• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.151-152
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• 2012

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.253-254
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• 2011

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.101-101
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• 2011

최근 반도체 및 디스플레이 사업의 급속한 발전으로 인해 반도체 공정은 초미세선폭화, 대면적화 되면서 오염입자를 제어하는 것이 이슈가 되고 있다. 반도체 및 디스플레이의 제조공정 중 챔버 내 진공부품은 진공상태에서 플라즈마에 의해 물리적인 데미지와 화학적으로 매우 활성이 높은 라디칼(Radical)반응에 의한 부식이 진행된다. 이러한 공정영향에 의해 챔버 내 부품들은 부식이 되고 공정 중에 오염입자가 발생하게 되어 반도체 및 디스플레이의 수율저하에 큰 영향을 미치고 부품교체 비용 또한 많이 들고 있다. 본 연구에서는 진공부품의 내전압측정방법을 이용하여 진공부품의 피막특성을 평가하는 연구방법으로서 내전압 지그(Zig)를 표준화하여 제작하였고, 재현성있는 데이터로 피막특성을 정량적으로 측정하는 방법을 연구 하였다. 식각공정 중에 발생하는 부식특성에 관해서는 화학부식와 플라즈마부식 열충격 등 각각 독립적으로 부식환경에 노출시켰으며, 진공부품의 손상 전 후의 내전압 특성변화를 이용하였다. 또한, CCP (Capacitativly Coupled Plasma)형의 RF magnetic sputter을 설계 제작하였고 진공부품에 고밀도 플라즈마를 발생시켜 플라즈마데미지에 의해 발생한 오염입자를 실시간으로 monitoring하여, 정량적으로 측정된 내전압특성결과를 비교 검증하였다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.72-77
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• 2016

Airplane reservoirs made of Al7075 are coated with an anodizing layer to maintain precision, air tightness and corrosion resistance. It is commonly required that the inner surface roughness of the reservoir be less than an average $0.2{\mu}m$ to maintain stable oil pressure. Even though precision polishing is necessary to achieve this quality it is not easy. Inner surface roughness is not uniform and the quality of the product is irregular because most of the work is done by hand. The purpose of this study is to design an exclusive polishing machine and to determine the standard cutting condition and polishing condition necessary for good inner surface roughness and to improve workefficiency.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.12
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• pp.993-998
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• 2016

In today's manufacturing industries, the demand for light non-ferrous materials is considerable due to the need to improve productivity and manufacturability. Since the surface roughness of a material is important for improving the functionality of machined parts, various techniques for surface treatments have been developed to obtain non-ferrous materials with low roughness. A superfinishing method utilizing polishing films is generally applied to the anodized surface of Al7075 in order to improve its roughness. The objective of this research is to determine through experiment the parameters that facilitate the shortest processing time, using a superfinishing method, for reaching a roughness of Ra $0.2{\mu}m$. This objective is met by applying the Taguchi method in the experiments. Through the experiments of superfinishing, the effectiveness of the parameters adopted for the surface treatment is demonstrated.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.7
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• pp.14-21
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• 2019

Large-diameter hydraulic devices such as the hydraulic reservoir in aircraft that serves to balance the hydraulic pressure in the various hydraulic devices in the cabin and to store hydraulic oil are operated by the internal piston systems. However, since this operates in an environment with high temperature and humidity, it may cause the inner surface to flake during its operation. Therefore, an anodizing surface treatment is applied to improve the corrosion resistance, abrasion resistance, and smooth operation. However, anodizing increases the surface roughness. Accordingly, the polishing process that improves the surface roughness after anodizing is important. However, the existing polishing process is performed manually, which results in an inefficient process. Therefore, in this study, we selected the optimum polishing conditions for effective polishing using the experimental design to improve the polishing process for the $Al_2O_3$ film that forms after anodization. Through experiments, we confirmed that the surface uniformity after polishing was superior as the feed rate was slower when the same polishing time had been applied.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1902-1904
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• 2001

본 논문은 마이크로머시닝 기술을 응용하여 다공질 실리콘 다이어프램을 제작하여 air, $N_2$, Ar 분위기에서 유리로 패키징하였다. 유리로 패키징된 소자들과 유리 패키징을 하지 않는 소자를 시간 경과에 따른 다공질 실리콘의 PL(Photoluminescence) 스펙트럼 (peak wavelength, intensity)과 저항 변화를 측정하였다. 또한, 패키징 분위기에 따른 다공질 실리콘의 aging 효과를 서로 비교하여 다공질 실리콘 다이어프램을 이용한 PIN 구조의 소자를 광센서로써 응용 가능성을 살펴보았다.

• Journal of the Korean Society for information Management
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• v.33 no.1
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• pp.225-245
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• 2016

The purpose of this study is to enhance the efficiency of library space usage through analyzing users' behavior in an academic library. Diary methodology was applied for collecting users' activities in the library. 108 students participated in this study, but 84 students submitted their diaries. Among them, 14 participants were interviewed to identify barriers and their needs in using the library. The findings suggest rearranging IT devices to increase use rate of those devices, making plans for reusing the space where it is rarely used, and improving the accessibility of information through browsing in the bookstack area. Additionally, time analysis of users' activities was used to analyze students' behavior in the library.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.8
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• pp.3301-3306
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. Conventional pick-up device of the die bonder is simply operated by up and down motion of a collet and an ejector pin. However, this method may cause undesired problems such as position misalignment and/or severe die damage when the pick-up device reaches the die. In this study, to minimize the position alignment error and die damage, a die bonder is developed by adopting a new pick-up head for precise alignment and high speed feeding. To evaluate structural stability of the designed system, required finite element model of the die bonder is generated, and structural analysis is performed. Vibration analysis of the pick-up head is also performed using developed finite element model at operation frequency range. As a result of the analysis, deformation, stress, and natural frequency of the die bonder are investigated.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.10
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• pp.4378-4384
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• 2012

In LED chip packaging, die bonding is a very important process which fixes the LED chip on the lead frame to provide enough strength for the next process. This paper focuses on the process optimization of a LED die bonding, which attaches small zener diode chip on PLCC LED package frame, using response surface analysis. Design of experiment (DOE) of 5 factors, 3 levels and 5 responses are considered, and the results are investigated. As the results, optimal conditions those satisfy all response objects can be derived.