and flash memory of 128 kbytes is used for storing a Firm Ware, and 8 kbytes SRAM is used for stack, storing memory of global variables while program running. If we uses the hybrid communication of path optimization of VHF, TRS and CDMA to remote control AtoN(aid to navigation), it is able to remove the communication shadow area. Even though there is a shadow area for individual communication method, we can select an optimum communication method. The compatibility of data has been enhanced as using of same data frame per communication devices. For the test, 8640 of data has been collected from the each buoy during 30 days in every 5 minutes and the receiving rate of the data has shown more than 99.4 %.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.1-6
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• 2008

Thermoelectric properties of calcium cobalt layer structure oxide system, $Ca_3Co_2O_6$ and $Ca_3Co_4O_9$ were investigated at the temperature range of 300 to 1000K for the application of thermoelectric generation. In the composition, the Ca site was partially substituted with Bi, Sr, La, K and the Co site was partially substituted with Mn, Fe, Ni, Cu, Zn. The thermoelectric properties of Bi substituted $Ca_3Co_4O_9$. $Ca_{2.7}Bi_{0.3}Co_4O_9$ for electrical conductivity, Seebeck coefficient and power factor were $85.4({\Omega}$cm)^{-l}, $176.2{\mu}V/K$ and $265.2{\mu}W/K^m$, respectively. The unit thermoelectric couple was fabricated with the p-type of $Ca_{2.7}Bi_{0.3}Co_4O_9$ and n-type ($Zn_{0.98}Al_{0.02}$)O thermoelectrics whose figure-of-merit(Z) were $0.87{\times}10^{-4}/K$ and $0.41{\times}10^4/K$, respectively. The generated thermoelectric power was about 30mV at the temperature difference of 120K in the unit thermoelectric couple.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.87-92
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• 2016

The importance of heat dissipation for the electric device modules along the thickness direction is increasing. Two types of two-layered materials, metal-metal bonding and dielectric-metal bonding, have been fabricated by roll bonding process and a thermal diffusivity of the specimens was measured along the thickness direction. The thermal diffusivity of specimens with metal-metal bonding measured by light flash analysis (LFA) showed a same value independent on the direction of heat flow. However, the thermal diffusivity of specimens with dielectric-metal bonding showed a big difference of 17.5% when the direction of heat flow changed oppositely in the LFA process. The measured thermal diffusivity of specimens when the heat flows from metal to dielectric direction showed smaller value of 17.5% compared to the value when the heat flow from dielectric to metal direction. The difference in thermal diffusivity of specimens with dielectric-metal bonding dependence on direction of heat flow is due to the electron-phonon resistance that occurred transfer process of electron energy to phonon energy near the interface.