• Journal of the Korean institute of surface engineering
• /
• v.32 no.6
• /
• pp.647-657
• /
• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

• Journal of the Korea Society for Simulation
• /
• v.20 no.3
• /
• pp.49-58
• /
• 2011

The workloads of facilities and laborers are important for the capacity planning in a factory. They are always referenced whenever a factory develops a new product, increases the production quantity and makes a plan of new investment. There are many measuring methods for estimating the workload effectiveness of facilities and laborers. In this paper, various measuring methods including survey, work sampling, micro-motion study, data gathering from ERP system and simulation, are analyzed for comparing the accuracy of workload. This case study is conducted in a Korean company that produces semiconductor parts like leadframe and packaging substrate.

• Journal of the Korean institute of surface engineering
• /
• v.19 no.3
• /
• pp.92-108
• /
• 1986

An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

• Journal of the Korean institute of surface engineering
• /
• v.36 no.6
• /
• pp.491-499
• /
• 2003

Copper-based leadframe sheets were oxidized in a hot alkaline solution to form brown-oxide layer on the surface and molded with epoxy molding compound (EMC). The brown-oxide-coated leadframe/EMC joints were machined to form sandwiched double-cantilever beam (SDCB) specimens and sandwiched Brazil-nut (SBN) specimens for the purpose of measuring the fracture toughness of leadframe/EMC interfaces. The SDCB and the SBN specimens were designed to measure the fracture toughness of the leadframe/EMC interfaces under nearly mode-I loading and mixed-mode (mode I ＋ mode II) loading conditions, respectively. Fracture surfaces were analyzed by various equipment such as glancing-angle XRD, SEM, AES, EDS and AFM to elucidate failure path. Results showed that failure occurred irregularly in the SDCB specimens, and oxidation time of 2 minutes divided the types of irregular failures into two classes. The failure in the SBN specimens was quite different from that in the SDCB specimens. The failure path in the SBN specimens was not dependent on the phase angle as well as the distance from tips of pre-cracks.

• Journal of Welding and Joining
• /
• v.30 no.3
• /
• pp.32-37
• /
• 2012

Lead frame which has a high thermal conductivity and high mechanical strength is one of core technology for ultra-thin electronics such as LED lead frames, memory devices of semiconductors, smart phone, PDA, tablet PC, notebook PC etc. In this paper, we fabricated a Cu/STS/Cu 3-layered clad metal for lead frame packaging materials and characterized the mechanical properties and thermal conductive properties of the clad metal lead frame material. The clad metal lead frame material has a comparable thermal conductivity to typical copper alloy lead frame materials and has a reinforced mechanical tensile strength by 1.6 times to typical pure copper lead frame materials. The thermal conductivity and mechanical tensile strength of the Cu/STS/Cu clad metal are 284.35 W/m K and $52.78kg/mm^2$, respectively.

• Journal of the Korean institute of surface engineering
• /
• v.32 no.4
• /
• pp.531-537
• /
• 1999

A copper based leadframe was oxidized in brown-oxide forming solution, then the growth characteristics of brown oxide and the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) were studied by using sandwiched double cantilever beam (SDCB) specimens. The brown oxide is composed of fine acicular CuO, and its thickness increased up to ~150 nm within 2 minutes and saturated. Bare leadframe showed alomost no adhesion to EMC, while once the brown-oxide layer formed on the Surface of leadframe, the adhesion strength increased up to ~80 J/$\m^2$ within 2 minutes. Correlation between oxide thickness, $\delta$ and the adhesion strength in terms of interfacial fracture toughness, $G_{c}$ was linear. Considering the above results, we might conclude that the main adhesion mechanism of brown-oxide treated leadframe to EMC is mechanical interlocking, in which fine acicular CuO plays a major role.e.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 1993.10a
• /
• pp.675-680
• /
• 1993

컴퓨터를 이용한 제품의 설계시 개념설계부터 최종설계에 이르는 동안 설계모델은 많은 수정을 요하게 된다. 이 과정에서 개념설계 단계부터 솔리드 모델을 채용하는 것은 불편하므로, 와이어프레임 모델이나 곡면 모델을 이용하여 설계를 진행하다가, 최종설계 단계에서 솔리드 모델로 전환하는 것이 바람직하다. 이 경우 이 3가지 모델을 모두 지원하는 모델러가 요구되는데 '복합다양체'를 지원하는 모델러가 이 요건을 만족시킨다. 또한 경계표현(B-rep)방식으로 모델링시 불리안 작업자를 많이 이용하는데, 모델링 도중에 불리한 작업으로 생성된 모델의 Undo작업은 용이하지 않은 일이다. 따라서 불리안 작업으로 생성된 모델의 수정작업을 위한 알고리즘이 요구된다, 일한 수정작업을 위해선 복합다양체를 지원하는 자료구조가 필요하다. 본 논문에선 이러한 복합다양체 자료구조를 갖는 형상모델러의 기본적 자료구조와 기본물체 모델링시 오일러 작업자를 구현하였다.

• Journal of Korea Multimedia Society
• /
• v.16 no.2
• /
• pp.160-168
• /
• 2013

In this paper an algorithm that represents shape sequences with moving frames parallel along the sequences are developed. According to Levi-Civita connection, it is not easy to measure the variation of the vector fields on non-Euclidean spaces without tools to parallel transport them. Thus, parallel transport of the vector fields along the shape sequences is implemented using the theories of principal frame bundle and analyzed via extensive simulation.

• Electronics and Telecommunications Trends
• /
• v.4 no.1
• /
• pp.16-34
• /
• 1989

반도체 산업에서 패키지는 반도체 재료 및 공정 분야와 같은 거대한 시장을 형성하는 중요한 분야이다. 소자가 다양해짐에따라 패키지의 형태도 다양해졌고 이에 따르는 패키지 재료 및 공정 분야가 특히 중요한 연구과제로 부상하고 있다. 현재 패키지 형태는 DIP형이 주류를 이루고 있으나 점차 CC형으로 변화 될 전망이며 탑재 기술면에서는 TAB 형태로 발전되는 추세를 보이고 있다. 국내 기술은 자체기술 개발 및 기술제휴를 통하여 시장이 점차 복잡화 다양화 하는 상황에서 기술개발에 전력을 쏟아 리드 프레임의 단일화, 도금기술의 향상으로 가격 절감을 통한 경쟁력 향상을 꾀하고 있다.

• Review of KIISC
• /
• v.21 no.2
• /
• pp.70-77
• /
• 2011

국제표준화기구 ITU-T에서는 SG17 WP3 그룹이 ID 관리 기술에 관한 표준화를 리드하는 연구그룹으로, 산하 6개의연구과제(Question)를 구성하여 관련 국제표준을 개발하고 있다. 이 연구과제들 중 Q.10에서는 ID 관리 기술의 구조와 프레임워크에 대하여 정보통신 환경에서 다양하게 응용될 수 있는 국제표준들의 개발을 담당하고 있다. 현재, Q.10에서는 앞서 언급된 분야로 총 4건의 국제표준을 제정하였으며, 총 12건의 표준초안들이 개발중에 있다. 본 논문에서는 Q.10에서 개발한 국제표준들과 개발 중에 있는 표준초안들에 대해 간단히 소개하고, 향후 추진방향을 제시하고자 한다.