• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.15-22
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• 1999

Generally, many equipments and a long lead time ale required to manufacture the build-up multilayer board through various processes such as etching, plating, drilling etc. Wet process is suitable for mass production, however it is not adequate for manufacturing prototype in developing stage. In this study, a silk screen printing technology is introduced to make a prototype build-up multilayer board. As for the material photo/thermal curable resin and conductive paste are used for forming dielectric and conductor. And conductive paste fills vias for interconnecting each layer, and also is used for circuit patterning by silk screen technology. Finally, the basic concept and the possibility of build-up multilayer board prototype is proposed and verified as a powerful approach, compared with the conventional processes.

• The Transactions of the Korea Information Processing Society
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• v.5 no.1
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• pp.249-257
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• 1998

다층 인쇄회로기판에서 고속 신호를 정확하고 신속하게 배선 설계하려면, 물리적 설계 규칙과 신호 잡음을 고려한 전기적 설계 규칙을 정립하고, 적용할 신호 검증 도구를 사용하여 신호의 충실성을 검증하여야 한다. 본 논문은 현재 개발 제작되어 동작 중에 있는 HIPSS(High Performance Storage System)보드에 대한 전기적 설계 규칙과 고속 신호의 배선에 따른 일부 고속 신호의 신호 검증 방법을 설명한다. 또한 전기적 설계 규칙을 적용하여 인쇄회로기판을 설계하는 경우, 발생하는 신호 지연, 반사 그리고 누화 등의 신호 잡음을 검증 도구를 이용하여 시뮬레이션 하고, 분석한 결과를 보이며, 수정된 고속 신호의 배선 설계를 확인한다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.203-203
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• 2011

최근 전자, 정보통신기기의 고기능, 고속화, 소형화, 경량화 요구에 따라 반도체 소자인 LSI와 함께 인쇄회로기판도 해가 갈수록 고밀도, 고다층화, 얇고 균일한 도금과 함께 밀착성향상 추세로 급속하게 진행되고 있다. 인쇄회로기판에서 표면처리는 매우 광범위하고 많은 문제점이 있지만 고주파노이즈감소를 위하여 도금두께 균일화 평활면의 접착, 파인패턴 형성과 절연성이 가장 중요하다.

• Proceedings of the KIEE Conference
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• 2001.11a
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• pp.35-37
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• 2001

다층 인쇄 회로 기판에 Combline 구조를 가진 스트립 라인 또는 마이크로 스트립 라인 대역통과 필터를 구현하였다. 저 비용 구현과 이동성과 휴대성을 강조하기 위해 기존의 세라믹 대신 FR4 와 에폭시를 기반으로 하는 다층 회로 기판의 도체 층에 집적화하였다. Combline 각 끝단에 커패시터를 부하 함으로써 전기적 길이를 화장하였고 전체적인 크기를 감소시킴으로서 적당한 필터 특성을 얻을 수 있었다. 구현된 필터는 마이크로파 대역에서 사용 가능하며 특히 Bluetooth나 Wireless LAN 과 같은 ISM 대역을 사용하는 무선통신소자로서 사용 가능하다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.11a
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• pp.27-30
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• 1999

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2011.05a
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• pp.202-202
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• 2011

최근 대용량 고속송신을 위한 모바일 무선정보통신기기의 신뢰성향상 함께 광 인쇄회로기판(O-PCB)국산화개발이 진행되고 있다. 광 Rigid-MLB개발에 이어 개발추진중인 광 Flexlble PCB는 광 연결 장치는 대용량데이터를 고속 전송하는데 필수적이다. 전원접속코드를 사용하지 않는 광도파로 층으로 구성되며 전기신호를 광신호로 변환시켜 다층의 광도파로 층으로 전송시킨다. 신속한 전송을 위한 균일도금에칭기술이 요구되고 있다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.7
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• pp.1639-1645
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• 2015

In UHD high-speed video transmission system, when a signal within certain frequency region coincides electrically and structurally, the system becomes unstable because the energy is concentrated, and signal flux is interfered and distorted. For the instability, power integrity analysis should be conducted. To remove the signal distortion for MLB, using a high-frequency design technique for EMI phenomenon, EMI which radiates electromagnetic energy fluxed into power layer was analyzed considering system stabilization. In this paper, we proposed an adaptive MLB design method which minimizes high-frequency noise in MLB structure, enhances signal integrity and power integrity, and suppresses EMI. The characteristic impedance for multi-layer circuit board proposed in this study were High-Speed Video Differential Signaling(HSVDS) line width w = 0.203, line gap d = 0.203, beta layer height h = 0.145, line thickness t = 0.0175, dielectric constant ε_r = 4.3, and characteristic impedance Zdiff = 100.186Ω. When high-speed video differential signal interface board was tested with optimized parameters, the magnitude of Eye diagram output was 672mV, jittering was 6.593ps, transmission frequency was 1.322GHz, signal to noise was 29.62dB showing transmission quality improvement of 10dB compared to previous system.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.2
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• pp.55-60
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• 2002

The recent trend in electronic devices has been towards light weight, low cost, high performance and improved reliability. Passive components are very important parts of microelectronic devices. The number of passive components used in hand held devices and computers continue to increase. To achieve improvements in costs, component density, performance, and reliability, embedding of these passive components into the printed circuit boards (PCBs) is required. This paper introduces the embedding of passive components, and discusses the remained challenges in the commercialization of this technique.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.87-88
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• 2007

• Transactions of the Korean Society of Mechanical Engineers A
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• v.41 no.5
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• pp.421-426
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• 2017

In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.