• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.4
• /
• pp.43-45
• /
• 2001

For photosensitive and micro-structuring in $Li_2O-A1_2O_3-SiO_2$glasses by laser treatment, Nd:YAG laser in 355 nm and 1064 nm wavelength was irradiated to the glass to investigate fracture characterization and optical changes. The fractured glass surfaces irradiated by 1064 nm laser was observed by Scanning Electron Microscope(SEM) and optical microscope, and optical changes caused by 355 nm later was identified from absorption spectra. In this study, it could be expected that the laser treatment technology will be utilized for 3-dimensional micro-structure, internal waveguide, optical memory by optical absorption changes in glass matrix.

• The Journal of the Korea Contents Association
• /
• v.11 no.3
• /
• pp.293-301
• /
• 2011

The material of the dental prosthesis was required bio-compatibility for biological, chemical, and physical stabilities. This study was conducted the stability evaluation of mechanical, biological characteristics through comparing Co-Cr alloy(SC group), Ti alloy(ST group) made by the selective laser melting method with Co-Cr alloy(CC group), Ni-Cr alloy(CN group) made by the casting method. Modulus of elasticity for mechanical characteristic evaluation was measured by the tensile test. And we conducted the release material analysis using lactic acid-NaCl solution for the evaluation of biological stability and were observed cytotoxicity through the content of this release medium. Taking these results into account, the Co-Cr alloy made by the selective laser melting method was observed modulus of elasticity higher than he Co-Cr alloy made by the casting method. And the Co-Cr alloy made by the selective laser melting method had more superior biological stability than the other groups as the result of cytotoxicity evaluation through the release material analysis. By this results, we think that alloys made by the selective laser melting method can be applied as materials for making the dental prosthesis.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.10a
• /
• pp.254-254
• /
• 2003

• Journal of the Microelectronics and Packaging Society
• /
• v.14 no.3
• /
• pp.29-36
• /
• 2007

The main objectives of this study are to investigate the micro-scale energy transfer mechanism for silicon wafer and to find an efficient way for fabrication of silicon wafer through-hole by using the femtosecond pulse laser ablation. In addition, the electron-phonon interactions during laser irradiation are discussed and the carrier number density and temperatures are estimated. In particular, the present study observes the shapes of silicon wafer through-hole with $100\;{\mu}m$ diameter and it also measures the heat-affected area and the ablation depths fur different laser fluences by using the optic microscope and the three-dimensional profile measurement technique. First, from numerical investigation, it is found that the nonequilibrium state exists between electrons and phonons during laser irradiation. From experimental results, it should be noted that the heat-affected area increases with laser fluence, and the optimal conditions for through-hole formation with minimum heat affected zone are finally obtained.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.11
• /
• pp.1765-1771
• /
• 2010

In the case of micro.electro-mechanical system (MEMS) devices, the quality of punched via hole is one of the most important factors governing the performance of the device. The common features that affect the laser micromachining of via holes drilled by using Nd:$YVO_4$ laser are described, and efficient optimization methods to measure them are presented. The analysis methods involving an orthogonal array, analysis of variance (ANOVA), and response surface optimization are employed to determine the main effects and to determine the optimal laser process parameters. The significant laser process parameters were identified and their effects on the quality of via holes were studied. Finally, an experiment in which the optimal levels of the laser process parameters were used was carried out to demonstrate the effectiveness of the optimization method.

• Proceedings of the Optical Society of Korea Conference
• /
• 2003.07a
• /
• pp.2-3
• /
• 2003

오늘날 레이저는 수많은 종류가 등장하였으며 출력개선은 물론 장치의 규모도 나날이 Compact하게 발전하였다. 또한 그 활용성도 대단히 증가하여 의료, 과학, 군사분야를 시작으로 1990년에 이르면서 산업 전 분야에 파급되어 원자력, 전기／전자, 자동차, 반도체 등 주요산업의 제품수준을 향상시키는 핵심기술로 이용되고 있다. 레이저는 이와 같이 새로운 생산도구로서 위치를 확립 시키면서 산업분야의 다양성과 함께 가공산업에서 요구되는 레이저 관련 기술도 다양하게 진보하고 있는 추세이다. (중략)

• Laser Solutions
• /
• v.6 no.1
• /
• pp.9-16
• /
• 2003

Micromachining using the DPSS 3rd Harmonic Laser (355nm) has outstanding advantages as a UV source in comparison with Excimer lasers in various aspects such as maintenance cost, maskless machining, high repetition rate and so on. It also has the greater absorptivity of many materials in contrast to other IR sources. In this paper, the process for micro-drilling of blind hole in Cu/PI/Cu substrate with the DPSS UV laser and the scanning device is investigated by the experimental methods. It is known that there is a large gap between the ablation threshold of copper and that of PI. We use the Archimedes spiral path for the blind hole with different energy densities to ablate the different material. Finally, the blind via hole of diameter 100$\mu\textrm{m}$ and 50$\mu\textrm{m}$ was drilled.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2003.06a
• /
• pp.219-222
• /
• 2003

Self-Assembled Monolayers(SAMs) by alkanethiol adsorption to thin metal film are widely being investigated for applications as coating layer for anti-stiction or friction reduction and in fabrication of micro structure of molecular and bio molecular. Recently, there have been many researches on micro patterning using the advantages of very thin thickness and etching resistance in selective etching of thin metal film of Self- Assembled Monolayers. In this report, we present the micromachining thin metal film by Mask-Less laser patterning of alknanethiolate Self-Assembled Monolayers.

• Proceedings of the KAIS Fall Conference
• /
• 2002.05a
• /
• pp.55-58
• /
• 2002

본 논문은 쾌속제작법을 이용한 임의형상을 가공하는 새로운 방법의 개념을 소개하고 있다. 본 시스템은 레이저 절단, 이송, 적층, 소결의 단계를 통하여 세라믹재료로 된 임의형상을 가공할 수 있다. 시스템을 구성하는 주요장비로는 레이저발생장치, X-Y테이블, 이송시스템, 그리고 전기로 등이 있다. 이 시스템을 사공하면 표면의 거칠기가 매끄러운 형상을 상대적으로 짧은 시간에 제작할 수 있는 장점이 있다. 또, 2차 공정을 거치지 않고, 바로 물체를 제작할 수 있어 효율성이 높다고 할 수 있다. 제작된 모형은 바로 조립되어 사용할 수 있기 때문에 응용분야가 다양하다.

• Laser Solutions
• /
• v.15 no.1
• /
• pp.10-14
• /
• 2012

Pulse laser welding was performed on C22 metal bellows. The results can be summarized as follows: Laser welded metal bellows had less thermal distortion, narrow HAZ, high aspect ratio in comparison with other welding processes like TIG, Plasma welding. Laser welded bellows has higher tensile strengths than that C22 base metal. The value of hardness in laser weld metal was measured 100-120 Hv, it was decreased compared to the base metal. It is reasoned that due to the annealed by heat input during the laser welding.